LCMXO1200C-3T144C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 113 9421 1200 144-LQFP |
|---|---|
| Quantity | 755 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 113 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200C-3T144C – MachXO Field Programmable Gate Array (144‑LQFP)
The LCMXO1200C-3T144C is a MachXO family FPGA device in a 144‑pin surface‑mount package. It combines non‑volatile, instant‑on configuration with FPGA-style logic and embedded memory to address common glue‑logic, bus‑bridging and control tasks.
With approximately 1200 logic elements, one embedded block RAM and up to 113 I/Os, this device is suited for applications that require compact, reconfigurable control logic with single‑chip configuration and low BOM complexity.
Key Features
- Core Logic Approximately 1200 logic elements for implementing glue logic, control state machines and bus interfacing tasks.
- Programmable Memory Total on‑chip RAM of 9,421 bits (approximately 9.4 Kbits) with one 9 Kbit embedded block SRAM available for embedded data and FIFOs.
- I/O Density Up to 113 general‑purpose I/Os in the 144‑pin package, providing flexible pin access for peripheral, bus and interface signals.
- Non‑volatile, Instant‑On Single‑chip non‑volatile architecture with instant‑on behavior and no external configuration memory required, simplifying system boot and security.
- Reconfiguration and Updates Supports in‑field reconfiguration and background programming of non‑volatile memory; SRAM‑based logic can be reconfigured in milliseconds.
- Clocking and PLL Integrated analog PLL capability (one PLL for this device family member) for clock multiplication, division and phase adjustment.
- Power and Voltage Operates over a supply range of 1.71 V to 3.465 V, enabling use with a variety of system power rails.
- Package & Mounting 144‑pin LQFP/TQFP (20 × 20 mm) surface‑mount package; commercial grade with operating temperature 0 °C to 85 °C.
- Regulatory RoHS‑compliant packaging.
Typical Applications
- Glue Logic Replace discrete gate arrays and PALs with reconfigurable on‑chip logic for bus arbitration, signal conditioning and control glue.
- Bus Bridging & Interfacing Implement protocol adaptation and bus bridging functions where flexible I/O and modest logic density are required.
- Power‑Up & System Control Handle power sequencing, reset control and simple supervisory state machines with instant‑on, single‑chip configuration.
- Control Logic Integrate user interface control, feature enablement and peripheral control tasks into a compact programmable device.
Unique Advantages
- Single‑Chip, No External Configuration Simplifies board design and improves security by eliminating external configuration memory and exposed bitstreams.
- Instant‑On Operation Powers up ready for operation, reducing system initialization time compared with devices that require external configuration.
- Field Reconfigurability Background programming and in‑field updates allow logic changes without removing the device or halting system operation.
- Balanced I/O-to‑Logic Ratio 113 I/Os paired with ~1200 logic elements offer a practical tradeoff for control, interfacing and glue applications in a compact package.
- Compact Surface‑Mount Package 144‑pin LQFP/TQFP (20 × 20 mm) supports surface‑mount assembly and efficient PCB layout for space‑constrained designs.
- Commercial‑Grade Reliability Commercial operating range (0 °C to 85 °C) and RoHS compliance support standard embedded and consumer applications.
Why Choose LCMXO1200C-3T144C?
The LCMXO1200C-3T144C delivers a practical combination of non‑volatile instant‑on behavior, reconfigurable FPGA-style logic and a substantial I/O count in a single, surface‑mount package. Its approximately 1200 logic elements, embedded block RAM and one PLL make it well suited to designers replacing CPLDs or small FPGAs for glue logic, bus interfacing and system control functions.
Choose this MachXO device when you need a compact, single‑chip programmable solution that simplifies board design, supports field upgrades and provides quick system startup, all within a commercial temperature and RoHS‑compliant package.
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