LAV-AT-E30-3ASG410I

The LAV-AT-E30-3ASG410I is an Avant™-E Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor designed for industrial applications. It combines a high logic-element count with substantial on-chip RAM and a dense I/O complement in a compact 410-WLCSP package, targeting space-constrained, I/O‑rich industrial and embedded designs.

As part of the Lattice Avant platform, the device is documented in the Avant Platform specifications and provides platform-level features described in the datasheet, including sysI/O, programmable termination and platform timing and interface characteristics for advanced system integration.

Key Features

• Core Capacity 262,000 logic elements for complex programmable logic and custom hardware acceleration.
• Embedded Memory Approximately 1.74 Mbits of on-chip RAM to support buffering, local storage and stateful logic.
• I/O Density 247 user I/O pins to interface with a wide range of peripherals and high-pin-count systems.
• Package and Mounting 410-BGA / 410-WLCSP (11×9) package supplied for surface-mount PCB assembly and compact board-level integration.
• Power Supply voltage specified at 820 mV (per product data).
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Platform-Level Signal and Timing Features The Avant platform datasheet documents sysI/O characteristics, on-chip programmable termination, PLLs and internal oscillator parameters to support timing and signal-integrity design choices.
• High‑Speed Interface Characterization The platform specifications include hardened PCIe characteristics and timing information across multiple link rates as detailed in the Avant platform datasheet.
• Reliability and Compliance RoHS compliant and designed for surface-mount assembly processes.

Typical Applications

• Industrial Systems Industrial-grade operating temperature and robust package options make this FPGA suitable for industrial automation and control electronics.
• I/O‑Dense Embedded Designs High pin-count I/O supports applications that require extensive peripheral interfacing and signal routing on compact PCBs.
• Space-Constrained Boards The 410-WLCSP package is targeted at compact board layouts where board area and profile are limited.

Unique Advantages

• High Logic Capacity: 262,000 logic elements enable complex custom logic implementations and hardware acceleration within a single device.
• Integrated On‑Chip RAM: Approximately 1.74 Mbits of embedded memory reduces external memory requirements and simplifies board-level BOM.
• Extensive I/O: 247 I/Os provide flexibility for multi-channel interfaces, sensor arrays and peripheral connectivity without external multiplexing.
• Compact, Surface-Mount Packaging: 410-WLCSP (11×9) package supports space-optimized system designs and modern assembly flows.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in typical industrial thermal environments.
• Platform Documentation: Avant platform specifications detail sysI/O, termination, PLLs, internal oscillators and hardened PCIe characteristics to aid design and verification.

Why Choose LAV-AT-E30-3ASG410I?

The LAV-AT-E30-3ASG410I positions itself as a high-capacity, industrial-grade FPGA option within the Lattice Avant platform, combining a large logic resource pool, substantial embedded memory and a high number of I/Os in a compact WLCSP package. These attributes make it suitable for engineers designing I/O-heavy, space-constrained industrial and embedded systems that require integrated memory and significant programmable logic.

Backed by Avant platform specifications that include signal, timing and interface guidance, the device offers a documented foundation for system integration and validation while maintaining RoHS compliance for broad manufacturing compatibility.

Request a quote or submit a purchase inquiry for the LAV-AT-E30-3ASG410I to get pricing and availability information.