LAV-AT-E30-3ASG410C
| Part Description |
Avant™-E Field Programmable Gate Array (FPGA) IC 247 1740800 262000 410-BGA, WLCSP |
|---|---|
| Quantity | 1,066 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 410-WLCSP (11x9) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 410-BGA, WLCSP | Number of I/O | 247 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 262000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-E30-3ASG410C – Avant™-E Field Programmable Gate Array (FPGA) IC, 410-WLCSP (11×9)
The LAV-AT-E30-3ASG410C is an Avant™-E Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor designed for commercial-grade embedded designs. This device delivers a high-density programmable logic fabric with 262,000 logic elements and approximately 1.74 Mbits of embedded memory to implement complex custom logic, protocol bridging, and interface functions.
With 247 user I/Os, a compact 410-WLCSP (11×9) package, and a documented supply voltage of 820 mV, the part targets space-constrained commercial applications that require significant I/O density and on-chip memory in a surface-mount form factor. Operating range is specified for 0 °C to 85 °C, and the device is RoHS compliant.
Key Features
- Core Logic Density — 262,000 logic elements for complex programmable logic implementations and high integration of custom functions.
- Embedded Memory — Approximately 1.74 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage without external memory.
- High I/O Count — 247 user I/Os to support multiple parallel interfaces, sensor arrays, and mixed-signal front-ends requiring numerous connections.
- Package & Mounting — 410-BGA, WLCSP package (supplier device package: 410-WLCSP (11×9)) in a surface-mount configuration for compact board layouts.
- Power — Documented supply voltage of 820 mV, enabling designs that follow the platform’s specified power domains.
- Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C suitable for standard commercial applications.
- Standards & Compliance — RoHS compliant for environmental and regulatory conformity in commercial products.
- Platform-Level Capabilities (per Avant Platform datasheet) — The Avant platform documentation cites advanced on-chip features such as sysCLOCK PLLs, internal oscillators, and hardened PCIe characteristics at a range of link rates, enabling scalable system-level integration when leveraging platform resources.
Typical Applications
- Commercial Embedded Systems: Implement custom control logic and protocol handling in compact commercial products within the 0 °C to 85 °C operating range.
- Interface Bridging & Connectivity: Use the device’s 247 I/Os and embedded memory to bridge multiple interfaces or aggregate sensor and peripheral data streams.
- Compact, High-Density Designs: The 410-WLCSP (11×9) package and surface-mount mounting support small-form-factor boards and space-constrained consumer or commercial electronics.
- FPGA-Based Prototyping & System Integration: Leverage the large logic fabric and on-chip RAM to prototype complex digital subsystems and integrate them into commercial products.
Unique Advantages
- High Logic Capacity: 262,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
- Substantial On-Chip Memory: Approximately 1.74 Mbits of embedded RAM reduces dependence on external memory and lowers overall system complexity.
- Extensive I/O: 247 user I/Os accommodate dense interface requirements and simplify board routing for multi‑port or multi‑sensor applications.
- Compact Packaging: 410-WLCSP (11×9) in a surface-mount form factor enables compact PCB layouts for space-sensitive designs.
- Commercial-Grade Reliability: Designed and specified for commercial temperature ranges (0 °C to 85 °C) and RoHS compliance for mainstream product deployment.
- Platform-Level Integration: Avant Platform documentation provides advanced timing, PLL, oscillator and PCIe characteristic details that support system-level design decisions.
Why Choose LAV-AT-E30-3ASG410C?
The LAV-AT-E30-3ASG410C positions itself as a high-density, commercially graded FPGA solution for designers needing extensive logic, memory, and I/O in a compact package. Its combination of 262,000 logic elements, approximately 1.74 Mbits of embedded memory, and 247 I/Os enables integration of complex digital functions while reducing external component count and board complexity.
Ideal for commercial embedded designs, interface-rich modules, and compact system prototypes, this Avant™-E device offers a documented platform-level feature set and a small 410-WLCSP footprint that supports space-constrained implementations while adhering to RoHS environmental requirements.
Request a quote or contact sales to check availability, lead times, and to discuss how LAV-AT-E30-3ASG410C can meet your project requirements.