LAV-AT-G30-2ASG410I

The LAV-AT-G30-2ASG410I is an Avant™-G FPGA device offering a programmable fabric for custom logic, embedded memory, and flexible I/O in a compact 410-ball WLCSP package. The device architecture includes programmable functional units, dedicated sysMEM and sysDSP resources, and advanced clocking and SERDES/PHY building blocks, making it suitable for industrial embedded applications that require configurable logic and system integration.

Key hardware attributes include 262,000 logic elements, approximately 1.74 Mbits of embedded memory, 196 I/O pins, a supply voltage of 820 mV, and an operating temperature range of –40 °C to 100 °C. The device is RoHS compliant and supplied in a 410-WLCSP (11×9) package for surface-mount assembly.

Key Features

• Logic Capacity  262,000 logic elements provide the programmable fabric for implementing custom digital logic and control functions.
• Embedded Memory (sysMEM)  Approximately 1.74 Mbits of on-chip RAM with support for single, dual and pseudo-dual port modes, memory cascading, FIFO modes, and RAM initialization/ROM operation.
• Programmable DSP (sysDSP)  Dedicated sysDSP resources for arithmetic and signal-processing blocks are included in the device architecture.
• Programmable I/O (PIO) and PIC  196 I/Os with a programmable I/O banking scheme and programmable I/O cell structure that includes input, output and tri-state register blocks; multiple I/O standards are supported per the device architecture.
• Clocking and Timing  On-chip oscillator and PLL support, with hierarchical clock resources including global, regional and edge clocks, plus dynamic clock select/control and DLL delay features for flexible clock distribution.
• SERDES and PHY Integration  Architecture includes SERDES and PCS blocks as well as PMA elements and multi-protocol PCS/PHY integration for high-speed serial interfaces.
• Device Configuration and Reliability  Enhanced configuration options are provided along with JTAG support and Single Event Upset (SEU) handling mechanisms described in the device documentation.
• Package and Environmental  410-BGA WLCSP package (410-WLCSP, 11×9) for surface-mount assembly; industrial-grade operating temperature of –40 °C to 100 °C and RoHS compliance.
• Power Supply  Specified voltage supply of 820 mV for the device core.

Typical Applications

• Industrial Control  Implement custom control logic, signal aggregation, and interface bridging in industrial systems operating across –40 °C to 100 °C.
• Data Path Acceleration  Use the device’s logic elements, sysDSP resources, and embedded memory to accelerate data-path functions and custom packet processing.
• High-Speed Serial Interfaces  Deploy SERDES/PMA and PCS building blocks to implement multi-protocol serial links or PHY integration in compact system designs.
• Embedded System Integration  Consolidate glue logic, peripheral interfaces and on-chip memory functions into a single programmable device to reduce board-level complexity.

Unique Advantages

• Significant Logic Density: 262,000 logic elements enable large-scale custom logic integration without relying on multiple discrete devices.
• Integrated Memory Resources: Approximately 1.74 Mbits of sysMEM with flexible porting and FIFO modes simplifies buffering and state storage within the FPGA fabric.
• Comprehensive Clocking Toolkit: On-chip oscillator, PLLs and multiple clock domains (global, regional, edge) provide designers with granular timing control for complex systems.
• Flexible I/O and Packaging: 196 programmable I/Os in a 410-WLCSP (11×9) package allow dense board layouts and support a variety of I/O standards through the programmable I/O cell architecture.
• Built for Industrial Environments: Industrial-grade temperature range (–40 °C to 100 °C) and RoHS compliance support deployment in a wide range of embedded applications.
• On-chip High-speed Interface Support: SERDES, PCS and multi-protocol PHY blocks enable integration of high-speed serial links within the same device architecture.

Why Choose LAV-AT-G30-2ASG410I?

The LAV-AT-G30-2ASG410I combines a substantial logic element count, embedded memory, programmable DSP resources, and a rich set of clocking and I/O capabilities in a compact 410-ball WLCSP package. This combination supports complex embedded designs that require on-chip memory, DSP acceleration, and configurable high-speed interfaces while maintaining the thermal and environmental margins expected for industrial deployments.

Designed for engineers and system designers who need scalability and integration, this Avant™-G FPGA targets applications where consolidating logic, memory, and interface functions into a single FPGA reduces BOM and simplifies board-level design. The device documentation provides detailed architecture and configuration guidance to support integration into production designs.

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