LCMXO1200E-4M132I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 101 9421 1200 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 739 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSPBGA (8x8) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 101 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200E-4M132I – MachXO FPGA, 1200 Logic Elements, 101 I/Os, 132‑LFBGA
The LCMXO1200E-4M132I is a MachXO family field programmable gate array (FPGA) in a 132‑ball CSPBGA (132‑LFBGA) surface‑mount package. It provides 1,200 logic elements and on‑chip memory in a non‑volatile, instant‑on architecture targeted at glue logic, bus bridging, power‑up control and general control logic in industrial applications.
Designed for applications that require low external BOM and predictable power‑up behavior, the device combines non‑volatile configuration, reconfigurable SRAM logic, and flexible I/O in an industrial‑grade package that operates from −40°C to 100°C.
Key Features
- Logic Capacity — 1,200 logic elements providing a compact fabric for glue logic and control functions; device also references 150 logic blocks for resource planning.
- On‑chip Memory — Total on‑chip memory of 9,421 bits (approximately 9.4 Kbits) for distributed and embedded RAM storage.
- I/O and Packaging — 101 user I/Os available in a 132‑ball CSPBGA (132‑LFBGA, 8×8 mm) supplier package; surface‑mount mounting suited for compact board designs.
- Non‑volatile, Instant‑On Architecture — Single‑chip non‑volatile configuration supports instant‑on behavior and eliminates the need for external configuration memory (family feature).
- Reconfiguration and Programming — Supports SRAM reconfiguration and in‑field updates through background programming and JTAG‑based programming (family feature).
- Analog and Clock Support — Family includes support for PLLs and flexible I/O buffer options for a wide range of interfaces (family feature).
- Power and Supply — Specified operating supply range of 1.14 V to 1.26 V per device data.
- Industrial Temperature Rating — Operating temperature range from −40°C to 100°C, suitable for industrial environments.
- Compliance and Mounting — RoHS‑compliant and provided in a surface‑mount package for standard SMT assembly.
Typical Applications
- Glue Logic and System Control — Implement address decoding, bus arbitration, power‑up sequencing and other control tasks using compact logic and on‑chip memory.
- Bus Bridging and Interfacing — Use the device’s flexible I/O and reconfigurable logic to bridge or adapt between different bus standards and voltage domains.
- Power‑Up and Reset Control — Non‑volatile instant‑on behavior and reconfigurable logic simplify deterministic power‑up sequences and supervision functions.
- Industrial Embedded Systems — Industrial temperature rating and robust packaging make it suitable for embedded control and monitoring applications in industrial equipment.
Unique Advantages
- Instant‑on, single‑chip configuration: Non‑volatile configuration eliminates external configuration memory and enables rapid, deterministic startup.
- Compact, reconfigurable logic fabric: 1,200 logic elements and ~9.4 Kbits of on‑chip memory provide a compact platform for glue logic, state machines and small data buffers.
- Flexible I/O in a small BGA: 101 I/Os in a 132‑ball CSPBGA (8×8) balance high pin count and small board area for space‑constrained designs.
- Industrial readiness: Rated for −40°C to 100°C and supplied in a surface‑mount RoHS‑compliant package for industrial deployments.
- Field reconfiguration: Family features allow background programming and in‑field SRAM updates for iterative firmware and feature upgrades.
Why Choose LCMXO1200E-4M132I?
The LCMXO1200E-4M132I positions itself as a compact, industrial‑grade MachXO FPGA that blends non‑volatile instant‑on operation with reconfigurable SRAM logic. Its combination of 1,200 logic elements, roughly 9.4 Kbits of on‑chip memory and 101 I/Os in a 132‑ball CSPBGA package makes it well suited for designers needing reliable control, interface bridging and power‑sequence functions without external configuration components.
Choose this device when you need a space‑efficient, RoHS‑compliant FPGA solution with industrial temperature range, flexible I/O count and the ability to update logic in the field while simplifying BOM and board complexity.
Request a quote or submit an inquiry for LCMXO1200E-4M132I to receive pricing, availability and ordering information.

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