LAV-AT-E70-2CBG484C
| Part Description |
Avant™-E Field Programmable Gate Array (FPGA) IC 349 4239360 637000 484-BGA, FCCSPBGA |
|---|---|
| Quantity | 945 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCCSP (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA, FCCSPBGA | Number of I/O | 349 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 637000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4239360 |
Overview of LAV-AT-E70-2CBG484C – Avant™-E Field Programmable Gate Array (FPGA) IC, 637,000 logic elements
The LAV-AT-E70-2CBG484C is a commercial-grade Avant™-E FPGA from Lattice Semiconductor Corporation optimized for complex programmable logic and system integration. Built on the Avant architecture, it provides a high-density fabric of programmable functional units alongside dedicated memory, DSP, I/O and SerDes/PHY capabilities to support data‑centric and control applications.
Typical use cases include high‑bandwidth interfacing, advanced signal processing, memory subsystem integration and flexible I/O aggregation where compact packaging and a comprehensive on‑chip feature set enable streamlined board designs.
Key Features
- Core Logic Approximately 637,000 logic elements provide a large programmable fabric for implementing complex logic, datapath and control functions.
- Embedded Memory Approximately 4.24 Mbits of on‑chip RAM (4,239,360 total RAM bits) with support for single, dual and pseudo‑dual port modes, FIFO modes, memory cascading, and RAM initialization/ROM operation as described in the Avant platform architecture.
- High I/O Count 349 user I/O pins, supported by a programmable I/O (PIO) banking scheme and programmable I/O cells (PIC) featuring dedicated input, output and tri‑state register blocks.
- Clocking and Timing Comprehensive clocking architecture including on‑chip oscillator, PLL, Global Clock (GCLK), Regional Clocks (RCLK), Edge Clock (ECLK), PHYCLK, clock synchronizers/dividers, dynamic clock select/control and DLL delay features for flexible timing domains.
- DSP and High‑Speed Interfaces Integrated sysDSP resources and support for SERDES/PCS and Multi‑Protocol PHY integration for high‑speed serial connectivity and protocol flexibility.
- DDR Memory Support DDR memory interface support with DDRPHY and DQS grouping features to integrate external DDR memory subsystems.
- Device Configuration & Reliability Enhanced configuration options including JTAG, SEU handling mechanisms and Trace ID features to support device configuration and system diagnostics.
- Power and Operating Range Core supply specified at 820 mV and commercial operating temperature range from 0 °C to 85 °C.
- Package & Mounting Surface‑mount 484‑BGA FCCSPBGA package (supplier device package 484‑FCCSP, 19 × 19) for compact board integration and dense routing.
- Compliance RoHS compliant.
Typical Applications
- High‑Speed Interface Aggregation Concentrate multiple serial and parallel interfaces using on‑chip SERDES/PHY and high I/O density for protocol bridging and data routing.
- Memory Subsystem Controllers Implement DDR controller logic and memory interfaces leveraging DDRPHY support and sysMEM features such as FIFO and memory cascading.
- Signal Processing and DSP Deploy sysDSP resources and large logic capacity for filtering, aggregation and real‑time data processing tasks.
- Flexible I/O and Timing Control Use extensive programmable I/O and the advanced clocking structure for mixed‑signal control, interface timing management and synchronization across domains.
Unique Advantages
- High logic density: 637,000 logic elements allow integration of large digital systems on a single device, reducing external components.
- Substantial embedded memory: Approximately 4.24 Mbits of RAM supports on‑chip buffering, FIFOs and complex memory architectures without immediate external RAM dependence.
- Comprehensive clocking: Multiple on‑chip clock resources (PLL, GCLK, RCLK, ECLK, PHYCLK, DLL delay and dynamic controls) provide robust timing flexibility for multi‑domain designs.
- Rich I/O and PHY support: 349 I/O with programmable cell features plus SERDES/PCS and DDRPHY integration enable broad interface options in a compact package.
- Compact packaging: 484‑BGA FCCSP package (19 × 19) facilitates high‑density board layouts while maintaining surface‑mount assembly compatibility.
- Commercial grade and RoHS compliant: Designed for commercial temperature operation (0 °C to 85 °C) with RoHS compliance for regulated manufacturing environments.
Why Choose LAV-AT-E70-2CBG484C?
The LAV-AT-E70-2CBG484C positions itself as a high‑capacity, feature‑rich FPGA option within the Avant platform, combining a large programmable fabric, significant on‑chip memory and extensive clocking and I/O resources. This makes it well suited to designs that require consolidated logic, memory buffering and versatile interface support in a single commercial‑grade device.
Engineers and procurement teams targeting compact, integrated solutions benefit from the device’s combination of logic density, DDR and SERDES/PHY support, and a package optimized for high‑density layouts. The Avant platform details around programmable functional units, sysMEM, sysDSP and programmable I/O provide a documented architecture for scalable design and system-level integration.
Request a quote or submit an RFQ for part number LAV-AT-E70-2CBG484C through your preferred distributor or procurement channel to begin sourcing and integration planning.