LAV-AT-E30-3ASG410C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 247 1740800 262000 410-BGA, WLCSP

Quantity 1,066 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package410-WLCSP (11x9)GradeCommercialOperating Temperature0°C – 85°C
Package / Case410-BGA, WLCSPNumber of I/O247Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-E30-3ASG410C – Avant™-E Field Programmable Gate Array (FPGA) IC, 410-WLCSP (11×9)

The LAV-AT-E30-3ASG410C is an Avant™-E Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor designed for commercial-grade embedded designs. This device delivers a high-density programmable logic fabric with 262,000 logic elements and approximately 1.74 Mbits of embedded memory to implement complex custom logic, protocol bridging, and interface functions.

With 247 user I/Os, a compact 410-WLCSP (11×9) package, and a documented supply voltage of 820 mV, the part targets space-constrained commercial applications that require significant I/O density and on-chip memory in a surface-mount form factor. Operating range is specified for 0 °C to 85 °C, and the device is RoHS compliant.

Key Features

  • Core Logic Density — 262,000 logic elements for complex programmable logic implementations and high integration of custom functions.
  • Embedded Memory — Approximately 1.74 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage without external memory.
  • High I/O Count — 247 user I/Os to support multiple parallel interfaces, sensor arrays, and mixed-signal front-ends requiring numerous connections.
  • Package & Mounting — 410-BGA, WLCSP package (supplier device package: 410-WLCSP (11×9)) in a surface-mount configuration for compact board layouts.
  • Power — Documented supply voltage of 820 mV, enabling designs that follow the platform’s specified power domains.
  • Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C suitable for standard commercial applications.
  • Standards & Compliance — RoHS compliant for environmental and regulatory conformity in commercial products.
  • Platform-Level Capabilities (per Avant Platform datasheet) — The Avant platform documentation cites advanced on-chip features such as sysCLOCK PLLs, internal oscillators, and hardened PCIe characteristics at a range of link rates, enabling scalable system-level integration when leveraging platform resources.

Typical Applications

  • Commercial Embedded Systems: Implement custom control logic and protocol handling in compact commercial products within the 0 °C to 85 °C operating range.
  • Interface Bridging & Connectivity: Use the device’s 247 I/Os and embedded memory to bridge multiple interfaces or aggregate sensor and peripheral data streams.
  • Compact, High-Density Designs: The 410-WLCSP (11×9) package and surface-mount mounting support small-form-factor boards and space-constrained consumer or commercial electronics.
  • FPGA-Based Prototyping & System Integration: Leverage the large logic fabric and on-chip RAM to prototype complex digital subsystems and integrate them into commercial products.

Unique Advantages

  • High Logic Capacity: 262,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
  • Substantial On-Chip Memory: Approximately 1.74 Mbits of embedded RAM reduces dependence on external memory and lowers overall system complexity.
  • Extensive I/O: 247 user I/Os accommodate dense interface requirements and simplify board routing for multi‑port or multi‑sensor applications.
  • Compact Packaging: 410-WLCSP (11×9) in a surface-mount form factor enables compact PCB layouts for space-sensitive designs.
  • Commercial-Grade Reliability: Designed and specified for commercial temperature ranges (0 °C to 85 °C) and RoHS compliance for mainstream product deployment.
  • Platform-Level Integration: Avant Platform documentation provides advanced timing, PLL, oscillator and PCIe characteristic details that support system-level design decisions.

Why Choose LAV-AT-E30-3ASG410C?

The LAV-AT-E30-3ASG410C positions itself as a high-density, commercially graded FPGA solution for designers needing extensive logic, memory, and I/O in a compact package. Its combination of 262,000 logic elements, approximately 1.74 Mbits of embedded memory, and 247 I/Os enables integration of complex digital functions while reducing external component count and board complexity.

Ideal for commercial embedded designs, interface-rich modules, and compact system prototypes, this Avant™-E device offers a documented platform-level feature set and a small 410-WLCSP footprint that supports space-constrained implementations while adhering to RoHS environmental requirements.

Request a quote or contact sales to check availability, lead times, and to discuss how LAV-AT-E30-3ASG410C can meet your project requirements.

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