LAV-AT-E70-1CSG841I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 502 4239360 637000 841-BGA, FCCSPBGA

Quantity 46 Available (as of May 4, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package841-FCCSP (15x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case841-BGA, FCCSPBGANumber of I/O502Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-E70-1CSG841I – Avant™-E Field Programmable Gate Array (FPGA) IC, 841‑BGA (FCCSPBGA)

The LAV-AT-E70-1CSG841I is an Avant™-E FPGA device from Lattice Semiconductor Corporation designed for industrial-grade embedded designs. It delivers a high-density programmable fabric with 637,000 logic elements and advanced on-chip resources drawn from the Lattice Avant platform architecture.

With approximately 4.24 Mbits of embedded memory and 502 I/O pins in an 841‑ball FCCSPBGA package, this device targets systems requiring significant logic capacity, flexible I/O connectivity, and industrial operating range while supporting platform-level features such as on-chip clocking, memory and PHY building blocks described in the Avant platform overview.

Key Features

  • Core Logic — 637,000 logic elements provide substantial programmable fabric for custom logic, control, and acceleration functions.
  • Embedded Memory — Approximately 4.24 Mbits of on-chip RAM (4,239,360 bits) to implement FIFOs, buffers, and local storage.
  • I/O Density — 502 I/O pins to support complex interfaces and large connector/multi‑bank I/O requirements.
  • Package & Mounting — 841‑BGA FCCSPBGA package; supplier device package 841‑FCCSP (15 × 13); surface mount for high‑density board integration.
  • Industrial Grade & Temperature Range — Rated for industrial operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
  • Voltage Supply — Core supply noted as 820 mV (specified as 820 mV to 820 mV in device data).
  • Platform Capabilities — Architectural features called out in the Avant platform overview include programmable functional unit blocks, routing and clocking structures (on‑chip oscillator, PLL, global/regional/edge clocks), and programmable I/O cell capabilities.
  • Memory and DSP Support — Platform documentation describes sysMEM and sysDSP building blocks for versatile memory modes (single/dual/pseudo‑dual port, FIFO) and DSP functions.
  • High‑Speed Interfaces — Avant platform material lists DDR memory support with DDRPHY and SERDES/PCS blocks and multi‑protocol PHY integration for systems that require high‑speed serial and memory interfaces.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial Control & Automation — Industrial-rated temperature range and high I/O count enable motor control, PLC functions, and factory automation logic in harsh environments.
  • Memory Interface and Aggregation — On‑chip memory resources and platform DDR support are suited to designs that require local buffering, FIFO management, and memory interface logic.
  • High‑Speed Connectivity — Platform SERDES/PHY capabilities make the device applicable to systems needing protocol bridging, aggregation, or custom high‑speed links.
  • Hardware Acceleration — Large logic element count and sysDSP building blocks support workload offload and algorithm acceleration within embedded systems.

Unique Advantages

  • High Logic Density: 637,000 logic elements enable complex custom logic and multiple concurrent functions on a single device, reducing partitioning across multiple FPGAs.
  • Substantial On‑Chip Memory: Approximately 4.24 Mbits of embedded RAM supports deep buffering and local data storage, simplifying external memory requirements for many designs.
  • Extensive I/O Count: 502 I/Os provide flexibility for multi‑bank interfaces, sensor arrays, and broad connectivity without external multiplexing.
  • Industrial Reliability: Specified operation from −40 °C to 100 °C and surface‑mount 841‑ball FCCSPBGA packaging meet common industrial deployment needs.
  • Platform Feature Set: Architecture-level features in the Avant platform—clocking, programmable I/O cells, sysMEM, sysDSP, DDRPHY, and SERDES—offer building blocks to accelerate system implementation.
  • Regulatory Compliance: RoHS compliance supports deployments that require lead‑free, environmentally compliant components.

Why Choose LAV-AT-E70-1CSG841I?

The LAV-AT-E70-1CSG841I positions itself for industrial embedded designs that demand a combination of high logic density, significant embedded memory, and broad I/O capacity in a compact FCCSPBGA package. Its alignment with the Lattice Avant platform architecture provides access to on‑chip building blocks—clocking, memory modes, DSP elements, and high‑speed PHY options—useful for systems integrating memory interfaces, protocol bridges, and real‑time acceleration.

Choose this device when your design requires a programmable, industrial‑rated FPGA with strong on‑chip resources and high I/O count to reduce board complexity and centralize critical logic functions. The device’s specifications make it suitable for engineers balancing integration density, connectivity, and environmental robustness.

Request a quote or submit an inquiry to receive pricing and availability details for LAV-AT-E70-1CSG841I and to discuss how this Avant™-E FPGA can fit your design requirements.

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