LCMXO1200E-4BN256C

IC FPGA 211 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LFBGA, CSPBGA

Quantity 479 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGA, CSPBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200E-4BN256C – MachXO FPGA, 1200 logic elements, 211 I/Os, 256‑LFBGA

The LCMXO1200E-4BN256C is a MachXO family field-programmable gate array (FPGA) supplied in a 256‑LFBGA (caBGA) package. It delivers 1,200 logic elements, up to 211 user I/Os and on‑chip non-volatile configuration suitable for glue logic, bus bridging, control logic and other embedded applications.

Designed for single‑chip, instantly available logic with non‑volatile configuration and reconfiguration capabilities, this commercial‑grade device targets applications that require moderate logic density, high I/O count and low‑voltage operation within a 0 °C to 85 °C operating range.

Key Features

  • Logic Capacity — 1,200 logic elements (cells) for implementing glue logic, protocol handling and control functions.
  • On‑Chip Memory — 9,421 total RAM bits available on-chip for small data buffering and state storage.
  • I/O Density — 211 user I/Os provided in the 256‑ball package for flexible interfacing and board-level connectivity.
  • Non‑volatile Instant‑On — MachXO family non‑volatile architecture enables single‑chip configuration without external memory and instant‑on behavior at power‑up.
  • Reconfiguration and Programming — Supports in-system reprogramming and background programming; family features include JTAG programmability and TransFR reconfiguration for in-field updates.
  • Clocking — MachXO1200 family provides on‑chip PLL resources (1 PLL for this device) for clock management and phase adjustments.
  • Package and Mounting — Supplied in a 256‑LFBGA (256‑caBGA, 14×14 mm) surface‑mount package.
  • Power and Temperature — Low‑voltage supply range of 1.14 V to 1.26 V and commercial operating temperature of 0 °C to 85 °C.
  • Compliance — RoHS compliant package.

Typical Applications

  • Glue Logic and Board Level Control — Replace discrete logic for power‑up sequencing, reset control and board management using the device’s instant‑on, single‑chip configuration.
  • Bus Bridging and Protocol Conversion — Use the 211 I/Os and programmable logic to implement bus interfaces and protocol translation at the board edge.
  • Peripheral and Sensor Interface — Implement interface logic, filtering and small buffering for sensors and peripherals with the available on‑chip RAM and I/Os.
  • System Control and Sequencing — Configure finite state machines, watchdog logic and power domain control leveraging non‑volatile configuration and reprogrammability.

Unique Advantages

  • Single‑Chip Non‑Volatile Design: Eliminates the need for external configuration memory, enabling instant‑on behavior and simplifying board design.
  • High I/O Count for Moderate Logic Density: 211 I/Os combined with 1,200 logic elements let you implement complex interfacing without moving to larger devices.
  • In‑System Reconfiguration: Background programming and TransFR reconfiguration support allow firmware updates and incremental logic changes in the field.
  • Low‑Voltage Operation: Verified supply range of 1.14 V to 1.26 V for designs targeting low‑voltage domains.
  • Compact, Surface‑Mount Packaging: 256‑ball caBGA (14×14 mm) delivers a high I/O count in a compact footprint for space‑constrained boards.
  • Commercial‑Grade Reliability: Specified for 0 °C to 85 °C operation and delivered in RoHS‑compliant packaging for standard commercial applications.

Why Choose LCMXO1200E-4BN256C?

The LCMXO1200E-4BN256C positions itself as a practical, single‑chip FPGA solution for designers who need moderate logic capacity with a high I/O count and non‑volatile instant‑on behavior. Its combination of 1,200 logic elements, approximately 9,421 bits of on‑chip RAM, one PLL and 211 I/Os in a 256‑LFBGA package makes it well suited to board‑level control, protocol bridging and interface consolidation in commercial applications.

Backed by MachXO family features such as in‑system programming and reconfiguration, this device offers a straightforward path to reduce BOM complexity, accelerate system boot time and enable in‑field updates while maintaining a compact board footprint.

Request a quote or submit a pricing inquiry to get availability and lead‑time information for the LCMXO1200E-4BN256C.

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