LAV-AT-E70-3LFG1156C

The LAV-AT-E70-3LFG1156C is an Avant-E platform Field Programmable Gate Array (FPGA) offered by Lattice Semiconductor. It provides a high-density programmable fabric with 477,000 logic elements and substantial embedded memory for complex digital designs.

Designed for commercial-temperature applications, this device combines a large I/O count (572 pins) with an FPBGA 1156 package (1156‑FPBGA, 35×35) and low-voltage operation (820 mV supply). On-chip resources and platform-level features make it suitable for designs requiring dense logic, sizable embedded memory, and extensive I/O connectivity.

Key Features

• Programmable Logic Capacity  477,000 logic elements enable large-scale, customizable logic implementations for system-level integration.
• Embedded Memory  Approximately 4.24 Mbits of total RAM bits for on-chip buffering, tables, and state storage.
• High I/O Count  572 I/O pins accommodate extensive peripheral, sensor, and bus interfacing directly to the device.
• Package and Mounting  1156‑BBGA (supplier device package: 1156‑FPBGA, 35×35) in a surface-mount form factor for board-level integration.
• Supply Voltage  Single reported supply point at 820 mV to 820 mV as specified for device operation.
• Operating Temperature  Commercial grade operation from 0 °C to 85 °C.
• Platform-Level Capabilities (Avant)  Datasheet sections indicate platform features including DDR memory support, SerDes/PCS and PCIe IP, device configuration options, and a security engine for system designs.
• RoHS Compliant  Device is RoHS status compliant.

Typical Applications

• High-speed connectivity and interface bridging  Leverage the Avant platform’s SerDes/PCS and PCIe capability areas for implementing high-bandwidth links and protocol bridging.
• Memory interface controllers  Use built-in DDR memory support for creating on-board memory controllers and buffering subsystems.
• Custom compute and acceleration  Large logic element count and embedded RAM make this device suitable for bespoke datapath accelerators and signal processing blocks.
• System I/O consolidation  High I/O count supports aggregation of multiple peripherals, sensors, and interfaces in a single device.

Unique Advantages

• High-density programmable fabric: 477,000 logic elements enable complex designs and high integration levels, reducing the need for multiple discrete devices.
• Substantial on-chip memory: Approximately 4.24 Mbits of embedded RAM supports local buffering and state storage without external memory for many functions.
• Extensive I/O capacity: 572 I/Os allow designers to connect a wide range of peripherals and interfaces directly to the FPGA.
• Compact BGA packaging: The 1156‑FPBGA (35×35) package delivers a high pin count in a surface-mount footprint suitable for dense board layouts.
• Platform feature set: Avant platform capabilities documented in the datasheet (DDR support, SerDes/PCS, PCIe, configuration and security blocks) enable a broad set of interface and system-level functions.
• Commercial-temperature rating: 0 °C to 85 °C operation fits a wide range of commercial electronic products and development workflows.

Why Choose LAV-AT-E70-3LFG1156C?

The LAV-AT-E70-3LFG1156C positions itself as a high-density, high-I/O FPGA solution within the Lattice Avant platform. Its combination of 477,000 logic elements, approximately 4.24 Mbits of embedded RAM, and 572 I/Os offers designers the resources to consolidate functionality, implement complex datapaths, and support extensive peripheral interfacing in a single device.

This device is suitable for commercial-temperature system designs that require substantial programmable logic, significant on-chip memory, and broad I/O capability in a compact 1156‑BBGA package. Documentation on Avant platform features provides a foundation for implementing DDR memory interfaces, SerDes/PCIe connectivity, and configuration/security functions as part of system-level designs.

Request a quote or submit an inquiry to obtain pricing and availability information for the LAV-AT-E70-3LFG1156C.