LCMXO1200C-4FTN256I

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA

Quantity 10 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O211Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200C-4FTN256I – MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA

The LCMXO1200C-4FTN256I is a member of the MachXO family of non-volatile, reconfigurable FPGAs. It integrates 1,200 logic elements, up to 211 I/Os, and approximately 9.4 Kbits of on-chip RAM in a 256-ball BGA package, making it suitable for control, interfacing and glue-logic functions.

Designed for industrial applications, this device offers instant-on operation, single-chip configuration (no external configuration memory required), and in-field reconfiguration capabilities while operating. It supports a wide supply voltage range and an extended operating temperature span for robust deployment.

Key Features

  • Core Logic — 1,200 logic elements (LUT-based architecture) optimized for glue logic, bus bridging and control functions.
  • On-chip Memory — Approximately 9.4 Kbits of total on-chip RAM to support embedded and distributed memory needs.
  • I/O Density — Up to 211 programmable I/Os, enabling high pin-to-pin connectivity in complex system designs.
  • Non-Volatile, Instant-On — Single-chip non-volatile configuration with instant-on behavior and no external configuration memory required.
  • Reconfiguration and In-System Programming — Supports in-field reconfiguration and background programming; SRAM-based logic can be reconfigured in milliseconds.
  • sysCLOCK PLL — Device-class includes one sysCLOCK PLL for clock multiplication, division and phase adjustment.
  • Flexible I/O Standards — Programmable I/O buffer family supports multiple interface standards (family-level support referenced in datasheet).
  • Power and Low-Power Modes — Sleep mode support for significant static current reduction.
  • Package and Mounting — 256-ball ftBGA (17×17 mm) / 256-LBGA surface-mount package.
  • Voltage and Temperature — Wide supply voltage range: 1.71 V to 3.465 V; operating temperature: −40 °C to 100 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Glue Logic — Implements board-level control and signal conditioning to simplify system-level routing and BOM.
  • Bus Bridging and Interfacing — Acts as a protocol adapter and I/O expander where up to 211 I/Os are required for bus-level conversions and buffering.
  • Power-Up and System Control — Provides instant-on power-up sequencing and deterministic control logic without external configuration memory.
  • Control and Monitoring — Integrates control state machines, sensor interfacing and housekeeping functions in industrial systems.

Unique Advantages

  • Instant-on single-chip configuration: Eliminates external configuration memory and enables microsecond power-up to active operation.
  • High I/O to logic ratio: Up to 211 I/Os paired with 1,200 logic elements supports dense interfacing and control tasks without larger devices.
  • In-field reconfiguration: TransFR reconfiguration and background programming allow updates while the system remains operational.
  • Low-power operation: Sleep mode capability permits substantial static current reduction for energy-sensitive designs.
  • Industrial temperature range: Rated for −40 °C to 100 °C for reliable operation in industrial environments.
  • Flexible supply operation: Supports a broad voltage range (1.71 V to 3.465 V) for compatibility with multiple system rails.

Why Choose LCMXO1200C-4FTN256I?

The LCMXO1200C-4FTN256I combines non-volatile, instant-on configuration with reconfigurable FPGA logic and a high I/O count to address common embedded challenges such as glue logic, bus interfacing and system control. Its single-chip configuration model reduces BOM complexity while providing rapid boot and in-field update capability.

Engineers targeting industrial applications will benefit from the device's extended temperature range, RoHS compliance, and support for a variety of I/O standards. The MachXO family is supported by established design tools referenced in the datasheet for synthesis, place-and-route and timing verification, enabling efficient development and migration within the family.

Request a quote or submit a procurement inquiry to evaluate the LCMXO1200C-4FTN256I for your next design.

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