LCMXO1200E-4FT256C

The LCMXO1200E-4FT256C is a MachXO family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It combines non-volatile configuration with FPGA-style LUT-based logic to deliver instant-on, reconfigurable glue logic and control functions in a single surface-mount package.

Targeted at commercial applications requiring moderate logic density and high I/O count, this device provides 1,200 logic elements, approximately 9,421 bits of on-chip RAM, and up to 211 I/Os in a 256‑ball BGA footprint—making it suitable for board-level interfacing, control and system management tasks.

Key Features

• Non‑volatile, instant‑on configuration – Single‑chip configuration with no external configuration memory required, enabling powers-up in microseconds and protecting bitstream security.
• Reconfiguration and programming – Supports in-field reconfiguration and background programming via JTAG; SRAM-based logic can be reconfigured in milliseconds.
• Logic density – 1,200 logic elements (cells) for glue logic, bus bridging and control functions.
• On‑chip memory – Approximately 9,421 bits of total on-chip RAM for distributed and embedded memory needs.
• I/O flexibility – 211 I/Os to support dense board-level interfacing and multiple peripheral connections.
• Clocking – Includes on-chip PLL capability as part of the MachXO family feature set for clock multiply/divide and phase adjustments (family-level feature).
• Power and sleep – Operates from a 1.14 V to 1.26 V supply; supports a sleep mode to significantly reduce static current draw.
• Package and mounting – 256‑LBGA package (supplier device package: 256‑FTBGA, 17×17 mm) optimized for surface‑mount PCB assembly; RoHS compliant.
• Commercial temperature grade – Rated for 0 °C to 85 °C operating temperature.

Typical Applications

• Glue Logic and Bus Bridging – Implement address decoding, bus arbitration, level translation and protocol bridging where flexible logic and many I/Os are required.
• Control and Power‑Up Sequencing – Implement system control, reset sequencing and power management logic with instant-on non-volatile configuration.
• Board‑Level Interface – Provide dense I/O interfacing for peripherals, sensors, and communication buses in compact BGA form factors.
• In‑field Logic Updates – Use background and in-system programming capabilities to update control logic without removing the device from the system.

Unique Advantages

• Single‑chip non‑volatile solution: Eliminates external configuration memory for simpler BOM and faster system start-up.
• High I/O to logic ratio: 211 I/Os paired with 1,200 logic elements allow complex interfacing while keeping the device footprint small.
• Rapid field reconfiguration: Reconfigure SRAM-based logic in milliseconds and support background programming to minimize system downtime.
• Commercial temperature rating: Rated 0 °C to 85 °C for a wide range of general-purpose applications.
• Compact BGA package: 256‑ball ftBGA (17×17 mm) surface‑mount package reduces board area while offering high pin count.

Why Choose LCMXO1200E-4FT256C?

The LCMXO1200E-4FT256C is positioned for designs that need a compact, non‑volatile FPGA with a balance of logic capacity and a high I/O count. Its single‑chip configuration, fast start-up behavior, and in-field reprogramming capabilities make it well suited for board-level control, interfacing and system management functions in commercial products.

Designed for engineers seeking a reliable, RoHS‑compliant surface-mount FPGA solution, the device benefits from the MachXO family tool support and architecture to ease integration and migration across density points within the family.

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