LAV-AT-E70-2LFG676C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 297 4239360 637000 676-BBGA, FCBGA

Quantity 203 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O297Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-E70-2LFG676C – Avant™-E Field Programmable Gate Array (FPGA), 676-FCBGA, 297 I/O

The LAV-AT-E70-2LFG676C is an Avant™-E platform FPGA IC from Lattice Semiconductor Corporation designed for high-density programmable logic integration. It combines a large logic fabric with dedicated memory and DSP resources, flexible clocking primitives, and a rich I/O complement to support complex embedded designs.

This commercial-grade device is optimized for applications that require significant on-chip logic and memory, abundant I/O, and advanced timing and interface features while operating within a 0 °C to 85 °C ambient range.

Key Features

  • Logic Capacity — Provides 637,000 logic elements for implementing sizable programmable logic designs and complex control functions.
  • Embedded Memory — Approximately 4.24 Mbits of on-chip RAM (4,239,360 bits) organized for sysMEM use, supporting single, dual and pseudo-dual port modes, FIFO modes and memory cascading.
  • I/O Resources — 297 programmable I/O pins with a sysI/O banking scheme and programmable I/O cell (PIC) features to support multiple I/O standards and flexible signal conditioning.
  • Clocking and Timing — Integrated clock infrastructure including on-chip oscillator, PLL, global and regional clocks, edge clocks and dynamic clock control for robust timing management.
  • DSP and Compute Blocks — sysDSP resources for arithmetic and signal-processing workloads (documented in the Avant platform overview).
  • Memory and DDR Support — sysMEM and DDRPHY support for DDR memory interfaces with DQS grouping for reliable DDR operation.
  • High‑Speed Interfaces — Architecture-level support for SERDES and PCS blocks and multi-protocol PHY integration as described in the Avant platform documentation.
  • Configuration and Reliability — Enhanced configuration options, JTAG support, Single Event Upset (SEU) handling, and trace identification features described in the platform datasheet.
  • Package and Mounting — 676-FCBGA package (27×27 mm) in a surface-mount form factor for dense board-level integration.
  • Power and Temperature — Core supply reported at 820 mV; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Embedded Systems — Implement control logic, custom peripherals, and system glue logic where high logic density and on-chip RAM simplify board-level design.
  • Connectivity and Communications — Use programmable I/O, SERDES/PCS and PHY support to build protocol bridges, packet processing, and interface controllers.
  • Memory Interface and Controllers — Leverage sysMEM and DDRPHY capabilities to implement memory controllers, FIFOs and buffering for storage or buffering subsystems.
  • Signal Processing and Acceleration — Employ sysDSP blocks and abundant logic elements for arithmetic-intensive tasks and hardware acceleration functions.

Unique Advantages

  • High Logic Density: 637,000 logic elements enable implementation of large-scale logic functions without external ASICs or multiple devices.
  • Substantial Embedded Memory: Approximately 4.24 Mbits of on-chip RAM supports complex state machines, buffering and embedded data storage.
  • Extensive I/O Count: 297 I/O pins provide flexibility for multi-board interfaces, wide parallel buses or mixed-signal I/O arrangements.
  • Comprehensive Clocking: On-chip oscillator, PLL and multiple clock domains (global, regional, edge) allow precise timing architectures and clock-domain management.
  • Platform-Level Interface Support: Documented support for DDRPHY, SERDES/PMA and multi-protocol PHY integration eases implementation of high-speed interfaces.
  • Compact, Surface-Mount Package: 676-FCBGA (27×27) package enables high-density PCB layouts while retaining a large logic and I/O complement.

Why Choose LAV-AT-E70-2LFG676C?

The LAV-AT-E70-2LFG676C positions itself as a high-capacity, platform-backed FPGA solution suitable for designers who need substantial on-chip logic, embedded memory and broad I/O in a single surface-mount package. Its Avant™-E platform features—clocking primitives, sysMEM, sysDSP, DDRPHY and SERDES/PMA support—provide an integrated foundation for complex embedded and interface-focused designs.

Engineers and procurement teams seeking a commercially graded, RoHS-compliant FPGA with precise operating-temperature bounds and a defined core supply level will find this device appropriate for scalable designs where integration, timing flexibility and memory resources drive system architecture choices.

Request a quote or submit a quote to obtain pricing and availability for the LAV-AT-E70-2LFG676C. Our team can provide lead-time information and support to help you evaluate this Avant™-E FPGA for your next design.

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