LCMXO1200C-4FT256C

The LCMXO1200C-4FT256C is a MachXO family non-volatile FPGA optimized for glue logic, bus bridging, bus interfacing, power-up control and general control logic. It combines instant-on, single-chip non-volatile configuration with a LUT-based logic array and on-chip memory to address low- to mid-density control and interface tasks.

With approximately 1200 logic elements, 211 I/Os and around 9.4 Kbits of on-chip RAM, this surface-mount 256-ball BGA device delivers a balance of I/O density and embedded memory for compact control and interface designs, while operating across a wide supply range and commercial temperature grade.

Key Features

• Non-volatile, instant-on architecture — Single-chip design requires no external configuration memory and powers up quickly, enabling immediate system-level operation.
• Logic capacity — Approximately 1200 logic elements suitable for glue logic, bridging and control functions.
• On-chip memory — Total on-chip RAM of 9,421 bits for distributed and embedded memory needs within the device.
• I/O density and package — Up to 211 I/Os in a 256-ball package; supplier device package specified as 256-FTBGA (17×17) and package case 256-LBGA, surface mount.
• Flexible power — Voltage supply range from 1.71 V to 3.465 V to support a variety of system supply scenarios.
• Commercial temperature grade — Operating range 0 °C to 85 °C for standard commercial applications.
• Reconfiguration and power management — Family-level features include background programming, in-field TransFR™ reconfiguration and a sleep mode that can significantly reduce static current.
• Development ecosystem — Supported by ispLEVER design tools and common synthesis flows for implementation and timing verification.
• RoHS compliant — Device meets RoHS environmental requirements.

Typical Applications

• Glue logic and system control — Implement board-level control functions and power-up sequencing without external configuration memory.
• Bus interfacing and bridging — Handle protocol adaptation and bus interconnect tasks with a high I/O count and on-chip logic.
• Peripheral and I/O consolidation — Concentrate diverse I/O functions in a single package to reduce BOM and PCB complexity.

Unique Advantages

• Instant-on, single-chip solution: Eliminates the need for external configuration memory, streamlining BOM and reducing system complexity.
• High I/O-to-logic ratio: 211 I/Os paired with ~1200 logic elements supports dense interfacing while keeping logic resources available for control and glue logic.
• On-chip memory integration: Approximately 9.4 Kbits of RAM provides local storage for FIFOs, state, and small data buffers without external RAM.
• Field reconfiguration capability: Family-level support for in-field updates and background programming enables flexible product upgrades and fast iteration.
• Reduced standby power option: Sleep mode capability provides substantial static current reduction for power-sensitive designs.
• Design tool support: Compatibility with ispLEVER and common synthesis tool flows simplifies implementation and timing closure.

Why Choose LCMXO1200C-4FT256C?

This MachXO FPGA balances compact logic capacity, significant I/O count and on-chip memory in a single, non-volatile package well suited to control, interfacing and glue logic roles. Its instant-on behavior and single-chip configuration reduce BOM and system boot complexity, while reconfiguration and low-power features enable maintainability and power efficiency over a product’s lifecycle.

Engineers and designers building compact systems that require reliable on-board logic, flexible I/O mapping and streamlined system integration will find the LCMXO1200C-4FT256C appropriate for commercial temperature applications and a variety of interface-focused designs.

Request a quote or submit a quote for pricing and availability of the LCMXO1200C-4FT256C today.