LCMXO1200E-4FT256I

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA

Quantity 1,148 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200E-4FT256I – MachXO FPGA, 1200 logic elements, 211 I/Os

The LCMXO1200E-4FT256I is a MachXO family Field Programmable Gate Array (FPGA) device optimized for glue logic, bus bridging, bus interfacing, power-up control and general control-logic tasks. It combines non-volatile configuration with FPGA-style LUT-based logic to deliver instant-on single-chip programmability without external configuration memory.

This industrial-grade device offers 1200 logic elements, approximately 9.4 Kbits of on-chip RAM and up to 211 I/Os in a 256-ball BGA package, making it suitable for embedded control and interface applications that require compact integration, in-field updates and broad I/O support.

Key Features

  • Core Logic  1200 logic elements (LUTs) for implementing glue logic, control paths and interface translation functions.
  • Embedded Memory  Approximately 9,421 bits (≈9.4 Kbits) of on-chip RAM for distributed and block memory usage.
  • I/O Density  Up to 211 I/Os to support dense peripheral and bus interfacing requirements.
  • Non-Volatile, Instant-On Configuration  Single-chip non-volatile configuration enables instant-on operation without external configuration memory and supports JTAG-based programming and background programming of non-volatile memory.
  • In-Field Reconfiguration  TransFR™ reconfiguration capability allows in-field logic updates while the system operates.
  • Programmable I/O  Flexible sysIO™ buffer architecture (family-level) supports a wide range of interfaces, including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
  • Clocking  Includes sysCLOCK PLL resources appropriate to the MachXO1200 family (one PLL available on LCMXO1200 devices).
  • Power and Low-Power Modes  Core voltage supply range 1.14 V to 1.26 V; family features include a Sleep Mode for significant static current reduction.
  • Packaging and Mounting  256-ball BGA package (supplier device package: 256-FTBGA, 17×17 mm), surface-mount mounting for compact board integration.
  • Operating Range and Grade  Industrial-grade operation from −40 °C to 100 °C.
  • Environmental Compliance  RoHS compliant packaging.

Typical Applications

  • Glue Logic and System Control  Implement glue logic, power sequencing and centralized control functions where instant-on non-volatile behavior simplifies system design.
  • Bus Bridging and Interface Translation  Use the dense I/O and programmable I/O buffer options to bridge between bus standards and translate signals between subsystems.
  • Power-Up and Reset Management  Manage power-up sequencing and reset control with deterministic, single-chip configuration and low-power sleep modes.
  • Embedded Control and I/O Aggregation  Aggregate and manage multiple peripheral interfaces, leveraging the device’s 211 I/Os and on-chip RAM for buffering and control logic.

Unique Advantages

  • Instant-On Non-Volatile Operation: Single-chip, non-volatile configuration removes the need for external configuration memory and enables immediate availability at power-up.
  • Single-Chip Integration: Combines LUT-based logic, embedded RAM and PLL resources to reduce BOM and simplify board-level design.
  • High I/O to Logic Density: 211 I/Os paired with 1200 logic elements provides flexible routing and interface options for mixed-signal and mixed-peripheral designs.
  • In-Field Update Capability: TransFR™ reconfiguration supports in-system logic updates without taking the entire system offline.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in industrial and temperature-challenging environments.
  • Standards-Focused I/O Support: Programmable I/O buffer options (as provided by the MachXO family) cover common signaling standards to ease integration across legacy and modern interfaces.

Why Choose LCMXO1200E-4FT256I?

The LCMXO1200E-4FT256I positions itself as a compact, industrial-grade MachXO FPGA offering a balanced mix of logic capacity, embedded memory and I/O density in a single non-volatile device. Its instant-on configuration, in-field reconfiguration capability and programmable I/O make it a practical choice for designers who need reliable control, interface bridging and power-up management without adding external configuration components.

This device is well suited to embedded system designers and procurement teams seeking a scalable, RoHS-compliant FPGA solution that simplifies BOM and supports industrial temperature operation, while maintaining the flexibility to update logic in the field.

Request a quote or submit a purchase inquiry for part number LCMXO1200E-4FT256I to receive pricing and availability information.

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