LAV-AT-G30-3ASG410I

The LAV-AT-G30-3ASG410I is an Avant™-G field programmable gate array (FPGA) in a 410-BGA/WLCSP supplier package intended for surface-mount applications. It provides 262000 logic elements, approximately 1.74 Mbits of embedded memory, and 196 I/O pins, and is specified for industrial-grade operation from -40 °C to 100 °C.

This device implements the Lattice Avant platform architecture and includes on-chip subsystems described in the platform overview—such as programmable functional units, configurable routing and clocking resources, memory and DSP blocks, and high-speed I/O and PHY features—enabling it for complex embedded logic, memory interfacing and I/O‑heavy designs in industrial environments.

Key Features

• Core Logic Capacity — 262000 logic elements for implementing large-scale programmable logic functions and custom fabric-based processing.
• Embedded Memory — 1,740,800 total RAM bits (approximately 1.74 Mbits) suitable for on-chip buffers, FIFOs and scratch memory.
• I/O and Packaging — 196 configurable I/O pins in a 410-BGA, WLCSP supplier package (410-WLCSP, 11×9); surface-mount mounting type for compact board designs.
• Industrial Temperature Grade — Specified operating range from -40 °C to 100 °C for deployment in industrial temperature environments.
• Supply Voltage — Device supply specified at 820 mV.
• Clocking and Timing — Platform includes on-chip oscillator and PLL support, plus hierarchical clock domains: Global Clock (GCLK), Regional Clock (RCLK), Edge Clock (ECLK), PHYCLK, dynamic clock select/control and DLL delay features.
• Memory Subsystem (sysMEM) — sysMEM supports bus-size matching, RAM initialization/ROM operation, memory cascading, single/dual/pseudo-dual port modes, FIFO modes and memory output reset.
• DSP Resources (sysDSP) — Dedicated DSP resources on the Avant platform for signal processing workloads (platform-level capability referenced in the datasheet).
• Programmable I/O — Programmable I/O cells (PIC) with input, output and tri-state register blocks and a documented banking scheme and supported I/O standards.
• High-Speed Interfaces — Platform-level SERDES/PMA blocks, Multi-Protocol PCS and DDRPHY support for DDR memory interfaces and multi-protocol PHY integration.
• Configuration and Reliability — Enhanced configuration options, JTAG support and Single Event Upset (SEU) handling mechanisms described in the platform documentation.
• RoHS Compliant — Device is RoHS compliant.

Typical Applications

• Industrial Control and Automation — Use the device's industrial temperature rating, plentiful I/O and on-chip memory for motor control logic, factory automation controllers and sensor aggregation.
• Embedded Processing and Acceleration — Implement custom data-paths and DSP functions using the platform’s sysDSP resources and abundant logic elements for real-time processing and hardware acceleration.
• Memory Interface and Buffering — Leverage sysMEM features and DDRPHY support for on-board memory controllers, buffering and FIFO-based data handling.
• High-Speed Connectivity — Deploy SERDES/PMA and multi-protocol PHY capabilities for high-speed serial links and protocol bridging in communication equipment.

Unique Advantages

• Significant Logic Density: 262000 logic elements enable implementation of sizable custom logic and complex state machines without immediate external ASIC support.
• On-Chip Memory Flexibility: Approximately 1.74 Mbits of embedded memory with support for single, dual and pseudo-dual port modes and FIFO operation simplifies buffer and memory architecture.
• Comprehensive Clocking: Built-in oscillator, PLLs and multiple clock domain primitives (GCLK, RCLK, ECLK, PHYCLK) allow flexible timing architectures and dynamic clock management.
• Broad I/O and High-Speed PHYs: 196 I/O pins and platform SERDES/DDRPHY capabilities support dense external interfacing and high-speed memory/serial protocols.
• Industrial Temperature Support: Rated from -40 °C to 100 °C for use in industrial applications requiring extended temperature operation.
• Compact Package Options: 410-WLCSP (11×9) supplier package supports space-constrained PCB designs while providing extensive I/O.

Why Choose LAV-AT-G30-3ASG410I?

The LAV-AT-G30-3ASG410I combines a high logic element count, flexible embedded memory and extensive I/O in a compact 410-WLCSP package targeted at industrial-grade designs. Its Avant platform features—programmable functional units, comprehensive clocking, sysMEM and sysDSP resources, plus high-speed PHY support—provide a matched set of capabilities for embedded processing, memory-intensive functions and high-speed interfacing.

This device is appropriate for engineers and system designers looking for a configurable FPGA with measurable on-chip resources, industrial temperature range and platform-level features documented in the Avant overview. The combination of logic capacity, memory, I/O and platform capabilities supports scalable designs and long-term deployment in industrial environments.

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