LCMXO1200C-4B256C

The LCMXO1200C-4B256C is a MachXO family Field Programmable Gate Array (FPGA) in a 256‑LFBGA (256‑CABGA, 14×14 mm) package, offering 1,200 logic elements and up to 211 I/O. Designed for glue logic, bus bridging, control and interface functions, this commercial‑grade device provides non‑volatile, instant‑on operation and flexible I/O in a single, surface‑mount package.

With on‑chip memory resources and in-field reconfiguration support, the LCMXO1200C-4B256C is suited for embedded control and interface functions where fast boot, reconfigurability and compact integration matter.

Key Features

• Logic Capacity — 1,200 logic elements (LUTs) to implement glue logic, state machines and small FPGA functions.
• On‑Chip Memory — Approximately 9,421 bits of total on‑chip RAM for distributed and embedded memory needs.
• I/O Density — Up to 211 I/O pins in the 256‑LFBGA package to support wide peripheral and bus interfacing.
• Non‑Volatile, Instant‑On Architecture — Single‑chip, non‑volatile configuration enables microsecond power‑up and eliminates external configuration memory.
• In‑Field Reconfiguration — Supports background and fast reconfiguration of SRAM‑based logic for field updates and system flexibility.
• Programmable I/O Buffer Options (family) — Flexible I/O buffer options on the MachXO family support a range of interfaces and standards to simplify board design.
• Clocking — Includes one analog PLL for clock multiply/divide and phase adjustments (MachXO1200 device capability).
• Supply and Mounting — Operates from 1.71 V to 3.465 V and is supplied in a surface‑mount 256‑LFBGA (256‑CABGA, 14×14) package.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
• Standards and Support (family) — Family features include JTAG programming, boundary scan and support for in‑system programming and background non‑volatile programming.
• RoHS Compliant — Device is RoHS compliant for lead‑free assembly.

Typical Applications

• Interface & Bus Bridging — Implement protocol conversion, bus steering and glue logic between processors, peripherals and custom IP using the device’s I/O density and reconfigurable logic.
• Power‑Up Control & System Sequencing — Use instant‑on, single‑chip configuration to manage power sequencing and control tasks that require deterministic boot behavior.
• Control Logic & State Machines — Replace discrete logic and CPLDs for compact control functions, supervisory logic and user‑interface controllers.
• Field‑Updatable Logic — Apply in systems that benefit from in‑field updates or incremental feature rollout using background and fast reconfiguration capabilities.

Unique Advantages

• Instant‑on, single‑chip configuration: Eliminates external configuration memory and delivers microsecond‑scale power‑up for faster system availability.
• High I/O per logic element: Combines 1,200 logic elements with up to 211 I/O to implement dense interface logic without a large FPGA footprint.
• Compact, manufacturable package: 256‑LFBGA (256‑CABGA, 14×14) surface‑mount package simplifies PCB routing while maintaining high pin count.
• Field flexibility: Background and SRAM reconfiguration enable in‑field updates with minimal impact to system operation.
• Commercial grade and RoHS compliant: Rated 0 °C to 85 °C and ready for mainstream electronic applications with lead‑free compliance.

Why Choose LCMXO1200C-4B256C?

The LCMXO1200C-4B256C positions itself as a compact, non‑volatile FPGA solution for designers needing instant‑on behavior, flexible reconfiguration and substantial I/O in a small surface‑mount package. Its combination of 1,200 logic elements, approximately 9.4 Kbits of on‑chip RAM and up to 211 I/O makes it well suited to replace discrete glue logic, implement bus interfaces and host control/state‑machine functions in commercial applications.

Supported by MachXO family capabilities such as background programming, PLL clock control and boundary‑scan/JTAG support, this device offers scalable design options and in‑field update paths while keeping board-level BOM and complexity down.

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