LAV-AT-E50-1CBG484I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 329 2723840 409000 484-BGA, FCCSPBGA

Quantity 375 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCCSP (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGA, FCCSPBGANumber of I/O329Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells409000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits2723840

Overview of LAV-AT-E50-1CBG484I – Avant™-E FPGA, 409,000 logic elements, ~2.72 Mbits RAM, 329 I/Os, 484-FCCSP

The LAV-AT-E50-1CBG484I is an Avant™-E Field Programmable Gate Array (FPGA) in a 484-FCCSP (19×19) package, offered in an industrial grade device. It integrates 409,000 logic elements, approximately 2.72 Mbits of embedded memory, and 329 programmable I/Os for high-density, reconfigurable designs.

Architected on the Lattice Avant platform, the device provides on-chip resources described in the product datasheet—including advanced clocking, memory and DSP building blocks, programmable I/O cells, DDR memory support, SERDES/PCS primitives, and device configuration options—targeting applications that need compact, industrial-rated programmable logic.

Key Features

  • Core Logic  409,000 logic elements (cells) for complex, high-density programmable logic implementations.
  • Embedded Memory  Approximately 2.72 Mbits of on-chip RAM (total RAM bits: 2,723,840) with support for single, dual and pseudo-dual port modes and FIFO configurations as described in the datasheet.
  • I/O and Packaging  329 programmable I/Os in a 484-BGA / FCCSPBGA footprint, supplied as a 484-FCCSP (19×19) package for compact board-level integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
  • Power Supply  Documented operating core voltage listed as 820 mV (820 mV to 820 mV in product data).
  • Clocking and Timing  Extensive clocking architecture including on-chip oscillator, PLL, global and regional clocks, edge clocks, PHYCLK, clock synchronizers/dividers, dynamic clock select/control and DLL delay features detailed in the datasheet.
  • sysMEM and Memory Flexibility  sysMEM blocks support initialization/ROM operation, memory cascading, bus-size matching and multiple port modes per the datasheet memory architecture.
  • sysDSP  Dedicated DSP resources are included in the platform architecture for arithmetic and signal-processing functions as described in the documentation.
  • Programmable I/O (PIO) and PIC  Programmable I/O cell architecture with input/output/tri-state register blocks and support for multiple I/O standards as outlined in the datasheet.
  • DDR Memory Support  DDRPHY and DQS grouping support for external DDR memory interfaces per the platform overview.
  • SERDES and PCS  Integrated SERDES/PMA and multi-protocol PCS building blocks for high-speed serial links are listed in the device architecture.
  • Device Configuration and Reliability  Enhanced configuration options, JTAG support and Single Event Upset (SEU) handling mechanisms are described in the product documentation.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Control and Automation  Programmable logic and high I/O density support custom control, I/O aggregation and protocol bridging in industrial systems operating across −40 °C to 100 °C.
  • High-Speed Interface and Data Processing  Integrated SERDES/PCS primitives and DDR memory support enable designs requiring serial links and external memory interfaces.
  • Embedded Signal Processing  sysDSP blocks and substantial logic and memory resources support on-device signal-processing functions and algorithm acceleration.

Unique Advantages

  • High-density programmable fabric: 409,000 logic elements provide the capacity to implement complex logic, custom datapaths and control logic in a single device.
  • Balanced memory and DSP resources: Approximately 2.72 Mbits of embedded RAM combined with sysDSP support enables local buffering, FIFOs and DSP workloads without immediate reliance on external memory.
  • Compact, production-ready package: 484-FCCSP (19×19) packaging with 329 I/Os delivers a high I/O count in a compact footprint suited to space-constrained boards.
  • Industrial temperature qualification: −40 °C to 100 °C rating supports deployments in demanding environmental conditions.
  • Comprehensive clocking and I/O architecture: On-chip oscillator, multiple clock domains, programmable I/O cells and DDRPHY options simplify system timing and interface design.
  • Platform-level integration: Architecture-level features such as SERDES, multi-protocol PCS and enhanced configuration options reduce peripheral component count and streamline system design.

Why Choose LAV-AT-E50-1CBG484I?

The LAV-AT-E50-1CBG484I brings Avant™-E platform capabilities—extensive logic capacity, embedded memory, DSP resources, and a rich clocking and I/O feature set—into an industrial-rated 484-FCCSP package. This combination is suited to engineers needing a compact FPGA with substantial on-chip resources for industrial control, high-speed interfaces and embedded processing tasks.

Designed with platform-level building blocks documented in the product datasheet, the device offers scalable integration for designs that require reconfigurable logic, memory flexibility and interface primitives while maintaining RoHS compliance and industrial temperature support.

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