LAV-AT-E70-1LFG1156C

The LAV-AT-E70-1LFG1156C is an Avant™-E Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor built on the Lattice Avant platform. It delivers high logic density and extensive on‑chip memory in a 1156‑FBGA (35×35) package for compact, board‑level integration.

With 637,000 logic elements, approximately 4.24 Mbits of embedded memory, and 553 user I/O, this device targets designs that require significant programmable logic, substantial RAM capacity, and large I/O counts while operating from a single 820 mV supply across a commercial temperature range (0 °C to 85 °C).

Key Features

• High Logic Density — 637,000 logic elements support complex digital functions and large-scale programmable implementations.
• Embedded Memory — Total on‑chip RAM of 4,239,360 bits (approximately 4.24 Mbits) for memory‑intensive designs, including FIFO and dual/pseudo‑dual port modes as described in the Avant platform memory architecture.
• Extensive I/O — 553 user I/O pins to support dense peripheral and bus connectivity across multiple banks and standards handled by the platform’s sysI/O and Programmable I/O Cell (PIC) structures.
• Avant Platform Architecture — Architecture details in the Avant platform include Programmable Functional Unit (PFU) blocks, slices, flexible routing, and a multi‑layer clocking structure (on‑chip oscillator, PLL, global/regional/edge clocks) for sophisticated timing control.
• Clocking and Timing Features — Integrated clocking capabilities such as PLLs, global and regional clock networks, clock synchronizers, dynamic clock select/control, and DLL delay options to manage diverse timing requirements.
• DSP and SERDES Support — The Avant platform documentation describes sysDSP resources and SERDES/PMA blocks with Multi‑Protocol PCS and PHY integration to support high‑speed serial and signal processing functions.
• DDR Memory Support — Platform includes DDRPHY support and DQS grouping for external DDR memory interfaces as part of the device family architecture.
• Package and Mounting — 1156‑FBGA (1156‑FCBGA, 35×35) surface‑mount package for compact PCB implementations.
• Power and Environmental — Single specified supply voltage of 820 mV and commercial operating temperature range from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• High‑density digital systems — Implements large programmable logic functions where significant logic elements and on‑chip RAM are required.
• Memory‑intensive designs — Leverages approximately 4.24 Mbits of embedded memory for buffering, FIFOs, and multiport memory configurations described in the Avant platform.
• High‑I/O connectivity — Supports applications requiring many peripheral interfaces and dense I/O routing with 553 available I/O pins.
• High‑speed serial and DSP subsystems — Uses the platform’s SERDES, sysDSP, and multi‑protocol PHY/PCS building blocks for serial links and signal processing tasks.

Unique Advantages

• Massive programmable capacity: 637,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level BOM complexity.
• Substantial on‑chip memory: Approximately 4.24 Mbits of embedded RAM supports large buffers, FIFOs, and memory cascades without immediate dependence on external memory.
• Extensive I/O footprint: 553 user I/O pins simplify integration of numerous peripherals, buses, and external interfaces.
• Comprehensive clocking suite: On‑chip oscillator, PLLs, and hierarchical clock networks provide flexible timing and clock management as documented for the Avant platform.
• Integrated high‑speed and DSP building blocks: SERDES/PMA, Multi‑Protocol PCS/PHY integration, and sysDSP capabilities facilitate advanced communications and signal processing designs.
• Compact, manufacturable package: 1156‑FCBGA (35×35) surface‑mount package balances density and assembly considerations for volume production.

Why Choose LAV-AT-E70-1LFG1156C?

The LAV-AT-E70-1LFG1156C positions itself as a high‑density FPGA solution within the Lattice Avant platform, combining a large pool of logic elements, multi‑Mbit on‑chip RAM, and a high I/O count in a compact 1156‑FCBGA package. Its documented architecture elements—programmable functional units, flexible routing, clocking hierarchy, memory modes, DSP, and SERDES features—support sophisticated digital, memory, and high‑speed interface implementations.

This device is suited for engineers and teams developing complex programmable systems that require scalability, integrated memory resources, and extensive I/O while operating on a single 820 mV supply within the commercial temperature range. The Avant platform documentation provides architectural guidance for integrating these capabilities into production designs.

Request a quote or submit your requirements to receive pricing and availability information for the LAV-AT-E70-1LFG1156C. Our team can assist with lead times and quantity pricing to support your design and procurement timelines.