LAV-AT-E30-2CBG484C

The LAV-AT-E30-2CBG484C is an Avant™-E Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation provided in a 484‑FCCSP (19×19) package. The device integrates 262,000 logic elements, approximately 1.74 Mbits of on‑chip RAM, and 329 I/O pins in a surface‑mount BGA form factor for compact system designs.

Architected as part of the Lattice Avant platform, the device includes programmable functional unit blocks, an advanced clocking structure, sysMEM memory blocks, sysDSP capabilities, programmable I/O cells, DDRPHY support and SERDES/PMA elements as described in the platform overview. It is offered as a commercial‑grade device with a specified operating range of 0 °C to 85 °C and RoHS compliance.

Key Features

• Logic Capacity — 262,000 logic elements for implementing complex programmable logic, control functions and custom acceleration.
• Embedded Memory — Approximately 1.74 Mbits of on‑chip RAM (1,740,800 bits) suitable for buffering, FIFOs and local data storage.
• I/O Density — 329 general‑purpose I/O pins supporting flexible interfacing and high‑density connectivity.
• Clocking and Timing — Platform‑level clocking architecture with on‑chip oscillator, PLLs, global and regional clocks, dynamic clock control and clock synchronizers as part of the Avant architecture.
• High‑Speed Interfaces — Device architecture includes SERDES/PMA blocks and DDRPHY support for high‑speed serial links and memory interfaces (as described in the Avant platform overview).
• Programmable I/O Cells — Programmable I/O cell (PIC) structure and sysI/O banking scheme enabling multiple I/O standards and flexible I/O register options.
• Package and Mounting — 484‑FCCSP (19×19) / 484‑BGA, surface‑mount package for dense board layouts and compact designs.
• Power and Supply — Specified supply voltage at 820 mV; consult platform documentation for detailed power sequencing and domain information.
• Commercial Grade & Compliance — Commercial grade device with operating temperature 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Custom Logic and Acceleration — Implement state machines, protocol offloads and application‑specific accelerators using the 262,000 logic elements and sysDSP blocks.
• Memory‑Centric Designs — Use approximately 1.74 Mbits of embedded memory and sysMEM FIFO modes for buffering, packet queues and data stream handling.
• High‑Density I/O Bridging — Utilize 329 I/O pins and programmable I/O cells for protocol bridging, multi‑lane interfaces and board‑level aggregation.
• High‑Speed Interfaces & Memory Controllers — Leverage DDRPHY and SERDES/PMA elements described in the Avant platform for serial links and external memory interfacing.

Unique Advantages

• Significant Logic Capacity: 262,000 logic elements provide room for complex designs and multiple concurrent functions without external offload.
• On‑Chip Memory for Low Latency: Approximately 1.74 Mbits of embedded RAM supports local buffering and reduces dependence on external memory for many use cases.
• High I/O Count: 329 I/O pins enable versatile board interfacing, sensor aggregation and peripheral control in compact systems.
• Avant Platform Architecture: Integrated PFU blocks, advanced clocking, sysMEM and sysDSP capabilities provide a cohesive architecture for timing, memory and signal processing tasks.
• Compact, Surface‑Mount Package: 484‑FCCSP (19×19) BGA offers a dense footprint for space‑constrained applications.
• Commercial‑Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose LAV-AT-E30-2CBG484C?

The LAV-AT-E30-2CBG484C brings a balanced combination of logic capacity, embedded memory and high I/O density in a compact 484‑FCCSP package. As part of the Avant platform, it exposes architecture elements—such as programmable functional units, sysMEM, sysDSP, DDRPHY and SERDES—that make it suitable for designs requiring integrated timing, memory and high‑speed interface capabilities within a commercial temperature range.

This device is well suited for engineering teams deploying advanced FPGA‑based subsystems that need a high logic count and flexible I/O in a surface‑mount BGA package, while adhering to commercial‑grade environmental limits and RoHS compliance.

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