LAV-AT-E70-1LFG1156I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 553 4239360 637000 1156-BBGA, FCBGA

Quantity 406 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O553Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-E70-1LFG1156I – Avant™-E FPGA, 637,000 logic elements, 1156-FCBGA

The LAV-AT-E70-1LFG1156I is an Avant™-E field programmable gate array (FPGA) from Lattice Semiconductor Corporation. Built on the Avant platform architecture, this device integrates a large array of programmable functional units with dedicated memory and DSP resources to support complex custom logic, high-speed interfaces, and memory-centric designs.

With 637,000 logic elements, approximately 4.24 Mbits of embedded memory, and 553 I/O, the device targets applications that require substantial programmable logic capacity, rich I/O connectivity and operation across industrial temperature ranges. Its 1156-FCBGA (35×35) surface-mount package and RoHS compliance make it suitable for production deployment in industrial systems.

Key Features

  • Logic Capacity — 637,000 logic elements for large-scale custom logic implementations and complex control or data-path functions.
  • Embedded Memory — Approximately 4.24 Mbits of total on-chip RAM bits for buffering, FIFO, and tightly coupled memory needs.
  • I/O Density — 553 user I/O pins to support broad peripheral and interface connectivity.
  • Package & Mounting — 1156-FCBGA (35×35) package in a surface-mount form factor for high-density PCB integration.
  • Operating Range — Industrial-grade operation from −40 °C to 100 °C for deployment in harsh thermal environments.
  • Power — Voltage supply specified at 820 mV (per product data).
  • Avant Platform Architecture — Device aligns with the Lattice Avant platform architecture which includes programmable functional unit (PFU) blocks, flexible routing and clocking structures, on-chip PLL/DLL options, and device configuration features.
  • Memory and DSP Subsystems — Datasheet coverage indicates sysMEM and sysDSP blocks for memory cascading, FIFO modes, ROM/initialization, and DSP functions useful for signal processing and compute tasks.
  • Programmable I/O and PHY Support — Architecture includes programmable I/O cell (PIC) features, DDR memory support with DDRPHY grouping, and SERDES/PCS building blocks for multi-protocol PHY integration.
  • Configuration & Reliability — Device configuration supports enhanced options including JTAG and SEU handling as described in the Avant platform documentation.
  • Compliance — RoHS compliant for regulatory alignment in standard manufacturing processes.

Typical Applications

  • High‑speed interfaces and protocol bridging — Utilizes SERDES/PCS and multi‑protocol PHY capabilities for complex serial link aggregation, protocol conversion, and interface bridging.
  • DDR memory interfacing and buffering — DDRPHY and sysMEM features support designs that require external DDR memory interfaces and high-bandwidth buffering.
  • Embedded compute and DSP acceleration — sysDSP and abundant logic elements enable implementation of custom accelerators and signal processing pipelines.
  • Industrial control and automation — Industrial-grade temperature range and broad I/O density suit automation, motor control, and factory systems requiring robust operation.

Unique Advantages

  • Substantial programmable capacity: 637,000 logic elements provide the headroom for complex, high‑gate‑count designs without partitioning across multiple devices.
  • Integrated memory resources: Approximately 4.24 Mbits of on‑chip RAM reduces dependency on external memory for many buffering and local storage needs.
  • High I/O count: 553 I/O pins simplify system integration by accommodating multiple parallel interfaces and control signals on a single device.
  • Industrial thermal capability: −40 °C to 100 °C rating supports deployment in demanding thermal environments common in industrial applications.
  • Avant platform ecosystem: Architecture elements documented in the Avant platform (PFU blocks, clocking, sysMEM, sysDSP, SERDES/PCS) provide a coherent foundation for implementing a wide range of protocols and compute functions.
  • Production-ready package: 1156-FCBGA (35×35) surface-mount package aligns with compact, high-density PCB designs and standard assembly flows.

Why Choose LAV-AT-E70-1LFG1156I?

The LAV-AT-E70-1LFG1156I positions itself as a high-capacity Avant™-E FPGA option for designs that demand large programmable logic resources, significant on‑chip memory, and extensive I/O. Its documented Avant platform architecture elements—covering programmable functional units, memory subsystems, DSP blocks, clocking, and SERDES/PHY support—help streamline the implementation of complex interfaces and compute functions.

This device is suited to engineering teams building industrial equipment, advanced communications or memory‑interfacing systems who need a single FPGA with substantial logic, embedded memory, and broad I/O. Its industrial temperature rating and RoHS compliance provide added assurance for long‑life production deployments.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the LAV-AT-E70-1LFG1156I.

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