LAV-AT-E30-2CBG484I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 329 1740800 262000 484-BGA, FCCSPBGA

Quantity 517 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCCSP (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGA, FCCSPBGANumber of I/O329Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-E30-2CBG484I – Avant™-E Field Programmable Gate Array (FPGA) IC 329 I/O, ~1.74 Mbits RAM, 262,000 Logic Elements, 484-FCCSP

The LAV-AT-E30-2CBG484I is an Avant™-E series FPGA from Lattice Semiconductor. It delivers a programmable logic fabric with 262,000 logic elements, approximately 1.74 Mbits of embedded RAM, and 329 user I/O, packaged in a 484-FCCSP (19×19) surface-mount package.

Built on the Lattice Avant platform, the device includes comprehensive on-chip resources for clocking, memory, DSP functions, high-speed PHY/serdes integration and flexible I/O. It is specified for industrial-grade operation from -40 °C to 100 °C and a supply voltage of 820 mV.

Key Features

  • Logic Capacity  262,000 logic elements for implementing complex custom logic, protocol bridges and acceleration functions.
  • Embedded Memory  Approximately 1.74 Mbits of on-chip RAM (1,740,800 bits) supporting single, dual and pseudo-dual port modes, FIFO modes and memory cascading.
  • I/O  329 programmable I/O pins with dedicated programmable I/O cell (PIC) architecture including input, output and tri-state register blocks.
  • Clocking and Timing  Comprehensive clocking features including on-chip oscillator, PLL, global and regional clocks, edge and PHY clocks, dynamic clock select/control and DLL delay elements.
  • Memory and DSP Building Blocks  sysMEM features for RAM initialization and ROM operation plus sysDSP resources for signal processing tasks.
  • DDR and PHY Support  DDR memory support with DDRPHY and DQS grouping for interfacing external memory devices.
  • SERDES and PCS  Integrated SERDES/PMA blocks and Multi-Protocol PCS/PHY integration for high-speed serial connectivity and protocol implementation.
  • Device Configuration & Reliability  Enhanced configuration options including JTAG and SEU handling, plus trace ID and device configuration features from the Avant platform.
  • Package & Mounting  484-ball FCCSP package (19×19) in a surface-mount form factor suitable for compact, board-level integration.
  • Industrial Temperature Range  Rated for operation from -40 °C to 100 °C to meet industrial-environment temperature requirements.
  • RoHS Compliant  Manufactured in compliance with RoHS directives.

Typical Applications

  • Industrial Automation  Programmable logic and interface control in industrial systems, leveraging the device’s industrial temperature rating and high I/O count.
  • Memory Interface and Controllers  DDR memory PHY support and sysMEM features make the device suitable for custom memory controller and buffering functions.
  • Protocol Bridging and Connectivity  SERDES, PCS and flexible PICs enable implementation of custom serial protocols and bridging between interfaces.
  • Embedded Signal Processing  sysDSP and abundant logic elements support offloading real-time signal processing tasks from host processors.

Unique Advantages

  • High Logic Density: 262,000 logic elements provide capacity for complex, integrated designs without external ASICs for many functions.
  • Integrated Memory Resources: Approximately 1.74 Mbits of on-chip RAM with flexible modes (single/dual/pseudo-dual port, FIFO and cascading) reduces external memory needs for many designs.
  • Extensive I/O and Programmability: 329 programmable I/O with dedicated input/output/tri-state register blocks simplifies mixed-signal and mixed-standards interfacing on a single device.
  • Flexible Clocking and Timing: Multiple clocking primitives including PLLs, oscillators and dynamic clock control support complex timing architectures and synchronous designs.
  • Package and Thermal Range for Industrial Use: 484-FCCSP surface-mount package combined with an operating range of -40 °C to 100 °C supports deployment in industrial environments.
  • Platform-Level Features: Avant platform capabilities such as DDRPHY, SERDES/PCS, sysDSP and enhanced configuration options give designers a cohesive set of on-chip building blocks.

Why Choose LAV-AT-E30-2CBG484I?

The LAV-AT-E30-2CBG484I is positioned for designs that require a balance of logic capacity, embedded memory, extensive I/O and platform-level peripherals within an industrial-grade FPGA. Its combination of 262,000 logic elements, approximately 1.74 Mbits of RAM and 329 I/O pins enables integration of protocol handling, memory interfaces and signal processing on a single device.

Backed by the Lattice Avant platform documentation and configuration features, this FPGA suits customers building industrial systems, memory interface controllers, connectivity modules and DSP-accelerated designs that benefit from a compact 484-FCCSP packaging and an extended operating temperature range.

Request a quote or submit a purchasing inquiry to get pricing and lead-time information for the LAV-AT-E30-2CBG484I.

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