LCMXO1200C-4BN256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 100 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 211 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200C-4BN256C – MachXO Field Programmable Gate Array (FPGA), 1200 logic elements, 256-LFBGA
The LCMXO1200C-4BN256C is a MachXO family FPGA from Lattice Semiconductor offering 1200 logic elements, up to 211 I/Os, and 9,421 bits of on-chip RAM in a 256-ball LFBGA (caBGA) package. Built for glue logic, bus interfacing and control applications, this single‑chip, non‑volatile FPGA delivers instant-on behavior and flexible I/O support for commercial-grade embedded systems.
Key Features
- Logic Capacity — 1200 logic elements provide programmable LUT-based logic resources suitable for glue logic, bus bridging and control functions.
- I/O Density — Up to 211 I/Os accommodate a wide mix of signals and peripheral interfaces in a single device footprint.
- On-chip Memory — Total of 9,421 bits of on-chip RAM for distributed and small embedded memory needs.
- Non-volatile, Instant-on — MachXO family capability for single-chip non‑volatile configuration enables immediate startup without external configuration memory.
- Reconfiguration Support — Family-level support for in-field reconfiguration and background programming enables updates without removing the device from the system.
- Flexible Voltage Range — Operates across a 1.71 V to 3.465 V supply window to support common system power rails.
- Low-power Modes — Family features include sleep modes to reduce static current for power-sensitive applications.
- Package — 256-LFBGA (256-CABGA, 14×14 mm) surface-mount package optimized for compact board integration.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
- RoHS Compliant — Meets RoHS requirements for lead‑free manufacturing processes.
Typical Applications
- Glue Logic and System Glue — Replace discrete gates and small CPLDs to consolidate control logic and signal routing on a single device.
- Bus Bridging and Interface Conversion — Implement bus translation, level shifting control and protocol bridging using abundant I/Os and programmable logic.
- Power-up and Reset Control — Provide deterministic instant-on sequencing and supervisory control without external configuration memory.
- Peripheral and Sensor Interfacing — Manage mixed-signal and digital peripherals with flexible I/O and on-chip memory for buffering and simple state machines.
Unique Advantages
- Single-chip Non‑volatile Configuration: Eliminates the need for external configuration memory, simplifying BOM and board layout while enabling instant-on operation.
- High I/O-to-Logic Ratio: 211 I/Os paired with 1200 logic elements support complex interfacing tasks without larger, higher-cost devices.
- Flexible Power Support: Broad supply range (1.71 V–3.465 V) allows integration with common digital rails and mixed-voltage systems.
- Compact, Production-ready Package: 256-ball LFBGA (14×14 mm) enables dense PCB routing and small form-factor designs.
- Power-aware Operation: Family-level sleep modes provide options to reduce static current during idle periods, supporting lower-power designs.
- Commercial Temperature Rating: Specified 0 °C to 85 °C operation for standard commercial applications and deployments.
Why Choose LCMXO1200C-4BN256C?
The LCMXO1200C-4BN256C positions itself as a compact, non‑volatile FPGA solution for designers needing instant-on behavior, flexible I/O counts and moderate logic capacity. With 1200 logic elements, 211 possible I/Os, and on‑chip RAM, it is well suited for consolidating glue logic, managing bus interfaces, and implementing control functions in commercial embedded systems. Its broad supply voltage range, RoHS compliance and 256-LFBGA package help simplify integration and production deployment while leveraging the MachXO family’s reconfiguration and low‑power features.
For availability, pricing, or to request a quotation for the LCMXO1200C-4BN256C, submit an inquiry to obtain lead-time and volume pricing information.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016