LAV-AT-E30-2CBG484I
| Part Description |
Avant™-E Field Programmable Gate Array (FPGA) IC 329 1740800 262000 484-BGA, FCCSPBGA |
|---|---|
| Quantity | 517 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCCSP (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA, FCCSPBGA | Number of I/O | 329 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 262000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-E30-2CBG484I – Avant™-E Field Programmable Gate Array (FPGA) IC 329 I/O, ~1.74 Mbits RAM, 262,000 Logic Elements, 484-FCCSP
The LAV-AT-E30-2CBG484I is an Avant™-E series FPGA from Lattice Semiconductor. It delivers a programmable logic fabric with 262,000 logic elements, approximately 1.74 Mbits of embedded RAM, and 329 user I/O, packaged in a 484-FCCSP (19×19) surface-mount package.
Built on the Lattice Avant platform, the device includes comprehensive on-chip resources for clocking, memory, DSP functions, high-speed PHY/serdes integration and flexible I/O. It is specified for industrial-grade operation from -40 °C to 100 °C and a supply voltage of 820 mV.
Key Features
- Logic Capacity 262,000 logic elements for implementing complex custom logic, protocol bridges and acceleration functions.
- Embedded Memory Approximately 1.74 Mbits of on-chip RAM (1,740,800 bits) supporting single, dual and pseudo-dual port modes, FIFO modes and memory cascading.
- I/O 329 programmable I/O pins with dedicated programmable I/O cell (PIC) architecture including input, output and tri-state register blocks.
- Clocking and Timing Comprehensive clocking features including on-chip oscillator, PLL, global and regional clocks, edge and PHY clocks, dynamic clock select/control and DLL delay elements.
- Memory and DSP Building Blocks sysMEM features for RAM initialization and ROM operation plus sysDSP resources for signal processing tasks.
- DDR and PHY Support DDR memory support with DDRPHY and DQS grouping for interfacing external memory devices.
- SERDES and PCS Integrated SERDES/PMA blocks and Multi-Protocol PCS/PHY integration for high-speed serial connectivity and protocol implementation.
- Device Configuration & Reliability Enhanced configuration options including JTAG and SEU handling, plus trace ID and device configuration features from the Avant platform.
- Package & Mounting 484-ball FCCSP package (19×19) in a surface-mount form factor suitable for compact, board-level integration.
- Industrial Temperature Range Rated for operation from -40 °C to 100 °C to meet industrial-environment temperature requirements.
- RoHS Compliant Manufactured in compliance with RoHS directives.
Typical Applications
- Industrial Automation Programmable logic and interface control in industrial systems, leveraging the device’s industrial temperature rating and high I/O count.
- Memory Interface and Controllers DDR memory PHY support and sysMEM features make the device suitable for custom memory controller and buffering functions.
- Protocol Bridging and Connectivity SERDES, PCS and flexible PICs enable implementation of custom serial protocols and bridging between interfaces.
- Embedded Signal Processing sysDSP and abundant logic elements support offloading real-time signal processing tasks from host processors.
Unique Advantages
- High Logic Density: 262,000 logic elements provide capacity for complex, integrated designs without external ASICs for many functions.
- Integrated Memory Resources: Approximately 1.74 Mbits of on-chip RAM with flexible modes (single/dual/pseudo-dual port, FIFO and cascading) reduces external memory needs for many designs.
- Extensive I/O and Programmability: 329 programmable I/O with dedicated input/output/tri-state register blocks simplifies mixed-signal and mixed-standards interfacing on a single device.
- Flexible Clocking and Timing: Multiple clocking primitives including PLLs, oscillators and dynamic clock control support complex timing architectures and synchronous designs.
- Package and Thermal Range for Industrial Use: 484-FCCSP surface-mount package combined with an operating range of -40 °C to 100 °C supports deployment in industrial environments.
- Platform-Level Features: Avant platform capabilities such as DDRPHY, SERDES/PCS, sysDSP and enhanced configuration options give designers a cohesive set of on-chip building blocks.
Why Choose LAV-AT-E30-2CBG484I?
The LAV-AT-E30-2CBG484I is positioned for designs that require a balance of logic capacity, embedded memory, extensive I/O and platform-level peripherals within an industrial-grade FPGA. Its combination of 262,000 logic elements, approximately 1.74 Mbits of RAM and 329 I/O pins enables integration of protocol handling, memory interfaces and signal processing on a single device.
Backed by the Lattice Avant platform documentation and configuration features, this FPGA suits customers building industrial systems, memory interface controllers, connectivity modules and DSP-accelerated designs that benefit from a compact 484-FCCSP packaging and an extended operating temperature range.
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