LAV-AT-E70-1CSG841C

The LAV-AT-E70-1CSG841C is an Avant™-E series FPGA from Lattice Semiconductor Corporation designed for high-density, configurable logic implementations. Built on the Avant platform architecture, this device provides a large programmable fabric together with embedded memory, flexible I/O, and a comprehensive on-chip subsystem suited for designs requiring integration of memory interfaces, DSP functions, and high-speed transceivers.

This commercial-grade, surface-mount FPGA offers 637,000 logic elements, approximately 4.24 Mbits of embedded RAM, and 502 general-purpose I/Os in an 841-ball FCCSPBGA package (841-FCCSP, 15×13). The device is specified for operation from 0 °C to 85 °C and is RoHS compliant.

Key Features

• Logic Capacity – 637,000 logic elements cells suitable for complex programmable logic and large-scale integration of custom functions.
• Embedded Memory – Approximately 4.24 Mbits of on-chip RAM with support for memory cascading, single/dual/pseudo-dual port modes, FIFO modes, and RAM initialization/ROM operation as described in the Avant platform memory architecture.
• Extensive I/O – 502 I/O pins with a programmable I/O cell architecture that includes input, output, and tri-state register blocks and a banking scheme for supported I/O standards.
• Clocking and Timing – On-chip oscillator, PLLs, global and regional clock domains, edge clocks, PHY clock support, clock synchronizers/dividers, dynamic clock select and control, and DLL delay elements to support complex clocking topologies.
• DSP and Processing – Integrated sysDSP resources and programmable functional unit (PFU) blocks including slices and routing for mapped DSP and logic functions.
• Memory and Interface IP – DDR memory support with DDRPHY and DQS grouping capabilities for external memory interfaces.
• High-speed SerDes and PHY – SERDES/PMA blocks and multi-protocol PCS/PHY integration for high-speed serial and multi-protocol physical-layer connectivity.
• Device Configuration & Reliability – Enhanced configuration options, JTAG support, Single Event Upset (SEU) handling, and trace ID features documented for the Avant platform.
• Package & Mounting – 841-ball FCCSP BGA package (supplier device package: 841-FCCSP, 15×13), surface mount.
• Power & Supply – Voltage supply specified at 820 mV (as listed in product data).
• Temperature & Compliance – Commercial grade operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

• High‑performance memory interfaces – Use the device’s sysMEM features and DDRPHY support to implement external memory controllers, FIFO buffering, and memory-mapped subsystems.
• Signal processing and acceleration – Leverage sysDSP resources and large logic capacity for real-time DSP tasks, filtering, and algorithm acceleration within embedded systems.
• Multi‑protocol connectivity – Employ SERDES/PMA and multi-protocol PCS/PHY integration for serialization, deserialization, and high-speed serial link implementations.
• Flexible I/O control and bridging – Use the extensive programmable I/O and banking scheme for protocol bridging, sensor interfacing, or custom peripheral expansion requiring many I/Os.

Unique Advantages

• High logic density: 637,000 logic elements enable consolidation of multiple functions into a single device, reducing system BOM and board area.
• Significant embedded memory: Approximately 4.24 Mbits of on-chip RAM with flexible modes (FIFO, single/dual/pseudo-dual port) simplifies data buffering and memory-mapped designs.
• Broad I/O reach: 502 I/Os with programmable I/O cell architecture provide design flexibility for diverse external interfaces and signaling standards.
• Comprehensive clocking: Multiple on-chip clock resources (oscillator, PLLs, global/regional/edge clocks, dynamic clock control) support complex timing domains and synchronous designs.
• Integrated high-speed PHYs: SERDES, DDRPHY, and multi-protocol PCS options enable implementation of high-speed links and memory interfaces without external transceiver chips.
• Commercial-ready and compliant: Surface-mount 841-FCCSP package, RoHS compliance, and a specified commercial temperature range support standard commercial product lifecycles.

Why Choose LAV-AT-E70-1CSG841C?

The LAV-AT-E70-1CSG841C combines high logic capacity, substantial embedded memory, and broad I/O capability within the Avant platform architecture to deliver a flexible FPGA solution for demanding, integrated designs. Its on-chip clocking, DSP resources, DDR and SERDES support make it suitable for systems that require configurable logic, high-speed interfaces, and embedded memory management.

This device is appropriate for engineers and teams seeking a commercially graded, RoHS‑compliant FPGA in a compact 841-ball FCCSP package that simplifies board-level integration while providing the architectural building blocks described in the Avant platform documentation.

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