LAV-AT-E70-1CBG484C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 349 4239360 637000 484-BGA, FCCSPBGA

Quantity 983 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCCSP (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGA, FCCSPBGANumber of I/O349Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-E70-1CBG484C – Avant™-E Field Programmable Gate Array (FPGA) IC 349 4239360 637000 484-BGA, FCCSPBGA

The LAV-AT-E70-1CBG484C is an Avant™-E FPGA device from Lattice Semiconductor, delivering high logic capacity and extensive on-chip memory in a compact 484-ball FCCSPBGA package. This surface-mount, commercial-grade FPGA integrates a large number of I/Os and platform-level resources to address designs that require dense programmable logic, embedded memory, and flexible I/O organization.

As part of the Lattice Avant Platform, the device leverages the platform architecture — including programmable functional units, advanced clocking, embedded memory blocks and DSP resources — to support a wide range of configurable hardware logic functions while providing traceable configuration and system-level interfaces.

Key Features

  • Logic Capacity  637,000 logic elements (cells) for implementing complex programmable logic and custom hardware functions.
  • Embedded Memory  Approximately 4.24 Mbits of total on-chip RAM (4,239,360 bits) for data buffering, FIFOs and local storage.
  • I/O Count  349 general-purpose I/O pins to support wide bus interfaces and multiple peripheral connections.
  • Package & Mounting  484-BGA, FCCSPBGA package (supplier device package: 484-FCCSP, 19×19) in a surface-mount format for dense board-level integration.
  • Power Supply  Voltage supply: 820 mV (device nominal supply as specified).
  • Operating Temperature  Commercial operating range: 0 °C to 85 °C.
  • Platform Architecture  Part of the Lattice Avant Platform with documented architecture elements such as Programmable Functional Unit (PFU) blocks, routing fabric, and clocking hierarchy.
  • Clocking & Timing  Platform-level clock features include on-chip oscillator, PLLs, global and regional clock resources, dynamic clock control and synchronizers (as described in the Avant Platform documentation).
  • Memory & DSP  sysMEM and sysDSP resources in the Avant Platform enable memory-centric and DSP-accelerated functions; features include single/dual-port RAM modes, FIFO modes and DSP blocks (per platform documentation).
  • I/O & Interfaces  Programmable I/O cells and banking scheme with support for platform I/O standards; platform documentation also describes DDR memory support and DDRPHY options, multi-protocol PHY/PCS and SERDES capabilities.
  • System Configuration & Reliability  Platform configuration options include JTAG, SEU handling guidance and enhanced configuration features described in the Avant Platform documentation.
  • Compliance  RoHS compliant.

Typical Applications

  • High-density programmable logic designs  Implement large-scale custom logic, state machines and hardware accelerators using 637,000 logic elements and extensive on-chip RAM.
  • Memory-centric subsystems  Leverage approximately 4.24 Mbits of embedded memory and sysMEM features for buffering, FIFOs and ROM-like initialization modes.
  • High-pin-count interface hubs  Use the 349 I/Os and flexible PIO banking to aggregate multiple buses, sensors and peripheral interfaces on a single device.
  • Clock- and timing-critical designs  Utilize platform clocking resources including PLLs, on-chip oscillator and dynamic clock control to manage complex timing domains.

Unique Advantages

  • High logic density: 637,000 logic elements provide substantial room for complex designs and integration of multiple functions into a single device, reducing board-level component count.
  • On-chip memory for system efficiency: Approximately 4.24 Mbits of embedded RAM enables local buffering and memory cascades to simplify external memory requirements.
  • Extensive I/O capability: 349 I/Os support broad peripheral connectivity and wide parallel interfaces without immediate need for external GPIO expanders.
  • Platform-level resources: Avant Platform features such as PFU blocks, sysDSP, DDR support and SERDES/PCS options provide a documented architectural foundation for building diverse FPGA-based subsystems.
  • Compact, manufacturable package: 484-FCCSP (19×19) ball grid package in surface-mount format eases placement in space-constrained designs while supporting automated assembly.
  • Commercial-grade readiness: Specified for 0 °C to 85 °C operation and RoHS compliant for mainstream electronic product deployment.

Why Choose LAV-AT-E70-1CBG484C?

The LAV-AT-E70-1CBG484C balances substantial logic capacity, measurable embedded memory, and a high I/O count in a compact FCCSPBGA package, making it a practical choice for designs that require dense programmable logic and flexible system integration. As a member of the Lattice Avant Platform, it benefits from a documented architecture that covers programmable functional units, memory modes, clocking structures and interface building blocks.

This device suits engineering teams looking to consolidate functionality, reduce external components, and implement complex FPGA-based functions within commercial-temperature systems. The combination of platform features and clear specifications supports scalable design decisions and predictable integration into product development workflows.

Request a quote or submit a pricing inquiry to initiate procurement or request additional technical information about LAV-AT-E70-1CBG484C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up