LAV-AT-G30-1LFG676C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-G Field Programmable Gate Array (FPGA) IC 298 1740800 262000 676-BBGA, FCBGA

Quantity 823 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O298Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-G30-1LFG676C – Avant™-G Field Programmable Gate Array (FPGA), 262000 logic elements, 676-FCBGA

The LAV-AT-G30-1LFG676C is an Avant™-G series FPGA from Lattice Semiconductor Corporation built on the Lattice Avant platform architecture. It integrates a high-density programmable fabric with on-chip memory and a broad set of architectural building blocks defined in the Avant platform overview.

Designed for commercial-grade embedded systems, this surface-mount FCBGA device delivers 262000 logic elements, approximately 1.74 Mbits of embedded memory, and 298 general-purpose I/Os in a 676-FCBGA (27×27) package, enabling complex logic, memory, and I/O integration in a compact form factor.

Key Features

  • Core Logic Density — 262000 logic elements to implement complex programmable logic and custom data paths.
  • Embedded Memory — Approximately 1.74 Mbits of on-chip RAM (1,740,800 bits) for local buffering, FIFOs, and tightly coupled memory structures.
  • I/O Capacity — 298 I/O pins to support broad peripheral connectivity and multi-bank I/O implementations.
  • Avant Platform Architecture — Architecture blocks described in the Avant overview including PFU (Programmable Functional Unit) blocks, slices, routing resources, and sysDSP blocks for arithmetic acceleration.
  • Clocking and Timing — Integrated clocking capabilities referenced in the platform documentation such as on-chip oscillator, PLLs, global and regional clocks, dynamic clock control, and DLL delay elements for flexible timing topologies.
  • Memory and PHY Support — Platform-level features include sysMEM memory modes, DDR memory support with DDRPHY and DQS grouping, and memory cascade/port modes for varied memory architectures.
  • High-speed Serial and PHY — Architectural support for SERDES/PMA blocks and Multi-Protocol PCS/PHY integration as described in the Avant platform overview.
  • Package and Mounting — 676-BBGA / 676-FCBGA (27×27) surface-mount package suitable for compact board-level designs.
  • Electrical and Environmental — Specified voltage supply entry of 820 mV and commercial operating temperature range of 0°C to 85°C; RoHS compliant.

Typical Applications

  • High-performance control and data-path acceleration — Use the device’s logic density and sysDSP architecture blocks to offload computational tasks and implement real-time data processing.
  • Memory interface and buffering — Leverage on-chip sysMEM features and DDRPHY support for memory bridging, buffering, and FIFO implementations.
  • High-speed serial connectivity — Implement SERDES/PMA and PCS-based interfaces for multi-protocol serial links and protocol bridging.
  • Embedded system integration — Combine logic, RAM, and a large I/O count to consolidate multiple functions onto a single FPGA in compact commercial devices.

Unique Advantages

  • High logic capacity: 262000 logic elements provide the headroom needed for complex FPGA designs and integration of multiple subsystems on a single device.
  • Integrated on-chip memory: Approximately 1.74 Mbits of embedded RAM reduces external memory dependence for many buffering and storage needs.
  • Extensive I/O: 298 I/Os enable flexible interfacing with peripherals, sensors, and external memory banks without immediate need for additional multiplexing logic.
  • Platform-level architecture: The Avant platform includes programmable functional units, sysDSP, and routing/clocking structures that support diverse architectural strategies and timing topologies.
  • Compact FCBGA package: The 676-FCBGA (27×27) package balances high pin count with a compact footprint for space-constrained boards.
  • Commercial deployment ready: Surface-mount mounting and a 0°C to 85°C operating range align with typical commercial embedded product requirements and RoHS compliance.

Why Choose LAV-AT-G30-1LFG676C?

The LAV-AT-G30-1LFG676C positions itself as a high-density, commercially graded FPGA option within the Lattice Avant platform family. Its balance of logic elements, embedded memory, and a large I/O complement makes it suitable for designs that require significant on-chip resources and flexible interfacing in a compact FCBGA package.

Engineers targeting embedded control, memory interface logic, or high-speed serial applications can leverage the Avant platform architecture—documented with features such as PLLs, on-chip oscillators, sysMEM modes, DDRPHY support, sysDSP blocks, and SERDES/PCS resources—to implement targeted solutions while keeping system integration compact and manageable.

Request a quote or submit a procurement inquiry to receive pricing and availability information for LAV-AT-G30-1LFG676C. Our team can provide detailed ordering guidance and assist with part selection for your design needs.

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