LCMXO1200C-3TN100C

IC FPGA 73 I/O 100TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 73 9421 1200 100-LQFP

Quantity 904 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O73Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200C-3TN100C – MachXO Field Programmable Gate Array (FPGA) IC 73 9421 1200 100-LQFP

The LCMXO1200C-3TN100C is a MachXO family FPGA optimized for glue logic, bus bridging, control functions and board-level interfacing. It combines non-volatile configuration, a dense array of LUT-based logic, and embedded memory to deliver instant-on programmable logic suitable for commercial embedded designs.

Architected for flexible I/O and low-latency control tasks, the device provides 1,200 logic elements, approximately 9,421 bits of on-chip RAM, and 73 I/Os in a 100-pin LQFP/TQFP (14 × 14 mm) package, making it appropriate for compact systems that require reconfigurability and integrated configuration memory.

Key Features

  • Logic Core  1,200 logic elements (LUTs) for implementing control, glue logic and interfacing functions.
  • Embedded Memory  Approximately 9,421 bits of embedded RAM (EBR and distributed RAM capacity aligned with MachXO1200 family specifications).
  • I/O Flexibility  73 user I/Os supported in the 100-pin package; flexible sysIO buffer options in the MachXO family support LVCMOS (1.2/1.5/1.8/2.5/3.3V), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS signaling.
  • Non-volatile, Instant-on Configuration  Single-chip non-volatile configuration enables instant-on operation without external configuration memory and reduces system complexity.
  • In-field Reconfiguration  Supports fast SRAM reconfiguration in milliseconds and TransFR™ background reconfiguration for in-field logic updates while the system operates.
  • Low-power Modes  Sleep mode supports significant static current reduction for low-power operation.
  • Clocking  Integrated PLL resources consistent with the MachXO1200 family for clock multiply/divide and phase adjustments.
  • Package & Mounting  100-LQFP / 100-TQFP (14 × 14 mm) surface-mount package suitable for compact board layouts.
  • Electrical & Environmental  Voltage supply range 1.71 V to 3.465 V; commercial operating temperature 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Glue Logic and Board-Level Control  Implement combinational and sequential glue logic to simplify PCB routing and reduce discrete component counts.
  • Bus Bridging and Interfacing  Bridge different bus standards and manage protocol translation using flexible I/O standards and on-chip logic.
  • Power-up and System Control  Manage power sequencing, reset logic and startup diagnostics with instant-on configuration and integrated control logic.
  • User Interface and Peripheral Control  Handle keypad, display and peripheral timing/control where compact packaging and reconfigurability are required.

Unique Advantages

  • Single-chip, non-volatile configuration: Eliminates the need for external configuration memory and enables microsecond-class power-up readiness.
  • Compact integration: 1,200 logic elements and 73 I/Os in a 100-pin LQFP/TQFP package reduce board space and simplify system BOM.
  • Flexible I/O signaling: Family-level support for a wide range of interface standards allows reuse across multiple system designs without hardware redesign.
  • In-field update capability: TransFR™ and background programming allow in-system logic updates while preserving system uptime.
  • Power-conscious operation: Sleep mode provides substantial static current reduction for energy-efficient designs.
  • Commercial-grade operating range: Designed for 0 °C to 85 °C operation with surface-mount 100-pin packaging for standard commercial applications.

Why Choose LCMXO1200C-3TN100C?

The LCMXO1200C-3TN100C positions itself as a practical, ready-to-deploy programmable logic device for commercial embedded systems that need instant-on behavior, flexible I/O, and compact packaging. Its combination of 1,200 logic elements, embedded RAM, and non-volatile configuration makes it well suited to replace discrete glue logic, manage bus interfacing, and centralize board control functions.

Engineers and procurement teams benefit from a single-chip solution that reduces external components and streamlines system design, while the MachXO family feature set—non-volatile instant-on, reconfiguration capabilities, and broad I/O support—provides design flexibility and longevity across product iterations.

Request a quote or submit a pricing inquiry for the LCMXO1200C-3TN100C to evaluate fit and availability for your next design.

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