LCMXO1200C-4FT256I

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA

Quantity 650 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O211Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200C-4FT256I – MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA

The LCMXO1200C-4FT256I is a MachXO family non-volatile FPGA that combines instant-on configuration with reconfigurable logic and flexible I/O. It provides 1,200 logic elements, up to 211 I/Os, and approximately 9.4 Kbits of on-chip RAM in a compact 256-ball BGA package.

Designed for embedded control, glue logic, bus bridging and interface tasks, this industrial-grade device supports a wide supply range (1.71 V to 3.465 V) and an extended operating temperature of −40 °C to 100 °C for robust deployment across demanding systems.

Key Features

  • Non-volatile, instant-on architecture  Single-chip non-volatile configuration enables power-up in microseconds without external configuration memory.
  • Reconfigurable logic  1,200 logic elements provide flexible implementation for glue logic, control paths, and protocol bridging.
  • I/O density and flexibility  Up to 211 I/Os with programmable sysIO™ buffer support for LVCMOS (1.2/1.5/1.8/2.5/3.3 V), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS interfaces.
  • Embedded and distributed memory  Approximately 9.4 Kbits of on-chip RAM (total RAM bits: 9,421) for small data buffering and state storage.
  • Clocking and timing  Includes analog PLL resources (MachXO1200 devices include one PLL) for clock multiply, divide and phase shifting.
  • Low-power modes  Sleep mode support provides substantial static current reduction for power-sensitive applications.
  • Package and mounting  Available in a 256-ball LBGA / 256-FTBGA (17×17 mm) package with surface-mount mounting for compact board integration.
  • Industrial temperature and RoHS compliant  Rated for −40 °C to 100 °C operation and RoHS-compliant packaging.

Typical Applications

  • Glue logic and system control  Implement power-up sequencing, resets and board-level control functions using the device’s instant-on and reconfigurable logic.
  • Bus bridging and protocol interfacing  Use the flexible I/O buffer set and ample I/O count to bridge between different voltage domains and serial/parallel interfaces.
  • Peripheral and sensor aggregation  Aggregate sensor inputs, handle debouncing and preprocessing tasks with on-chip logic and embedded RAM for temporary storage.
  • Industrial equipment control  Deploy in harsh environments where extended temperature range and industrial-grade components are required.

Unique Advantages

  • Instant-on, single-chip configuration: Eliminates external configuration memory and enables immediate operation at power-up.
  • Wide I/O support: Up to 211 programmable I/Os and multi-standard buffer support reduce the need for external level translators and interface chips.
  • Compact, surface-mount packaging: 256-ball LBGA/FTBGA package provides high pin count in a small footprint for dense board designs.
  • Industrial temperature rating: −40 °C to 100 °C operation suits demanding embedded and industrial applications.
  • On-chip memory and PLL: Approximately 9.4 Kbits of RAM and an integrated PLL enable local buffering and clock management without extra components.
  • RoHS compliant: Meets environmental requirements for modern electronic assemblies.

Why Choose LCMXO1200C-4FT256I?

The LCMXO1200C-4FT256I positions itself as a compact, industrial-grade MachXO FPGA offering immediate, secure configuration and a balance of logic density, I/O capability and on-chip memory. Its single-chip non-volatile design simplifies BOM and system initialization while the wide voltage and temperature ranges support robust deployment.

This part is well suited for engineers building control systems, protocol bridges and interface-centric designs that require reliable instant-on behavior, flexible I/O standards and a small board footprint. The on-chip PLL and embedded RAM further reduce external components and streamline system design.

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