LAV-AT-E70-3CBG484I

The LAV-AT-E70-3CBG484I is an Avant™-E Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor’s Avant platform. This device provides a high-density logic fabric with 637,000 logic elements, approximately 4.24 Mbits of embedded memory, and 349 general-purpose I/O pins in a 484‑lead FCCSP/BGA package.

Designed for industrial-grade embedded applications, the Avant‑E platform documented in the datasheet includes programmable logic, on-chip memory, DSP resources, flexible clocking, DDR PHY support and SERDES/PCS building blocks to address compute, I/O aggregation and memory interface requirements in compact, surface-mount designs.

Key Features

• High logic capacity  637,000 logic elements provide significant programmable logic resources for complex designs and custom hardware acceleration.
• Embedded memory  Approximately 4.24 Mbits of total RAM bits for buffering, FIFOs and local data storage across the fabric.
• High I/O density  349 general-purpose I/O pins support extensive peripheral and board-level interfacing in I/O‑heavy applications.
• Avant platform architecture  Platform-level features described in the datasheet include programmable functional unit (PFU) blocks, slices, routing resources and sysDSP building blocks to support arithmetic and signal-processing tasks.
• Clocking and timing  On-chip oscillator, PLLs, global and regional clock structures, dynamic clock control and clock synchronizers provide flexible timing and clock distribution options.
• Memory and DDR support  sysMEM architecture, memory cascading, FIFO modes and DDRPHY support with DQS grouping are detailed in the platform overview for memory interface designs.
• High-speed connectivity  SERDES and PCS blocks are included at the platform level to enable multi-protocol serial interfaces and protocol conversion functions.
• Package and mounting  484-FCCSP (19×19) / 484‑BGA package, surface-mountable for compact board designs.
• Industrial temperature range  Rated for operation from −40 °C to 100 °C for deployments in industrial environments.
• Supply voltage  Core supply listed as 820 mV (0.82 V) per product data.
• RoHS compliant  Meets RoHS requirements for lead-free assembly and regulatory considerations.

Typical Applications

• Industrial control and automation  Use the device’s industrial temperature range and high I/O count for sensor aggregation, motor control logic and factory-automation interfaces.
• Memory interface and buffering  Leverage sysMEM features and DDRPHY support for board-level memory controllers, data buffering and high-throughput data paths.
• Protocol bridging and high-speed I/O  SERDES/PCS and abundant I/O enable protocol translation, multi-protocol bridging and aggregation of high-speed serial links.
• Embedded signal processing  sysDSP resources and large logic capacity make the device suitable for onboard signal processing, filtering and custom compute acceleration.

Unique Advantages

• Substantial programmable resources  637,000 logic elements reduce the need for multiple devices by consolidating logic, control and processing into a single FPGA.
• Integrated memory capacity  Approximately 4.24 Mbits of embedded memory supports local buffering and reduces external memory dependency for many functions.
• Large I/O footprint  349 I/O pins allow direct interfacing to a wide variety of sensors, peripherals and board-level components without excessive multiplexing.
• Platform-level feature set  Clocking, PLLs, on-chip oscillator, sysDSP, sysMEM, DDRPHY and SERDES/PCS capabilities described in the Avant platform datasheet provide a comprehensive foundation for system designs.
• Industrial readiness  Rated operation from −40 °C to 100 °C suits deployment in industrial environments where extended temperature ranges are required.
• Compact, surface-mount package  484-FCCSP (19×19) packaging balances high I/O and logic density with a small board footprint for space-constrained designs.

Why Choose LAV-AT-E70-3CBG484I?

The LAV-AT-E70-3CBG484I positions itself as a high-capacity Avant‑E FPGA option that combines a large logic fabric, meaningful embedded memory and abundant I/O in a compact 484‑lead FCCSP/BGA package. Platform-level features called out in the datasheet—flexible clocking, DSP and memory structures, DDRPHY and SERDES/PCS—provide the building blocks necessary for complex embedded systems.

This device is suited to engineering teams designing industrial and embedded systems that require integrated logic, on-chip memory and robust interfacing options. Its combination of resources, industrial temperature rating and surface-mount packaging supports scalable designs with a clear upgrade path within the Avant platform.

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