LAV-AT-E70-3CSG841I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 502 4239360 637000 841-BGA, FCCSPBGA

Quantity 1,423 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package841-FCCSP (15x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case841-BGA, FCCSPBGANumber of I/O502Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-E70-3CSG841I – Avant™-E FPGA IC, 841-BGA (Industrial)

The LAV-AT-E70-3CSG841I is an Avant™-E Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation’s Avant platform. This industrial-grade device integrates a substantial programmable fabric with on-chip memory and extensive I/O to support complex, configurable logic and high-speed system interfaces.

Built on the Avant architecture, the device includes programmable functional units, memory and DSP blocks, advanced clocking and configuration options, and support for high‑speed serial and DDR memory interfaces—enabling use in applications that require dense logic, substantial embedded memory, and a broad physical I/O complement.

Key Features

  • Logic Capacity  Provides 637,000 logic elements for implementing large-scale custom logic and control functions.
  • Embedded Memory  Approximately 4.24 Mbits of on-chip RAM (4,239,360 total RAM bits) for frame buffers, FIFOs, and local data storage.
  • Extensive I/O  Up to 502 programmable I/O pins to interface with a wide range of peripherals and system components.
  • Clocking and Timing  Avant platform clocking features include on‑chip oscillator, PLL, global and regional clocks, dynamic clock select and control, and DLL delay options for flexible timing architectures.
  • Memory and DSP Blocks  Integrated sysMEM and sysDSP resources as described in the Avant platform overview to support memory-centric designs and DSP acceleration.
  • High‑Speed Interfaces  Platform-level support for SERDES, Multi‑Protocol PCS, and Multi‑Protocol PHY integration addresses high-speed serial link and protocol requirements.
  • DDR Memory Support  DDRPHY and DQS grouping functionality are included in the platform overview to enable external DDR memory interfaces.
  • Configuration and Reliability  Enhanced configuration options, JTAG support, and Single Event Upset (SEU) handling are described in the platform documentation for configuration and resilience strategies.
  • Package and Mounting  841‑BGA, FCCSPBGA package (supplier package: 841‑FCCSP, 15 × 13) for surface-mount PCB assembly.
  • Operating Conditions  Supply voltage specified at 820 mV; operating temperature range −40 °C to 100 °C for industrial environments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High‑speed connectivity and protocol bridging  SERDES and Multi‑Protocol PCS/PMA functionality enable implementation of serial link interfaces and protocol conversion logic.
  • Memory interface controllers  DDRPHY and sysMEM capabilities support DDR memory controllers, buffering, and memory-mapped interfaces.
  • Signal processing and compute acceleration  sysDSP blocks and large logic capacity allow deployment of custom DSP pipelines and hardware accelerators.
  • Industrial control and automation  Industrial grade temperature range and extensive I/O make the device suitable for industrial control, sensor aggregation, and automation logic.

Unique Advantages

  • High logic density: 637,000 logic elements enable complex finite state machines, datapaths, and custom processors within a single device.
  • Substantial on‑chip memory: Approximately 4.24 Mbits of embedded RAM reduces external memory dependence and supports large buffering and local data storage.
  • Broad I/O capability: 502 I/O pins provide flexibility for multi‑lane interfaces, parallel buses, and mixed-signal front ends.
  • Platform-level interface support: DDR, SERDES, and multi‑protocol PHY/PCS blocks described in the Avant platform simplify integration of high-speed and memory interfaces.
  • Industrial operating range: −40 °C to 100 °C operation supports deployment in demanding environments.
  • Compact surface-mount package: 841‑FCCSP (15 × 13) BGA delivers a high pin‑count solution in a space-efficient footprint.

Why Choose LAV-AT-E70-3CSG841I?

The LAV-AT-E70-3CSG841I delivers a combination of high logic capacity, substantial embedded memory, and a wide I/O complement within the Avant™ platform architecture. Its platform-level features—clocking, configurable memory and DSP resources, DDR support, and high‑speed serial interface blocks—provide a flexible foundation for complex, performance-oriented designs in industrial applications.

This device is suitable for development teams and product designs that require dense programmable logic, on‑chip memory for frame buffering or FIFOs, extensive I/O for multi‑lane interfaces, and industrial temperature operation. As part of the Avant platform, it aligns with platform architecture elements for configuration, timing, and high‑speed interface integration.

Request a quote or submit an inquiry to obtain pricing and availability for the LAV-AT-E70-3CSG841I. Our team can provide ordering details and support for your design requirements.

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