LAV-AT-E70-2LFG676C
| Part Description |
Avant™-E Field Programmable Gate Array (FPGA) IC 297 4239360 637000 676-BBGA, FCBGA |
|---|---|
| Quantity | 203 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 297 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 637000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4239360 |
Overview of LAV-AT-E70-2LFG676C – Avant™-E Field Programmable Gate Array (FPGA), 676-FCBGA, 297 I/O
The LAV-AT-E70-2LFG676C is an Avant™-E platform FPGA IC from Lattice Semiconductor Corporation designed for high-density programmable logic integration. It combines a large logic fabric with dedicated memory and DSP resources, flexible clocking primitives, and a rich I/O complement to support complex embedded designs.
This commercial-grade device is optimized for applications that require significant on-chip logic and memory, abundant I/O, and advanced timing and interface features while operating within a 0 °C to 85 °C ambient range.
Key Features
- Logic Capacity — Provides 637,000 logic elements for implementing sizable programmable logic designs and complex control functions.
- Embedded Memory — Approximately 4.24 Mbits of on-chip RAM (4,239,360 bits) organized for sysMEM use, supporting single, dual and pseudo-dual port modes, FIFO modes and memory cascading.
- I/O Resources — 297 programmable I/O pins with a sysI/O banking scheme and programmable I/O cell (PIC) features to support multiple I/O standards and flexible signal conditioning.
- Clocking and Timing — Integrated clock infrastructure including on-chip oscillator, PLL, global and regional clocks, edge clocks and dynamic clock control for robust timing management.
- DSP and Compute Blocks — sysDSP resources for arithmetic and signal-processing workloads (documented in the Avant platform overview).
- Memory and DDR Support — sysMEM and DDRPHY support for DDR memory interfaces with DQS grouping for reliable DDR operation.
- High‑Speed Interfaces — Architecture-level support for SERDES and PCS blocks and multi-protocol PHY integration as described in the Avant platform documentation.
- Configuration and Reliability — Enhanced configuration options, JTAG support, Single Event Upset (SEU) handling, and trace identification features described in the platform datasheet.
- Package and Mounting — 676-FCBGA package (27×27 mm) in a surface-mount form factor for dense board-level integration.
- Power and Temperature — Core supply reported at 820 mV; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Embedded Systems — Implement control logic, custom peripherals, and system glue logic where high logic density and on-chip RAM simplify board-level design.
- Connectivity and Communications — Use programmable I/O, SERDES/PCS and PHY support to build protocol bridges, packet processing, and interface controllers.
- Memory Interface and Controllers — Leverage sysMEM and DDRPHY capabilities to implement memory controllers, FIFOs and buffering for storage or buffering subsystems.
- Signal Processing and Acceleration — Employ sysDSP blocks and abundant logic elements for arithmetic-intensive tasks and hardware acceleration functions.
Unique Advantages
- High Logic Density: 637,000 logic elements enable implementation of large-scale logic functions without external ASICs or multiple devices.
- Substantial Embedded Memory: Approximately 4.24 Mbits of on-chip RAM supports complex state machines, buffering and embedded data storage.
- Extensive I/O Count: 297 I/O pins provide flexibility for multi-board interfaces, wide parallel buses or mixed-signal I/O arrangements.
- Comprehensive Clocking: On-chip oscillator, PLL and multiple clock domains (global, regional, edge) allow precise timing architectures and clock-domain management.
- Platform-Level Interface Support: Documented support for DDRPHY, SERDES/PMA and multi-protocol PHY integration eases implementation of high-speed interfaces.
- Compact, Surface-Mount Package: 676-FCBGA (27×27) package enables high-density PCB layouts while retaining a large logic and I/O complement.
Why Choose LAV-AT-E70-2LFG676C?
The LAV-AT-E70-2LFG676C positions itself as a high-capacity, platform-backed FPGA solution suitable for designers who need substantial on-chip logic, embedded memory and broad I/O in a single surface-mount package. Its Avant™-E platform features—clocking primitives, sysMEM, sysDSP, DDRPHY and SERDES/PMA support—provide an integrated foundation for complex embedded and interface-focused designs.
Engineers and procurement teams seeking a commercially graded, RoHS-compliant FPGA with precise operating-temperature bounds and a defined core supply level will find this device appropriate for scalable designs where integration, timing flexibility and memory resources drive system architecture choices.
Request a quote or submit a quote to obtain pricing and availability for the LAV-AT-E70-2LFG676C. Our team can provide lead-time information and support to help you evaluate this Avant™-E FPGA for your next design.

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