LAV-AT-E30-2LFG676I

The LAV-AT-E30-2LFG676I is an Avant™-E platform field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It delivers a large fabric of programmable logic and embedded memory in a high-density 676-FCBGA package suitable for surface-mount assembly.

Built on the Lattice Avant platform architecture, the device includes programmable functional units, extensive I/O resources and platform-level blocks referenced in the product datasheet, providing a foundation for high-speed I/O, memory interfaces, and DSP-oriented functions in industrial applications.

Key Features

• Core Logic — 196,000 logic element cells for implementing complex programmable logic and custom hardware functions.
• Embedded Memory — Approximately 1.74 Mbits of on-chip RAM to support buffers, FIFOs, and local memory for datapaths and control structures.
• I/O Capacity — 312 programmable I/Os to interface with sensors, memory, peripherals and high-speed transceivers.
• Platform Capabilities — Based on the Lattice Avant platform with architecture blocks described in the datasheet, including programmable functional units (PFUs), programmable I/O (PIO), sysMEM, sysDSP, DDR memory support, SerDes/PCS and PCIe-related blocks.
• Package & Mounting — 676-FCBGA (27 × 27 mm) package in a surface-mount form factor for compact board layouts and high pin-count connectivity.
• Power — Supply voltage specified at 820 mV for the core domain as listed in the product data.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Compliance — RoHS-compliant for global environmental requirements.

Typical Applications

• High-speed serial and protocol bridging — Leverages platform SerDes and PCIe-related blocks for protocol interfacing and data transport tasks.
• Memory interface and buffering — DDR memory support and abundant on-chip RAM enable memory controller, buffering and data staging functions.
• DSP and acceleration — sysDSP and the high logic element count support compute acceleration, filtering and signal processing pipelines.
• I/O-dense control and interface — Large I/O count and programmable I/O cells for complex peripheral aggregation, sensor interfaces and protocol conversion.

Unique Advantages

• High logic density: 196,000 logic elements provide capacity for substantial custom logic integration on a single device, reducing external components.
• Embedded memory for on-chip buffering: Approximately 1.74 Mbits of RAM supports local data storage, minimizing external memory bandwidth for many use cases.
• Rich I/O and platform blocks: 312 I/Os combined with Avant platform features (PIO, DDR support, SerDes/PCS and sysDSP) simplify implementation of high-performance interfaces and datapaths.
• Industrial temperature operation: −40 °C to 100 °C rating enables deployment in thermally demanding environments.
• Compact, high-pin-count package: 676-FCBGA (27 × 27 mm) offers a balance of size and pin count for dense designs.
• Environmental compliance: RoHS status confirms adherence to common material restrictions.

Why Choose LAV-AT-E30-2LFG676I?

The LAV-AT-E30-2LFG676I positions itself as a high-capacity, industrial-temperature FPGA option within the Lattice Avant platform family. Its combination of 196,000 logic elements, substantial on-chip RAM and 312 I/Os supports integration of complex interfaces, DSP acceleration and memory-intensive functions in a single, compact package.

This device is suited to engineers designing systems that require a balance of programmable logic density, embedded memory and platform-level capabilities described in the Avant™-E datasheet, while maintaining industrial temperature performance and RoHS compliance.

Request a quote or submit a pricing and availability inquiry to evaluate the LAV-AT-E30-2LFG676I for your next design.