LAV-AT-E70-1LFG1156I
| Part Description |
Avant™-E Field Programmable Gate Array (FPGA) IC 553 4239360 637000 1156-BBGA, FCBGA |
|---|---|
| Quantity | 406 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 553 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 637000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4239360 |
Overview of LAV-AT-E70-1LFG1156I – Avant™-E FPGA, 637,000 logic elements, 1156-FCBGA
The LAV-AT-E70-1LFG1156I is an Avant™-E field programmable gate array (FPGA) from Lattice Semiconductor Corporation. Built on the Avant platform architecture, this device integrates a large array of programmable functional units with dedicated memory and DSP resources to support complex custom logic, high-speed interfaces, and memory-centric designs.
With 637,000 logic elements, approximately 4.24 Mbits of embedded memory, and 553 I/O, the device targets applications that require substantial programmable logic capacity, rich I/O connectivity and operation across industrial temperature ranges. Its 1156-FCBGA (35×35) surface-mount package and RoHS compliance make it suitable for production deployment in industrial systems.
Key Features
- Logic Capacity — 637,000 logic elements for large-scale custom logic implementations and complex control or data-path functions.
- Embedded Memory — Approximately 4.24 Mbits of total on-chip RAM bits for buffering, FIFO, and tightly coupled memory needs.
- I/O Density — 553 user I/O pins to support broad peripheral and interface connectivity.
- Package & Mounting — 1156-FCBGA (35×35) package in a surface-mount form factor for high-density PCB integration.
- Operating Range — Industrial-grade operation from −40 °C to 100 °C for deployment in harsh thermal environments.
- Power — Voltage supply specified at 820 mV (per product data).
- Avant Platform Architecture — Device aligns with the Lattice Avant platform architecture which includes programmable functional unit (PFU) blocks, flexible routing and clocking structures, on-chip PLL/DLL options, and device configuration features.
- Memory and DSP Subsystems — Datasheet coverage indicates sysMEM and sysDSP blocks for memory cascading, FIFO modes, ROM/initialization, and DSP functions useful for signal processing and compute tasks.
- Programmable I/O and PHY Support — Architecture includes programmable I/O cell (PIC) features, DDR memory support with DDRPHY grouping, and SERDES/PCS building blocks for multi-protocol PHY integration.
- Configuration & Reliability — Device configuration supports enhanced options including JTAG and SEU handling as described in the Avant platform documentation.
- Compliance — RoHS compliant for regulatory alignment in standard manufacturing processes.
Typical Applications
- High‑speed interfaces and protocol bridging — Utilizes SERDES/PCS and multi‑protocol PHY capabilities for complex serial link aggregation, protocol conversion, and interface bridging.
- DDR memory interfacing and buffering — DDRPHY and sysMEM features support designs that require external DDR memory interfaces and high-bandwidth buffering.
- Embedded compute and DSP acceleration — sysDSP and abundant logic elements enable implementation of custom accelerators and signal processing pipelines.
- Industrial control and automation — Industrial-grade temperature range and broad I/O density suit automation, motor control, and factory systems requiring robust operation.
Unique Advantages
- Substantial programmable capacity: 637,000 logic elements provide the headroom for complex, high‑gate‑count designs without partitioning across multiple devices.
- Integrated memory resources: Approximately 4.24 Mbits of on‑chip RAM reduces dependency on external memory for many buffering and local storage needs.
- High I/O count: 553 I/O pins simplify system integration by accommodating multiple parallel interfaces and control signals on a single device.
- Industrial thermal capability: −40 °C to 100 °C rating supports deployment in demanding thermal environments common in industrial applications.
- Avant platform ecosystem: Architecture elements documented in the Avant platform (PFU blocks, clocking, sysMEM, sysDSP, SERDES/PCS) provide a coherent foundation for implementing a wide range of protocols and compute functions.
- Production-ready package: 1156-FCBGA (35×35) surface-mount package aligns with compact, high-density PCB designs and standard assembly flows.
Why Choose LAV-AT-E70-1LFG1156I?
The LAV-AT-E70-1LFG1156I positions itself as a high-capacity Avant™-E FPGA option for designs that demand large programmable logic resources, significant on‑chip memory, and extensive I/O. Its documented Avant platform architecture elements—covering programmable functional units, memory subsystems, DSP blocks, clocking, and SERDES/PHY support—help streamline the implementation of complex interfaces and compute functions.
This device is suited to engineering teams building industrial equipment, advanced communications or memory‑interfacing systems who need a single FPGA with substantial logic, embedded memory, and broad I/O. Its industrial temperature rating and RoHS compliance provide added assurance for long‑life production deployments.
Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the LAV-AT-E70-1LFG1156I.

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