LCMXO1200E-4FTN256I

The LCMXO1200E-4FTN256I is a MachXO family field-programmable gate array (FPGA) in a 256-ball BGA package designed for instant-on, non‑volatile logic integration. It combines approximately 1,200 logic elements with flexible I/O and embedded memory to address glue logic, bus interfacing and control functions in industrial systems.

Built for system-level integration, the device delivers high I/O count (211 I/Os), on-chip memory resources (total ~9,421 bits), and reconfiguration capabilities while operating across an industrial temperature range.

Key Features

• Core Logic – Approximately 1,200 logic elements enabling glue logic, bridging and control implementations.
• Memory – Total on-chip RAM of 9,421 bits (including an embedded block RAM block of roughly 9.2 Kbits as referenced for the MachXO1200 family).
• I/O Density – Up to 211 programmable I/Os to support dense pin requirements and multiple peripheral interfaces.
• Non-Volatile, Instant-On – Single-chip non-volatile architecture with instant-on behavior and no external configuration memory required.
• Reconfiguration and Sleep – Supports in-field reconfiguration (background programming) and a sleep mode that can reduce static current by up to 100×.
• Flexible I/O Buffering – Programmable sysIO buffer supports a wide range of interface standards (LVCMOS, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, RSDS) as documented for the MachXO family.
• Clocking – Family devices include analog PLLs; the MachXO1200 family provides one PLL for clock multiply/divide and phase shifting.
• Supply and Temperature – Core supply range listed at 1.14 V to 1.26 V for this part number; device is specified for industrial operation from −40 °C to 100 °C.
• Package – 256-ball ftBGA (17 × 17 mm) supplier package with surface-mount mounting for compact board-level integration.
• System Support – Includes boundary-scan (IEEE 1149.1) support and on-chip oscillator options as part of the MachXO family feature set.
• Standards and Compliance – RoHS compliant packaging.

Typical Applications

• Glue Logic and Bus Bridging – Implement address decoding, protocol translation and bus interfacing where dense I/O and reconfigurable logic are required.
• Power-Up and System Control – Manage power sequencing, reset logic and initialization tasks with instant-on, single-chip non-volatile operation.
• Peripheral and Sensor Interfaces – Aggregate and condition signals from multiple peripherals using the device’s flexible I/O standards and embedded memory.
• Control and Timing Functions – Use the on-chip PLL and logic resources for clock management, event sequencing and deterministic control tasks.

Unique Advantages

• Single-Chip, Non-Volatile Design: Eliminates the need for external configuration memory, simplifying BOM and reducing system boot time through instant-on behavior.
• High I/O-to-Logic Ratio: 211 I/Os paired with ~1,200 logic elements supports complex interfacing without a large FPGA footprint.
• Field Reconfiguration: Background programming and in-field updates allow logic changes without removing the device from the system.
• Low-Power Standby: Sleep mode capability enables significant static current reduction for power-sensitive designs.
• Flexible Interface Support: Programmable I/O buffers support multiple signaling standards, enabling reuse across different board-level designs.
• Industrial Temperature Range: Specified operation from −40 °C to 100 °C for use in industrial application environments.

Why Choose LCMXO1200E-4FTN256I?

The LCMXO1200E-4FTN256I positions itself as a compact, non‑volatile FPGA solution for applications that require immediate availability after power-up, significant I/O capacity, and embedded memory for buffering and control. Its combination of ~1,200 logic elements, ~9.4 Kbits of on-chip RAM, and 211 I/Os makes it suitable for designers targeting glue logic, bus interfacing and system-control roles in industrial equipment.

Backed by the MachXO family architecture and design tool support, this device offers predictable integration and the ability to update logic in the field while meeting industrial temperature and packaging requirements for robust board-level deployment.

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