LAV-AT-E70-2LFG676I

The LAV-AT-E70-2LFG676I is an Avant™-E platform FPGA from Lattice Semiconductor. It provides a high-density programmable fabric with extensive embedded memory, a broad I/O count, and platform-level features described in the Avant overview, including programmable functional units (PFU), sysMEM and sysDSP resources, programmable I/O, SerDes/PMA and DDRPHY support.

Targeted for industrial applications, this device combines large logic capacity and on-chip memory with a compact 676‑FCBGA package and an extended operating temperature range to support demanding embedded system designs.

Key Features

• Logic Capacity — Provides 477,000 logic elements for complex programmable logic and system integration.
• Embedded Memory — Approximately 4.24 Mbits (4,239,360 bits) of on-chip RAM to support large buffers, FIFOs and local data storage.
• I/O Density — 312 I/O pins to support multiple interfaces, peripherals and high-pin-count board designs.
• Avant Platform Architecture — Architecture topics in the Avant overview include PFU blocks, routing, clocking structures, sysMEM, sysDSP, programmable I/O cells, and security engine capabilities.
• High-speed Interfaces — Datasheet content lists SerDes/PMA blocks, multi-protocol PCS/PHY integration and DDR memory support (DDRPHY), enabling serial links and external memory interfaces.
• Package and Mounting — 676‑FCBGA package (27×27) in a surface-mount form factor for high-density board integration.
• Power — Operates from a supply of 820 mV (single supply value specified in product data).
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial environments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Use for custom control logic, sensor aggregation and real-time processing where extended temperature range and high logic density are required.
• Networking and Connectivity — Suitable for implementing serial link PHY/PCS functions and multi-protocol SerDes interfaces as outlined in the Avant platform documentation.
• Memory Interface and Buffering — On-chip sysMEM and DDRPHY support enable local buffering and external DDR memory interfacing for data-path acceleration.
• Embedded Signal Processing — sysDSP and programmable functional units support custom DSP pipelines and data-path processing within a single device.

Unique Advantages

• High logic integration: 477,000 logic elements enable consolidation of multiple functions into one FPGA, reducing system BOM and board area.
• Substantial on-chip memory: Approximately 4.24 Mbits of embedded RAM supports large FIFOs, look-up tables and buffer storage without external memory.
• Broad I/O support: 312 I/Os accommodate diverse peripherals and high-pin-count interfaces for flexible system I/O mapping.
• Platform-level features: Avant platform architecture includes PFU, sysMEM, sysDSP, SerDes/PMA and DDRPHY building blocks for system-centric designs.
• Industrial robustness: Rated from −40 °C to 100 °C and RoHS compliant for deployment in industrial environments.
• Compact high-density package: 676‑FCBGA (27×27) delivers high pin-count in a compact surface-mount footprint for space-constrained applications.

Why Choose LAV-AT-E70-2LFG676I?

The LAV-AT-E70-2LFG676I positions itself as a high-capacity Avant™-E FPGA option for designs that require large logic resources, significant on-chip memory and extensive I/O in a compact industrial-grade package. Its platform-level architecture elements—documented in the Avant overview—provide the building blocks for serial interfaces, memory subsystems and DSP functions within a single device.

This combination of logic density, embedded RAM and platform features makes the device suitable for engineering teams building advanced industrial, connectivity and embedded processing solutions that benefit from integration, scalability and extended operating temperature capability.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the LAV-AT-E70-2LFG676I.