LAV-AT-E30-3CBG484C
| Part Description |
Avant™-E Field Programmable Gate Array (FPGA) IC 329 1740800 262000 484-BGA, FCCSPBGA |
|---|---|
| Quantity | 940 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCCSP (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA, FCCSPBGA | Number of I/O | 329 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 262000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-E30-3CBG484C – Avant™-E Field Programmable Gate Array (FPGA)
The LAV-AT-E30-3CBG484C is an Avant™-E FPGA IC from Lattice Semiconductor Corporation, delivered in a 484-ball FCCSP/BGA package. It combines programmable logic, embedded memory, and extensive I/O to address commercial embedded designs that require configurable logic, on-chip memory resources, and flexible interface support.
Architecturally aligned with the Avant platform, the device provides programmable functional units, clocking and PLL structures, sysMEM and sysDSP resources, programmable I/O cells, and DDR memory support as described in the platform overview. It is targeted at commercial applications that benefit from integrated logic density and interface versatility.
Key Features
- Logic Capacity — 262,000 logic elements, enabling substantial programmable logic for complex custom functions and hardware-accelerated tasks.
- Embedded Memory — Approximately 1.74 Mbits of on-chip RAM (1,740,800 bits) to support data buffering, FIFOs, and tightly coupled storage for DSP or control logic.
- Rich I/O — 329 general-purpose I/O pins suitable for multi-bank signaling and diverse interface requirements.
- Clocking and Timing — Built-in clocking architecture including on-chip oscillator, PLLs, global and regional clocks, dynamic clock control, and delay elements as outlined in the Avant platform overview.
- Memory and DSP Support — sysMEM blocks with single/dual/pseudo-dual port and FIFO modes plus sysDSP resources for arithmetic and signal-processing tasks.
- High-speed Interfaces — Platform-level support for DDR memory PHY and SERDES/PCS functionality for high-throughput link implementations.
- Package & Mounting — Surface-mount 484-BGA / 484-FCCSP (19×19) package offering a compact footprint for board-level integration.
- Power & Supply — Supply specified in product data as 820 mV (listed as 820 mV to 820 mV).
- Operating Range & Compliance — Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS-compliant status.
Typical Applications
- Connectivity and Communications — Implement protocol translation, interface bridging, and high-speed I/O functions using the device’s SERDES and programmable I/O resources.
- Signal Processing — Deploy sysDSP and embedded memory for filtering, aggregation, and other DSP workloads in commercial signal-processing equipment.
- Memory-Buffered Systems — Use on-chip sysMEM and DDR PHY support for designs that require local buffering, FIFOs, and memory-matched data paths.
- Embedded Control and Logic Integration — Replace or augment discrete logic in commercial embedded systems with configurable logic and dense I/O to reduce component count and increase flexibility.
Unique Advantages
- Substantial Logic Density: 262,000 logic elements provide room to implement complex state machines, custom accelerators, and glue logic in a single device.
- On-Chip Memory for Low-Latency Design: Approximately 1.74 Mbits of embedded RAM reduces external memory dependence for buffering and control structures.
- Comprehensive Clocking Infrastructure: Multiple clocking resources (on-chip oscillator, PLLs, global/regional clocks) simplify timing architecture and dynamic clock schemes.
- Flexible I/O and Interface Support: 329 I/Os and platform-level DDR and SERDES support allow broad connectivity options for heterogeneous systems.
- Compact, Surface-Mount Package: The 484-FCCSP/BGA (19×19) package enables high density board integration while maintaining a robust pinout for signals and power.
- Commercial Grade and RoHS Compliant: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
Why Choose LAV-AT-E30-3CBG484C?
The LAV-AT-E30-3CBG484C positions itself as a commercial-grade, platform-aligned FPGA that balances high logic capacity with embedded memory and extensive I/O. It is well suited for designers who need integrated programmable logic, DSP capability, and memory interfacing in a compact surface-mount package.
For commercial embedded system designers and integrators, this Avant™-E device supports scalable architectures that consolidate discrete functions into programmable hardware, helping to simplify BOMs and accelerate time-to-market while leveraging the architectural features detailed in the Avant platform documentation.
Request a quote or submit a parts inquiry to obtain pricing and availability for the LAV-AT-E30-3CBG484C.