LAV-AT-E50-3CBG484C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 329 2723840 409000 484-BGA, FCCSPBGA

Quantity 381 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCCSP (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGA, FCCSPBGANumber of I/O329Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells409000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits2723840

Overview of LAV-AT-E50-3CBG484C – Avant™-E FPGA, 329 I/Os, ~2.72 Mbits RAM, 409000 Logic Elements

The LAV-AT-E50-3CBG484C is an Avant™-E field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a high logic capacity FPGA fabric with integrated memory and extensive I/O in a compact 484-ball FCCSPBGA package.

Architected as part of the Lattice Avant platform, the device includes on-chip memory and DSP resources alongside programmable I/O and clocking blocks, making it suitable for designs that require substantial programmable logic, embedded memory, and flexible I/O integration within a commercial temperature range.

Key Features

  • Logic Capacity  409000 logic element cells for implementing complex programmable logic functions.
  • Embedded Memory  Approximately 2.72 Mbits of on-chip RAM (2,723,840 bits) for data storage, FIFOs, and buffer implementations; sysMEM supports single, dual and pseudo-dual port modes and FIFO modes as described in the Avant platform documentation.
  • I/O Density  329 programmable I/Os to support diverse peripheral interfaces and signaling requirements.
  • Package and Mounting  484-BGA (484-FCCSP, 19×19) FCCSPBGA package in a surface-mount form factor for compact board footprint.
  • Power  Voltage supply specified at 820 mV (as provided in product data).
  • Operating Range  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
  • Clocking and Timing  Avant platform clocking primitives are supported, including on-chip oscillator, PLLs, global and regional clock structures, and dynamic clock control as documented in the platform overview.
  • Memory and DSP Subsystems  sysMEM and sysDSP blocks are included in the platform architecture for flexible memory configurations and DSP functions.
  • High-Speed Interfaces  Architecture notes include DDR PHY support and SERDES/PCS blocks and multi-protocol PHY/PCS integration capability per the Avant platform documentation.
  • Configuration and Reliability Features  Device configuration options include JTAG and SEU handling mechanisms referenced in the platform overview.
  • Compliance  RoHS compliant.

Typical Applications

  • High-speed memory interfacing  Leverages DDR PHY and sysMEM capabilities for designs requiring external memory controllers and PHY integration.
  • Serial and protocol bridging  SERDES and PCS blocks support implementations that require multi-protocol PHY/PCS integration and high-speed serial lanes.
  • Digital signal processing  sysDSP resources combined with large logic capacity enable on-chip signal processing and algorithm acceleration.
  • Custom I/O and interface control  Extensive programmable I/O and PIC features support varied I/O standards and flexible interfacing tasks.

Unique Advantages

  • Substantial logic density: 409000 logic element cells allow implementation of complex, high-gate-count designs without external logic expansion.
  • Integrated on-chip memory: Approximately 2.72 Mbits of embedded RAM reduces the need for external buffer memory in many designs.
  • Rich I/O complement: 329 I/Os provide broad connectivity options for peripherals, memory interfaces, and custom signaling.
  • Comprehensive clocking architecture: On-chip oscillator, PLLs, and regional/global clocking options facilitate flexible timing domain management.
  • Compact package: 484-FCCSP (19×19) BGA package enables high integration in space-constrained board layouts.
  • Platform-level capabilities: Avant platform features such as sysMEM, sysDSP, DDRPHY, and multi-protocol PHY/PCS support enable coherent system-level design choices documented by the vendor.

Why Choose LAV-AT-E50-3CBG484C?

The LAV-AT-E50-3CBG484C positions itself as a high-capacity Avant™-E FPGA option within Lattice Semiconductor’s Avant platform, combining significant logic resources, embedded memory, and broad I/O in a compact FCCSPBGA package. Its documented platform features—including advanced clocking, memory and DSP subsystems, and PHY/PCS building blocks—support system designers looking to consolidate functions on a single programmable device.

This part is suited for commercial-temperature applications that need scalable programmable logic, on-chip RAM, and flexible I/O and interface capabilities. The device is RoHS compliant and is supported by Avant platform documentation that details configuration, timing, memory, and interface features to aid design and verification.

Request a quote or contact sales to discuss availability, lead times, and pricing for the LAV-AT-E50-3CBG484C.

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