LAV-AT-E50-2CBG484I
| Part Description |
Avant™-E Field Programmable Gate Array (FPGA) IC 329 2723840 409000 484-BGA, FCCSPBGA |
|---|---|
| Quantity | 823 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCCSP (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA, FCCSPBGA | Number of I/O | 329 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 409000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-E50-2CBG484I – Avant™-E Field Programmable Gate Array (FPGA) IC 329 2723840 409000 484-BGA, FCCSPBGA
The LAV-AT-E50-2CBG484I is an Avant™-E FPGA device from Lattice Semiconductor intended for industrial-grade embedded designs. Built on the Lattice Avant platform architecture, the device combines a large programmable fabric with on-chip memory and extensive I/O to support complex, configurable logic implementations.
This FPGA is positioned for systems that require a high count of logic elements, substantial embedded RAM, and a broad set of timing and I/O resources while operating across an industrial temperature range.
Key Features
- Programmable Logic Capacity — Approximately 409,000 logic elements for implementing large custom logic functions and complex datapaths.
- Embedded Memory — Approximately 2.72 Mbits of embedded RAM (2,723,840 bits) for on-chip data storage, FIFOs, and buffering.
- I/O Resources — 329 general-purpose I/O pins to support wide parallel interfaces and multiple peripheral connections.
- Clocking and Timing — Architecture documentation includes on-chip oscillator, PLL, global and regional clock resources, dynamic clock control, and clock synchronizers to support diverse timing schemes.
- Memory and DSP Blocks — Device architecture references sysMEM and sysDSP blocks for flexible memory modes (single/dual/ROM/fifo) and DSP-style processing.
- High-Speed Interfaces — Platform overview describes SERDES/PMA blocks and multi-protocol PCS/PHY integration for serialized high-speed links and DDR memory PHY support.
- Configuration and Reliability — Device features include enhanced configuration options, JTAG support, and Single Event Upset (SEU) handling mechanisms described in the platform documentation.
- Package and Mounting — 484-ball FCCSPBGA package (484-FCCSP, 19 × 19 mm) optimized for surface-mount assembly.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environmental needs.
- RoHS Compliant — Meets RoHS environmental requirements.
- Voltage Supply — Specified supply range shown as 820 mV to 820 mV in device data.
Typical Applications
- Industrial Control Systems — Suitable for control and automation applications that require industrial temperature operation and substantial on-chip logic and memory.
- High-Density I/O Interfaces — Effective in designs needing large numbers of GPIOs for parallel buses, sensors, or multi-channel I/O aggregation.
- Custom Data Processing — Implements datapaths and processing pipelines using the large logic element count and embedded RAM for buffering and intermediate storage.
Unique Advantages
- Large FPGA Fabric: 409,000 logic elements provide a substantial resource pool for complex logic integration without external ASICs.
- On-Chip Memory: Approximately 2.72 Mbits of embedded RAM reduces external memory dependence and simplifies board-level design.
- Extensive I/O Count: 329 I/Os enable broad peripheral connectivity and parallel data paths directly to the FPGA.
- Platform-Level Clocking and SERDES: Built-in platform features such as PLLs, clock networks, and SERDES/PCS blocks support a wide range of timing and high-speed interface requirements.
- Industrial Temperature and Packaging: A 484-ball FCCSPBGA package and −40 °C to 100 °C rating address robust mounting and environmental needs.
- Compliance and Configuration: RoHS compliance and documented configuration/JTAG and SEU handling options support manufacturability and field reliability considerations.
Why Choose LAV-AT-E50-2CBG484I?
The LAV-AT-E50-2CBG484I provides a substantial programmable fabric combined with embedded RAM and a high I/O count, all within a compact 484-FCCSP package rated for industrial temperatures. It is suited to engineers and procurement teams designing systems that require significant on-chip logic density, flexible memory modes, and comprehensive clocking and high-speed interface resources described by the Lattice Avant platform documentation.
For designs that demand scalability in logic, memory, and I/O while maintaining RoHS compliance and industrial operating range, this Avant™-E device delivers verified platform features to support integration and long-term deployment.
Request a quote or submit your requirements to receive pricing and availability for LAV-AT-E50-2CBG484I. Include your desired quantity, lead times, and any specific configuration questions to get a prompt response.