LAV-AT-E30-3ASG324I

The LAV-AT-E30-3ASG324I is an Avant™-E platform FPGA from Lattice Semiconductor Corporation, offering a high-density programmable logic device in a compact 324‑ball WLCSP/BGA package. Designed for industrial-grade embedded designs, this device combines a broad set of on‑chip resources and platform-level features to support complex I/O, memory, and logic integration.

This device implements the Lattice Avant architecture, which includes programmable functional units, on‑chip memory and DSP resources, and support for high‑speed serial and memory PHYs suitable for applications that require customizable logic, memory interfacing, and flexible I/O configurations.

Key Features

• Programmable Logic Capacity — 196,000 logic elements available for implementing custom digital functions and accelerators.
• Embedded Memory — Approximately 1.74 Mbits (1,740,800 bits) of on‑chip RAM for buffering, FIFOs, and local data storage.
• Rich I/O — 208 user I/O pins to support multiple interfaces and external peripherals.
• Package and Mounting — Available in a 324‑ball WLCSP/BGA footprint (Supplier Device Package: 324‑WLCSP (11×9)); surface‑mount mounting type for compact board designs.
• Industrial Temperature Grade — Rated to operate from −40°C to 100°C for industrial environments.
• Supply Voltage — Documented supply voltage: 820 mV.
• Platform-Level Architecture — Part of the Lattice Avant platform with architecture elements such as programmable functional unit (PFU) blocks, sysMEM and sysDSP resources, programmable I/O cells, clocking structures, and device configuration features as described in the platform overview.
• High‑Speed and Memory Support (Series Features) — Series documentation includes DDR PHY support, SerDes/PMA blocks, multi‑protocol PCS/PHY integration and PCIe capability at the platform level.
• System and Security Features (Series Features) — Platform overview lists device configuration options, security engine and SEU handling mechanisms at the series level.
• Compliance — RoHS compliant.

Typical Applications

• High‑density logic integration — Implement custom digital functions, protocol adapters, and application‑specific accelerators using the device’s large logic capacity.
• Memory interface and buffering — Use on‑chip sysMEM resources and documented DDR PHY support (series feature) for memory buffering, FIFOs, and data path staging.
• High‑speed serial connectivity — Leverage SerDes and PCS/PMA capabilities described in the platform overview for multi‑protocol serial links and bridging functions.
• Industrial embedded controllers — Industrial temperature range and robust packaging make the device suitable for industrial control, I/O aggregation, and sensor interface applications.

Unique Advantages

• Substantial logic density: 196,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level complexity.
• On‑chip memory for efficient data handling: Approximately 1.74 Mbits of embedded RAM supports local buffering and high-throughput streaming without external memory for many use cases.
• Flexible I/O capacity: 208 I/O pins provide the ability to interface with a wide range of peripherals and parallel buses.
• Compact, manufacturable package: 324‑WLCSP (11×9) package supports compact board layouts and surface‑mount assembly workflows.
• Industrial operating range: −40°C to 100°C rating addresses temperature demands of industrial applications.
• Platform ecosystem: The device is part of the Avant platform, which includes architectural elements—programmable logic, memory, DSP, high‑speed PHYs and configuration/security features—documented at the series level to support system-level design choices.

Why Choose LAV-AT-E30-3ASG324I?

The LAV-AT-E30-3ASG324I positions itself as a high‑capacity, industrial‑grade FPGA option within the Lattice Avant platform. With 196,000 logic elements, approximately 1.74 Mbits of embedded memory, and 208 I/Os in a compact 324‑ball WLCSP/BGA package, it is suited to designers needing significant programmable logic and on‑chip resources in space‑constrained, industrial environments.

Its documented platform features—programmable functional units, sysMEM and sysDSP resources, programmable I/O cells, and series-level support for DDR PHYs and high‑speed serial interfaces—support scalable designs and system integration while maintaining compliance and manufacturability expectations for embedded applications.

Request a quote or submit a parts inquiry to receive pricing, lead time, and availability for the LAV-AT-E30-3ASG324I. Our team can provide the information you need to evaluate this device for your next design.