LAV-AT-E50-2CBG484I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 329 2723840 409000 484-BGA, FCCSPBGA

Quantity 823 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCCSP (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGA, FCCSPBGANumber of I/O329Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells409000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits2723840

Overview of LAV-AT-E50-2CBG484I – Avant™-E Field Programmable Gate Array (FPGA) IC 329 2723840 409000 484-BGA, FCCSPBGA

The LAV-AT-E50-2CBG484I is an Avant™-E FPGA device from Lattice Semiconductor intended for industrial-grade embedded designs. Built on the Lattice Avant platform architecture, the device combines a large programmable fabric with on-chip memory and extensive I/O to support complex, configurable logic implementations.

This FPGA is positioned for systems that require a high count of logic elements, substantial embedded RAM, and a broad set of timing and I/O resources while operating across an industrial temperature range.

Key Features

  • Programmable Logic Capacity — Approximately 409,000 logic elements for implementing large custom logic functions and complex datapaths.
  • Embedded Memory — Approximately 2.72 Mbits of embedded RAM (2,723,840 bits) for on-chip data storage, FIFOs, and buffering.
  • I/O Resources — 329 general-purpose I/O pins to support wide parallel interfaces and multiple peripheral connections.
  • Clocking and Timing — Architecture documentation includes on-chip oscillator, PLL, global and regional clock resources, dynamic clock control, and clock synchronizers to support diverse timing schemes.
  • Memory and DSP Blocks — Device architecture references sysMEM and sysDSP blocks for flexible memory modes (single/dual/ROM/fifo) and DSP-style processing.
  • High-Speed Interfaces — Platform overview describes SERDES/PMA blocks and multi-protocol PCS/PHY integration for serialized high-speed links and DDR memory PHY support.
  • Configuration and Reliability — Device features include enhanced configuration options, JTAG support, and Single Event Upset (SEU) handling mechanisms described in the platform documentation.
  • Package and Mounting — 484-ball FCCSPBGA package (484-FCCSP, 19 × 19 mm) optimized for surface-mount assembly.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environmental needs.
  • RoHS Compliant — Meets RoHS environmental requirements.
  • Voltage Supply — Specified supply range shown as 820 mV to 820 mV in device data.

Typical Applications

  • Industrial Control Systems — Suitable for control and automation applications that require industrial temperature operation and substantial on-chip logic and memory.
  • High-Density I/O Interfaces — Effective in designs needing large numbers of GPIOs for parallel buses, sensors, or multi-channel I/O aggregation.
  • Custom Data Processing — Implements datapaths and processing pipelines using the large logic element count and embedded RAM for buffering and intermediate storage.

Unique Advantages

  • Large FPGA Fabric: 409,000 logic elements provide a substantial resource pool for complex logic integration without external ASICs.
  • On-Chip Memory: Approximately 2.72 Mbits of embedded RAM reduces external memory dependence and simplifies board-level design.
  • Extensive I/O Count: 329 I/Os enable broad peripheral connectivity and parallel data paths directly to the FPGA.
  • Platform-Level Clocking and SERDES: Built-in platform features such as PLLs, clock networks, and SERDES/PCS blocks support a wide range of timing and high-speed interface requirements.
  • Industrial Temperature and Packaging: A 484-ball FCCSPBGA package and −40 °C to 100 °C rating address robust mounting and environmental needs.
  • Compliance and Configuration: RoHS compliance and documented configuration/JTAG and SEU handling options support manufacturability and field reliability considerations.

Why Choose LAV-AT-E50-2CBG484I?

The LAV-AT-E50-2CBG484I provides a substantial programmable fabric combined with embedded RAM and a high I/O count, all within a compact 484-FCCSP package rated for industrial temperatures. It is suited to engineers and procurement teams designing systems that require significant on-chip logic density, flexible memory modes, and comprehensive clocking and high-speed interface resources described by the Lattice Avant platform documentation.

For designs that demand scalability in logic, memory, and I/O while maintaining RoHS compliance and industrial operating range, this Avant™-E device delivers verified platform features to support integration and long-term deployment.

Request a quote or submit your requirements to receive pricing and availability for LAV-AT-E50-2CBG484I. Include your desired quantity, lead times, and any specific configuration questions to get a prompt response.

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