LAV-AT-E70-2CBG484C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 349 4239360 637000 484-BGA, FCCSPBGA

Quantity 945 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCCSP (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGA, FCCSPBGANumber of I/O349Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-E70-2CBG484C – Avant™-E Field Programmable Gate Array (FPGA) IC, 637,000 logic elements

The LAV-AT-E70-2CBG484C is a commercial-grade Avant™-E FPGA from Lattice Semiconductor Corporation optimized for complex programmable logic and system integration. Built on the Avant architecture, it provides a high-density fabric of programmable functional units alongside dedicated memory, DSP, I/O and SerDes/PHY capabilities to support data‑centric and control applications.

Typical use cases include high‑bandwidth interfacing, advanced signal processing, memory subsystem integration and flexible I/O aggregation where compact packaging and a comprehensive on‑chip feature set enable streamlined board designs.

Key Features

  • Core Logic Approximately 637,000 logic elements provide a large programmable fabric for implementing complex logic, datapath and control functions.
  • Embedded Memory Approximately 4.24 Mbits of on‑chip RAM (4,239,360 total RAM bits) with support for single, dual and pseudo‑dual port modes, FIFO modes, memory cascading, and RAM initialization/ROM operation as described in the Avant platform architecture.
  • High I/O Count 349 user I/O pins, supported by a programmable I/O (PIO) banking scheme and programmable I/O cells (PIC) featuring dedicated input, output and tri‑state register blocks.
  • Clocking and Timing Comprehensive clocking architecture including on‑chip oscillator, PLL, Global Clock (GCLK), Regional Clocks (RCLK), Edge Clock (ECLK), PHYCLK, clock synchronizers/dividers, dynamic clock select/control and DLL delay features for flexible timing domains.
  • DSP and High‑Speed Interfaces Integrated sysDSP resources and support for SERDES/PCS and Multi‑Protocol PHY integration for high‑speed serial connectivity and protocol flexibility.
  • DDR Memory Support DDR memory interface support with DDRPHY and DQS grouping features to integrate external DDR memory subsystems.
  • Device Configuration & Reliability Enhanced configuration options including JTAG, SEU handling mechanisms and Trace ID features to support device configuration and system diagnostics.
  • Power and Operating Range Core supply specified at 820 mV and commercial operating temperature range from 0 °C to 85 °C.
  • Package & Mounting Surface‑mount 484‑BGA FCCSPBGA package (supplier device package 484‑FCCSP, 19 × 19) for compact board integration and dense routing.
  • Compliance RoHS compliant.

Typical Applications

  • High‑Speed Interface Aggregation Concentrate multiple serial and parallel interfaces using on‑chip SERDES/PHY and high I/O density for protocol bridging and data routing.
  • Memory Subsystem Controllers Implement DDR controller logic and memory interfaces leveraging DDRPHY support and sysMEM features such as FIFO and memory cascading.
  • Signal Processing and DSP Deploy sysDSP resources and large logic capacity for filtering, aggregation and real‑time data processing tasks.
  • Flexible I/O and Timing Control Use extensive programmable I/O and the advanced clocking structure for mixed‑signal control, interface timing management and synchronization across domains.

Unique Advantages

  • High logic density: 637,000 logic elements allow integration of large digital systems on a single device, reducing external components.
  • Substantial embedded memory: Approximately 4.24 Mbits of RAM supports on‑chip buffering, FIFOs and complex memory architectures without immediate external RAM dependence.
  • Comprehensive clocking: Multiple on‑chip clock resources (PLL, GCLK, RCLK, ECLK, PHYCLK, DLL delay and dynamic controls) provide robust timing flexibility for multi‑domain designs.
  • Rich I/O and PHY support: 349 I/O with programmable cell features plus SERDES/PCS and DDRPHY integration enable broad interface options in a compact package.
  • Compact packaging: 484‑BGA FCCSP package (19 × 19) facilitates high‑density board layouts while maintaining surface‑mount assembly compatibility.
  • Commercial grade and RoHS compliant: Designed for commercial temperature operation (0 °C to 85 °C) with RoHS compliance for regulated manufacturing environments.

Why Choose LAV-AT-E70-2CBG484C?

The LAV-AT-E70-2CBG484C positions itself as a high‑capacity, feature‑rich FPGA option within the Avant platform, combining a large programmable fabric, significant on‑chip memory and extensive clocking and I/O resources. This makes it well suited to designs that require consolidated logic, memory buffering and versatile interface support in a single commercial‑grade device.

Engineers and procurement teams targeting compact, integrated solutions benefit from the device’s combination of logic density, DDR and SERDES/PHY support, and a package optimized for high‑density layouts. The Avant platform details around programmable functional units, sysMEM, sysDSP and programmable I/O provide a documented architecture for scalable design and system-level integration.

Request a quote or submit an RFQ for part number LAV-AT-E70-2CBG484C through your preferred distributor or procurement channel to begin sourcing and integration planning.

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