LAV-AT-E50-1CBG484C
| Part Description |
Avant™-E Field Programmable Gate Array (FPGA) IC 329 2723840 409000 484-BGA, FCCSPBGA |
|---|---|
| Quantity | 27 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCCSP (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA, FCCSPBGA | Number of I/O | 329 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 409000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-E50-1CBG484C – Avant™-E Field Programmable Gate Array (FPGA), 484-FCCSPBGA, 409000 logic elements
The LAV-AT-E50-1CBG484C is an Avant™-E series Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It implements the Avant platform architecture with programmable functional units, on-chip memory and DSP capabilities suited for designs that require a large number of logic elements, extensive on-chip RAM, and substantial I/O connectivity.
This device targets commercial-grade applications and offers a combination of programmable logic (409,000 logic element cells), approximately 2.7 Mbits of embedded memory, and 329 I/O pins in a 484-FCCSP (19×19) BGA package—delivering a balance of integration, I/O density, and configurability.
Key Features
- Core Architecture Avant platform architecture with Programmable Functional Unit (PFU) blocks and slice-based logic resources as described in the Avant documentation.
- Logic Capacity 409,000 logic element cells to implement complex custom logic and system functions.
- Embedded Memory Approximately 2.7 Mbits of on-chip RAM (2,723,840 bits) with sysMEM features including RAM initialization, ROM operation, memory cascading, and single/dual/pseudo-dual port and FIFO modes.
- Processing and DSP Platform includes sysDSP blocks for dedicated signal processing capabilities (architectural details and integration provided by the Avant platform overview).
- I/O and Interfaces 329 I/O pins with programmable I/O (PIO) cells, banking schemes and supported sysI/O standards. Programmable I/O cell (PIC) functionality includes input, output and tri-state register blocks.
- High-Speed Interfaces Platform-level support for SERDES, PCS, SERDES/PMA blocks, multi-protocol PCS (MPPCS) and multi-protocol PHY (MPPHY) integration, and DDR memory support with DDRPHY and DQS grouping as described in the Avant platform documentation.
- Clocking and Timing Comprehensive clocking structure including on-chip oscillator, PLL, global/regional/edge/PHY clocks, clock synchronizers/dividers, dynamic clock select/control and DLL delay (DLLDEL).
- Configuration and Reliability Device configuration options include enhanced configuration modes, JTAG support and Single Event Upset (SEU) handling mechanisms discussed in the platform overview.
- Package and Mounting 484-ball FCCSP BGA package (484-FCCSP, 19×19) for surface mount assembly; RoHS compliant.
- Electrical and Environmental Specified supply voltage 820 mV and commercial operating temperature range 0 °C to 85 °C.
Typical Applications
- Memory interface controllers — Leverages DDR memory support and DDRPHY features for designs that require on-board DRAM interfacing and DQS grouping control.
- High-speed serial connectivity — Utilizes SERDES/PMA and PCS capabilities for designs needing multi-protocol serial links and high-speed PHY integration.
- Signal processing accelerators — Employs sysDSP blocks and abundant logic elements for embedded DSP functions and custom data-path implementation.
- Custom I/O bridging and protocol conversion — Programmable I/O cells and a large I/O count enable flexible interfacing between disparate peripherals and buses.
Unique Advantages
- High logic density: 409,000 logic element cells provide capacity for complex control, protocol handling and custom compute functions without external ASICs.
- Substantial on-chip memory: Approximately 2.7 Mbits of embedded RAM with versatile sysMEM modes reduces dependence on external memory for many designs.
- Rich I/O and PHY support: 329 I/O pins combined with SERDES, PCS and DDRPHY support enables high-bandwidth connectivity and flexible interface implementations.
- Comprehensive clocking: On-chip oscillator, PLLs and multiple clock domains support complex timing architectures and dynamic clock control.
- Commercial-grade reliability and compliance: RoHS compliant and specified for 0 °C to 85 °C operation for mainstream commercial applications.
Why Choose LAV-AT-E50-1CBG484C?
The LAV-AT-E50-1CBG484C combines the Avant platform’s architectural building blocks—PFU slices, sysMEM, sysDSP, and advanced I/O/PHY support—with a high logic count and significant on-chip RAM to address commercial designs that require configurable compute and high I/O density. Its 484-FCCSP package and surface-mount mounting suit compact board layouts while maintaining 329 programmable I/Os.
This device is well suited for engineering teams building systems that need integrated DDR support, high-speed serial interfaces, and extensive programmable logic in a commercial-temperature FPGA. The Avant platform documentation provides detailed architectural and configuration guidance to support system design and verification.
Request a quote or submit your inquiry to obtain pricing, availability, and additional technical support for LAV-AT-E50-1CBG484C.

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