LCMXO1200C-4FTN256I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA |
|---|---|
| Quantity | 10 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200C-4FTN256I – MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA
The LCMXO1200C-4FTN256I is a member of the MachXO family of non-volatile, reconfigurable FPGAs. It integrates 1,200 logic elements, up to 211 I/Os, and approximately 9.4 Kbits of on-chip RAM in a 256-ball BGA package, making it suitable for control, interfacing and glue-logic functions.
Designed for industrial applications, this device offers instant-on operation, single-chip configuration (no external configuration memory required), and in-field reconfiguration capabilities while operating. It supports a wide supply voltage range and an extended operating temperature span for robust deployment.
Key Features
- Core Logic — 1,200 logic elements (LUT-based architecture) optimized for glue logic, bus bridging and control functions.
- On-chip Memory — Approximately 9.4 Kbits of total on-chip RAM to support embedded and distributed memory needs.
- I/O Density — Up to 211 programmable I/Os, enabling high pin-to-pin connectivity in complex system designs.
- Non-Volatile, Instant-On — Single-chip non-volatile configuration with instant-on behavior and no external configuration memory required.
- Reconfiguration and In-System Programming — Supports in-field reconfiguration and background programming; SRAM-based logic can be reconfigured in milliseconds.
- sysCLOCK PLL — Device-class includes one sysCLOCK PLL for clock multiplication, division and phase adjustment.
- Flexible I/O Standards — Programmable I/O buffer family supports multiple interface standards (family-level support referenced in datasheet).
- Power and Low-Power Modes — Sleep mode support for significant static current reduction.
- Package and Mounting — 256-ball ftBGA (17×17 mm) / 256-LBGA surface-mount package.
- Voltage and Temperature — Wide supply voltage range: 1.71 V to 3.465 V; operating temperature: −40 °C to 100 °C.
- Compliance — RoHS compliant.
Typical Applications
- Glue Logic — Implements board-level control and signal conditioning to simplify system-level routing and BOM.
- Bus Bridging and Interfacing — Acts as a protocol adapter and I/O expander where up to 211 I/Os are required for bus-level conversions and buffering.
- Power-Up and System Control — Provides instant-on power-up sequencing and deterministic control logic without external configuration memory.
- Control and Monitoring — Integrates control state machines, sensor interfacing and housekeeping functions in industrial systems.
Unique Advantages
- Instant-on single-chip configuration: Eliminates external configuration memory and enables microsecond power-up to active operation.
- High I/O to logic ratio: Up to 211 I/Os paired with 1,200 logic elements supports dense interfacing and control tasks without larger devices.
- In-field reconfiguration: TransFR reconfiguration and background programming allow updates while the system remains operational.
- Low-power operation: Sleep mode capability permits substantial static current reduction for energy-sensitive designs.
- Industrial temperature range: Rated for −40 °C to 100 °C for reliable operation in industrial environments.
- Flexible supply operation: Supports a broad voltage range (1.71 V to 3.465 V) for compatibility with multiple system rails.
Why Choose LCMXO1200C-4FTN256I?
The LCMXO1200C-4FTN256I combines non-volatile, instant-on configuration with reconfigurable FPGA logic and a high I/O count to address common embedded challenges such as glue logic, bus interfacing and system control. Its single-chip configuration model reduces BOM complexity while providing rapid boot and in-field update capability.
Engineers targeting industrial applications will benefit from the device's extended temperature range, RoHS compliance, and support for a variety of I/O standards. The MachXO family is supported by established design tools referenced in the datasheet for synthesis, place-and-route and timing verification, enabling efficient development and migration within the family.
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