LCMXO1200E-4B256I

The LCMXO1200E-4B256I is a MachXO family field programmable gate array (FPGA) offering a blend of non-volatile configuration and FPGA-style LUT-based logic. It delivers 1,200 logic elements, approximately 9.4 Kbits of on-chip RAM, and up to 211 I/Os in a 256-ball LFBGA/CSPBGA package targeted at industrial applications.

Engineered for glue logic, bus interfacing, control and power-up sequencing, this device emphasizes instant-on operation, single-chip configuration, and flexible I/O to streamline system design and reduce external BOM.

Key Features

• Logic Capacity — 1,200 logic elements for implementing glue logic, state machines, bus bridging and control functions.
• On-chip Memory — Total RAM bits: 9,421 (approximately 9.4 Kbits) of on-chip memory for distributed and embedded storage.
• I/O Density — 211 user I/Os to support wide connectivity and board-level interfacing needs.
• Non-volatile, Instant-on Architecture — Single-chip non-volatile configuration enables microsecond power-up and eliminates the need for external configuration memory; supports in-field reconfiguration.
• Reconfiguration and Background Programming — Supports reconfiguring SRAM-based logic in milliseconds and background programming of non-volatile memory for in-system updates.
• Low-power Modes — Sleep mode capability for substantial static current reduction (up to 100× as specified in family data).
• Clocking — Includes sysCLOCK PLL support appropriate to the MachXO1200 family for clock multiplication, division and phase shifting.
• Flexible I/O Buffer Support — Programmable I/O buffer options (documented in family datasheet) to support a range of signaling standards for board-level interfacing.
• Industrial Temperature and Power — Rated for operation from −40°C to 100°C; core supply range specified at 1.14 V to 1.26 V.
• Package — 256-LFBGA (CSPBGA) package; supplier device package listed as 256-CABGA (14×14 mm).
• RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

• Glue Logic and System Control — Implement power-up sequencing, reset control, and board-level combinatorial/sequential glue logic with instant-on configuration.
• Bus Bridging and Interfacing — Support bus translation and protocol interfacing using abundant I/Os and flexible I/O buffer options.
• Peripheral and Sensor Interfaces — Aggregate and preprocess signals from sensors and peripherals, leveraging on-chip memory and logic for local processing.
• User Interface and Control — Drive LEDs, buttons, and control panels while offloading simple state machines from the main processor.

Unique Advantages

• Single-chip, Non-volatile Configuration: Eliminates external configuration memory and enables immediate functionality at power-up.
• High I/O-to-Logic Ratio: 211 I/Os paired with 1,200 logic elements allow dense board-level interfacing without excessive device count.
• In-field Reconfiguration: Background programming and rapid reconfiguration let you update logic while the system remains operational.
• Industrial Temperature Range: −40°C to 100°C rating supports deployment in industrial environments.
• Power Management Features: Sleep mode provides significant static current reduction for power-sensitive designs.
• Compact BGA Packaging: 256-ball LFBGA/CSPBGA (256-CABGA, 14×14) facilitates high-pin-count connectivity in a small footprint.

Why Choose LCMXO1200E-4B256I?

The LCMXO1200E-4B256I positions itself as a flexible, industrial-grade FPGA with non-volatile instant-on behavior and a compact, high-I/O package. It is suited to designers who need reliable board-level control, bus interfacing, and in-field update capability without adding external configuration components.

Select this device when your design requires a balance of logic capacity, significant I/O count, on-chip RAM, and robust temperature performance, backed by the MachXO family architecture and configuration features.

Request a quote or submit an inquiry for pricing and availability of the LCMXO1200E-4B256I to evaluate fit for your next design.