LCMXO1200E-4B256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,425 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200E-4B256C – MachXO Field Programmable Gate Array (FPGA), 1200 logic elements, 211 I/Os
The LCMXO1200E-4B256C is a MachXO family non-volatile FPGA optimized for glue logic, bus bridging/interfacing, power-up control and general control logic. It combines instant-on non-volatile configuration with FPGA-style LUT-based logic and embedded memory to deliver a single-chip, reconfigurable control solution for commercial embedded systems.
Designed for high pin-to-pin integration, this device provides 1200 logic elements, approximately 9.4 Kbits of on-chip RAM, and 211 I/Os in a 256-ball LFBGA/CABGA package. It operates from a 1.14 V–1.26 V core supply and is rated for commercial temperature operation (0 °C to 85 °C).
Key Features
- Non-volatile, infinitely reconfigurable — Instant-on device that requires no external configuration memory and supports reconfiguration of SRAM-based logic in milliseconds.
- Fast startup and field updates — Instant-on power-up behavior and TransFR™ in-field reconfiguration enable updates while the system operates.
- Logic capacity — 1200 logic elements provide a compact fabric for glue logic, protocol translation and control functions.
- On-chip memory — Approximately 9.4 Kbits of embedded RAM for distributed and block memory needs.
- High I/O count — 211 programmable I/Os to support dense interfacing and board-level connectivity.
- Flexible I/O buffer support — Family-level support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS interfaces (as provided by the MachXO family).
- Clock management — Includes analog PLL capability for clock multiply/divide and phase shifting (1 PLL for the LCMXO1200 device family member).
- System-level support — JTAG programmability, IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support; background programming of non-volatile memory is supported.
- Package and mounting — Surface-mount 256-ball LFBGA / CABGA (14 × 14 mm) package for compact board integration.
- Commercial grade and RoHS compliant — Rated for 0 °C to 85 °C operation and RoHS compliant.
Typical Applications
- Glue Logic and Board-Level Control — Implement bus arbitration, address decoding and control-state machines using the device’s LUT-based logic and on-chip RAM.
- Bus Bridging and Interfacing — Bridge or translate between interfaces with 211 I/Os and flexible I/O buffer support for multiple signaling standards.
- Power-Up and Reset Control — Instant-on, single-chip non-volatile configuration provides predictable startup behavior for system sequencing and power management.
- Field-Upgradable Control Logic — In-field TransFR™ reconfiguration allows updating logic while the system remains operational.
Unique Advantages
- Single-chip, instant-on configuration: Eliminates the need for external configuration memory, simplifying BOM and accelerating system startup.
- High I/O-to-logic density: 211 I/Os paired with 1200 logic elements enable compact implementations of dense interface logic without large FPGAs.
- On-chip memory for buffering and state: Approximately 9.4 Kbits of embedded RAM supports small FIFOs, state storage and distributed memory needs.
- Field reconfiguration support: TransFR™ and background programming let you update non-volatile configuration and SRAM logic with minimal system disruption.
- Established tool support: MachXO devices are supported by ispLEVER design tools for synthesis, place-and-route and timing verification (family-level support noted in the MachXO data sheet).
- Compact, surface-mount package: 256-ball LFBGA/CABGA (14 × 14 mm) simplifies board layout for space-constrained designs.
Why Choose LCMXO1200E-4B256C?
The LCMXO1200E-4B256C sits at the intersection of CPLD-style instant-on behavior and FPGA-style programmable logic. With 1200 logic elements, roughly 9.4 Kbits of embedded RAM, and 211 I/Os in a compact 256-ball package, it is suited for designers who need a single-chip, reconfigurable control solution for glue logic, bus interfacing and power sequencing in commercial applications. Its non-volatile architecture, JTAG and IEEE-standard programming support, and family toolchain compatibility make it a pragmatic choice for designs that require reliable startup, in-field updates and compact board-level integration.
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