LAV-AT-E30-3CBG484C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-E Field Programmable Gate Array (FPGA) IC 329 1740800 262000 484-BGA, FCCSPBGA

Quantity 940 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCCSP (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGA, FCCSPBGANumber of I/O329Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-E30-3CBG484C – Avant™-E Field Programmable Gate Array (FPGA)

The LAV-AT-E30-3CBG484C is an Avant™-E FPGA IC from Lattice Semiconductor Corporation, delivered in a 484-ball FCCSP/BGA package. It combines programmable logic, embedded memory, and extensive I/O to address commercial embedded designs that require configurable logic, on-chip memory resources, and flexible interface support.

Architecturally aligned with the Avant platform, the device provides programmable functional units, clocking and PLL structures, sysMEM and sysDSP resources, programmable I/O cells, and DDR memory support as described in the platform overview. It is targeted at commercial applications that benefit from integrated logic density and interface versatility.

Key Features

  • Logic Capacity — 262,000 logic elements, enabling substantial programmable logic for complex custom functions and hardware-accelerated tasks.
  • Embedded Memory — Approximately 1.74 Mbits of on-chip RAM (1,740,800 bits) to support data buffering, FIFOs, and tightly coupled storage for DSP or control logic.
  • Rich I/O — 329 general-purpose I/O pins suitable for multi-bank signaling and diverse interface requirements.
  • Clocking and Timing — Built-in clocking architecture including on-chip oscillator, PLLs, global and regional clocks, dynamic clock control, and delay elements as outlined in the Avant platform overview.
  • Memory and DSP Support — sysMEM blocks with single/dual/pseudo-dual port and FIFO modes plus sysDSP resources for arithmetic and signal-processing tasks.
  • High-speed Interfaces — Platform-level support for DDR memory PHY and SERDES/PCS functionality for high-throughput link implementations.
  • Package & Mounting — Surface-mount 484-BGA / 484-FCCSP (19×19) package offering a compact footprint for board-level integration.
  • Power & Supply — Supply specified in product data as 820 mV (listed as 820 mV to 820 mV).
  • Operating Range & Compliance — Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS-compliant status.

Typical Applications

  • Connectivity and Communications — Implement protocol translation, interface bridging, and high-speed I/O functions using the device’s SERDES and programmable I/O resources.
  • Signal Processing — Deploy sysDSP and embedded memory for filtering, aggregation, and other DSP workloads in commercial signal-processing equipment.
  • Memory-Buffered Systems — Use on-chip sysMEM and DDR PHY support for designs that require local buffering, FIFOs, and memory-matched data paths.
  • Embedded Control and Logic Integration — Replace or augment discrete logic in commercial embedded systems with configurable logic and dense I/O to reduce component count and increase flexibility.

Unique Advantages

  • Substantial Logic Density: 262,000 logic elements provide room to implement complex state machines, custom accelerators, and glue logic in a single device.
  • On-Chip Memory for Low-Latency Design: Approximately 1.74 Mbits of embedded RAM reduces external memory dependence for buffering and control structures.
  • Comprehensive Clocking Infrastructure: Multiple clocking resources (on-chip oscillator, PLLs, global/regional clocks) simplify timing architecture and dynamic clock schemes.
  • Flexible I/O and Interface Support: 329 I/Os and platform-level DDR and SERDES support allow broad connectivity options for heterogeneous systems.
  • Compact, Surface-Mount Package: The 484-FCCSP/BGA (19×19) package enables high density board integration while maintaining a robust pinout for signals and power.
  • Commercial Grade and RoHS Compliant: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.

Why Choose LAV-AT-E30-3CBG484C?

The LAV-AT-E30-3CBG484C positions itself as a commercial-grade, platform-aligned FPGA that balances high logic capacity with embedded memory and extensive I/O. It is well suited for designers who need integrated programmable logic, DSP capability, and memory interfacing in a compact surface-mount package.

For commercial embedded system designers and integrators, this Avant™-E device supports scalable architectures that consolidate discrete functions into programmable hardware, helping to simplify BOMs and accelerate time-to-market while leveraging the architectural features detailed in the Avant platform documentation.

Request a quote or submit a parts inquiry to obtain pricing and availability for the LAV-AT-E30-3CBG484C.

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