LAV-AT-E50-3CBG484I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 329 2723840 409000 484-BGA, FCCSPBGA

Quantity 1,252 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCCSP (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGA, FCCSPBGANumber of I/O329Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells409000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits2723840

Overview of LAV-AT-E50-3CBG484I – Avant™-E FPGA, 484-FCCSP

The LAV-AT-E50-3CBG484I is an Avant™-E Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It is part of the Lattice Avant platform and implements programmable logic, on-chip memory, DSP capabilities, and advanced I/O and PHY building blocks described in the platform overview.

Designed for industrial-grade applications, this device combines high logic density with embedded memory and flexible I/O in a 484-FCCSP package, supporting deployments that require a wide operating temperature range and surface-mount assembly.

Key Features

  • Core Logic — Approximately 409,000 logic elements for implementing complex programmable logic and compute functions, aligned with the Avant programmable functional unit (PFU) architecture.
  • Embedded Memory — Approximately 2.72 Mbits of on-chip RAM (2,723,840 bits) with support for single, dual and pseudo-dual port modes, memory cascading, initialization and FIFO operation as described in the Avant platform memory blocks.
  • Programmable I/O — 329 user I/O pins and a programmable I/O cell (PIC) architecture providing input, output and tri-state register blocks and support for multiple I/O standards as described by the platform.
  • Clocking and Timing — On-chip oscillator, PLLs, global and regional clock resources, dynamic clock control and clock synchronizers for flexible clock domain management as described in the platform overview.
  • PHY and High-Speed Interfaces — Platform-level support for SERDES/PMA blocks, multi-protocol PCS and integrated PHY functionality including DDRPHY for DDR memory support.
  • Configuration and Reliability — Enhanced configuration options, JTAG support and SEU handling capabilities are part of the listed device architecture in the Avant platform documentation.
  • Package & Mounting — 484-FCCSP (19×19) package case in a 484-BGA/FCCSPBGA form factor; surface-mount mounting type suitable for board-level assembly.
  • Industrial Temperature Range — Rated for operation from -40 °C to 100 °C for industrial environments.
  • Power — Voltage supply indicated as 820 mV in the product data.
  • Compliance — RoHS compliant.

Typical Applications

  • Memory Interface and Bridging — Use the device’s sysMEM and DDRPHY capabilities to implement DDR memory interfaces, memory controllers and high-throughput buffering.
  • High-Speed Serial and Protocol Processing — Leverage SERDES/PMA and multi-protocol PCS building blocks for high-speed serial links and protocol adaptation.
  • Signal Processing and DSP Acceleration — Implement compute-intensive tasks using the platform’s sysDSP and large logic element count for data path acceleration and filtering.
  • I/O-Intensive Control and Bridging — The 329 I/O pins and programmable I/O cell architecture support complex I/O routing, bussing and peripheral interfacing in industrial systems.

Unique Advantages

  • High Logic Density: Approximately 409,000 logic elements enable large, integration-heavy designs without increasing board-level complexity.
  • Substantial Embedded Memory: Approximately 2.72 Mbits of on-chip RAM simplifies memory architecture and reduces external memory requirements for many applications.
  • Platform-Level Feature Set: The Avant platform provides programmable functional units, clocking resources, DDRPHY and SERDES/PMA blocks that accelerate time-to-design for complex systems.
  • Industrial Thermal Range: Rated from -40 °C to 100 °C to meet a broad set of industrial operating conditions.
  • Flexible Packaging: 484-FCCSP (19×19) package offers a high-pin-count, surface-mount solution for compact, high-density PCB designs.
  • Standards and Compliance: RoHS compliance supports environmentally conscious manufacturing and supply chain requirements.

Why Choose LAV-AT-E50-3CBG484I?

The LAV-AT-E50-3CBG484I positions itself as a high-density, industrial-grade FPGA option within the Lattice Avant platform family. It combines a substantial logic element count, multiple megabits of embedded RAM, and a comprehensive platform architecture (programmable functional units, clocking, DDR and SERDES/PHY support) that addresses complex interface, memory and signal-processing needs.

This device is suitable for designs that require a balance of integration, configurable compute resources and robust I/O in a compact surface-mount package. Its operating temperature range and RoHS compliance make it a practical choice for industrial applications that benefit from the Avant platform’s documented architectural features.

Request a quote or submit an inquiry to receive pricing and availability for the LAV-AT-E50-3CBG484I. Our team can provide part availability and support information to help evaluate this FPGA for your design requirements.

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