LCMXO1200E-4MN132C

IC FPGA 101 I/O 132CSBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 101 9421 1200 132-LFBGA, CSPBGA

Quantity 404 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O101Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200E-4MN132C – MachXO Field Programmable Gate Array (FPGA)

The LCMXO1200E-4MN132C is a MachXO family FPGA offering a single‑chip, non‑volatile architecture optimized for glue logic, bus bridging, bus interfacing, power‑up control and control logic. It combines instant‑on behavior and in-field reconfiguration capabilities with a compact, surface‑mount CSPBGA package for commercial embedded designs.

Key on‑chip resources include 1,200 logic elements across 150 logic blocks, approximately 9.4 Kbits of on‑chip RAM, and 101 I/Os in a 132‑ball CSPBGA (8×8 mm). The device operates from 1.14 V to 1.26 V and is specified for commercial temperatures (0 °C to 85 °C).

Key Features

  • Core Logic — 1,200 logic elements implemented across 150 logic blocks to handle combinational and sequential logic requirements.
  • On‑chip Memory — Approximately 9.4 Kbits of embedded memory for small buffer, state and control storage.
  • I/O and Package — 101 user I/Os in a 132‑ball CSPBGA (8×8 mm) surface mount package; RoHS‑compliant packaging.
  • Non‑volatile, Instant‑on — Single‑chip non‑volatile architecture powers up in microseconds with no external configuration memory required.
  • Reconfiguration and Programming — Supports TransFR™ in‑field reconfiguration and JTAG programming of SRAM and non‑volatile memory, including background programming of non‑volatile storage.
  • Power and Sleep — Operates from 1.14 V to 1.26 V and includes a Sleep Mode enabling up to 100× static current reduction.
  • Clocking — Includes one sysCLOCK PLL for clock multiplication, division and phase shifting.
  • Grade and Temperature — Commercial grade device specified for operation from 0 °C to 85 °C.

Typical Applications

  • Glue Logic — Replace discrete glue components with flexible programmable logic to simplify board design and reduce BOM.
  • Bus Bridging and Interfacing — Implement protocol bridging, bus width conversion and I/O buffering in a compact, reprogrammable device.
  • Power‑up Control — Manage system sequencing and power supervision with instant‑on behavior and single‑chip configuration.
  • Control Logic — Implement finite state machines, control paths and timing logic for embedded systems requiring in‑field updates.

Unique Advantages

  • Single‑chip non‑volatile architecture: Eliminates the need for external configuration memory, streamlining BOM and board layout.
  • Fast system availability: Instant‑on power‑up in microseconds reduces startup latency for time‑sensitive applications.
  • Field reconfiguration (TransFR™): Allows logic updates while the system is running, enabling rapid in‑field fixes and feature upgrades.
  • Low‑power standby: Sleep Mode provides up to 100× reduction in static current for power‑sensitive designs.
  • High I/O density in a compact package: 101 I/Os in a 132‑ball CSPBGA give a strong I/O‑to‑logic ratio for space‑constrained boards.
  • Commercial temperature and RoHS compliance: Designed for standard commercial environments with RoHS‑compliant packaging.

Why Choose LCMXO1200E-4MN132C?

This MachXO device balances compact packaging, non‑volatile instant‑on operation, and reconfigurable logic to address board‑level control, interfacing and sequencing tasks in commercial embedded systems. Its combination of 1,200 logic elements, roughly 9.4 Kbits of on‑chip RAM and 101 I/Os makes it well suited for designs that need immediate availability and in‑field flexibility without external configuration components.

Designers can leverage the MachXO family toolchain and device architecture to simplify integration and migration across similar density points, reducing development time and long‑term maintenance effort for systems that benefit from field updates and low‑power standby modes.

Request a quote or contact sales to discuss availability, pricing, and sample requests for the LCMXO1200E-4MN132C.

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