LAV-AT-E70-2LFG1156I

The LAV-AT-E70-2LFG1156I is an Avant™-E field programmable gate array (FPGA) IC from Lattice Semiconductor’s Avant platform. Built around a programmable functional-unit architecture described in the Avant platform datasheet, the device provides substantial logic capacity, embedded memory, and a broad set of on-chip resources for complex programmable designs.

With 637,000 logic elements, approximately 4.24 Mbits of embedded memory and 553 I/Os in a 1156-FCBGA (35×35) package, this industrial-grade FPGA is targeted at designs that require high logic density, significant memory resources and large I/O counts while operating across an extended temperature range.

Key Features

• Logic Capacity — 637,000 logic elements for large-scale programmable logic implementations and complex design partitioning.
• Embedded Memory — Approximately 4.24 Mbits of on-chip RAM (4,239,360 bits) to support data buffering, FIFOs, and memory-intensive functions.
• I/O and Package — 553 programmable I/Os in a 1156-FCBGA (35×35) package; surface-mount 1156-BBGA/FCBGA package case for compact board integration.
• Clocking and Timing — On-chip oscillator, PLL, global and regional clock domains, edge clocks, dynamic clock select/control and DLL delay options as described in the Avant platform architecture.
• Memory Subsystem (sysMEM) — Platform memory features including single/dual/pseudo-dual port modes, FIFO modes, memory cascading and RAM initialization/ROM operation capabilities.
• Signal Processing (sysDSP) — Dedicated DSP resources indicated by the Avant platform overview for arithmetic and signal processing workloads.
• Programmable I/O and PHY — Programmable I/O cell architecture, multiple sysI/O standards, banking scheme and DDR memory support including DDRPHY and DQS grouping.
• SERDES and PHY — SERDES/PMA block and multi‑protocol PCS/PHY support detailed for high-speed serial interface integration.
• Device Configuration & Reliability — Enhanced configuration options, JTAG support, and single-event upset (SEU) handling described in the platform documentation.
• Electrical & Environmental — Supply voltage specified at 820 mV (as listed) and industrial operating temperature range from −40 °C to 100 °C; RoHS compliant.

Typical Applications

• Industrial Control and Automation — Use in control logic, protocol conversion and I/O aggregation where industrial temperature operation and large I/O counts are required.
• High-Density I/O Systems — Suitable for designs that need many GPIOs and complex routing, leveraging 553 available I/Os to consolidate board-level interfaces.
• Memory-Intensive Designs — Systems requiring on-chip buffering, FIFOs or memory cascades can take advantage of approximately 4.24 Mbits of embedded RAM and the sysMEM features.
• Signal Processing and Data Path Acceleration — Applications leveraging the platform’s sysDSP resources and rich clocking infrastructure for deterministic processing pipelines.

Unique Advantages

• High Logic and Memory Density: 637,000 logic elements combined with approximately 4.24 Mbits of embedded memory support large, integration-heavy designs without immediate external logic expansion.
• Extensive I/O Count: 553 I/Os reduce the need for external I/O expanders and simplify multi-interface board designs.
• Comprehensive Clock and Timing Resources: On-chip oscillator, PLLs, regional/global/edge clocks and dynamic clock controls enable flexible timing domains and clock management.
• Integrated High-Speed and Memory Interfaces: SERDES/PMA blocks, multi-protocol PCS/PHY and DDRPHY support facilitate implementation of high-speed serial links and external memory interfaces.
• Industrial Temperature Capability: Rated for −40 °C to 100 °C operation to meet environmental tolerance needs for industrial applications.
• Compact Surface-Mount Packaging: 1156-FCBGA (35×35) package provides a high-pin-count solution in a compact footprint for space-constrained boards.

Why Choose LAV-AT-E70-2LFG1156I?

The LAV-AT-E70-2LFG1156I positions itself for designs that require substantial programmable logic, embedded memory and a very high I/O count delivered in an industrial-temperature, surface-mount FCBGA package. As part of the Lattice Avant platform, the device integrates architecture-level features—clocking, routing, sysMEM and sysDSP—described in the Avant platform documentation to address demanding programmable logic requirements.

This device is suitable for engineering teams building complex embedded systems that benefit from integrated memory, robust clocking, DDR and SERDES support, and a high pin-count package. Its industrial rating and RoHS compliance support deployments in regulated manufacturing and industrial environments where extended temperature range is required.

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