LCMXO1200E-3TN144C

The LCMXO1200E-3TN144C is a MachXO series field programmable gate array (FPGA) designed for single‑chip, non‑volatile programmable logic. With 1,200 logic elements and 113 I/Os in a 144‑pin LQFP surface‑mount package, it is optimized for glue logic, bus bridging, bus interfacing, power‑up control and general control logic in commercial applications.

Key value comes from instant‑on, single‑chip configuration with in‑field reconfiguration options, a compact 144‑LQFP footprint, and support for low‑voltage systems in the specified supply range.

Key Features

• Logic Capacity — 1,200 logic elements for implementing mid‑density control and glue logic functions.
• On‑chip Memory — 9,421 bits of total on‑chip RAM for small data buffers and state storage.
• I/O — 113 configurable I/O pins in the 144‑LQFP package to support dense peripheral and bus connections.
• Non‑volatile, Instant‑On — Single‑chip, non‑volatile configuration enables power‑up in microseconds without external configuration memory.
• In‑field Reconfiguration — Supports background and in‑system reprogramming to update logic while deployed.
• Power Management — Sleep mode capability for significant static current reduction.
• Clocking — Integrated PLL resources (1 PLL for this device) to support clock multiplication, division and phase shifting.
• Package & Mounting — 144‑LQFP (20 × 20 mm) surface‑mount package; RoHS compliant.
• Commercial Temperature & Supply — Designed for commercial operation from 0 °C to 85 °C with a supply range of 1.14 V to 1.26 V.

Typical Applications

• Glue Logic — Replace discrete glue logic with a compact, reprogrammable single‑chip solution to simplify board design and reduce BOM.
• Bus Bridging and Interfacing — Implement protocol translation, bus width adaptation and interface bridging with dense I/O and flexible logic resources.
• Power‑Up and System Control — Manage system sequencing, reset control and power‑up supervision leveraging instant‑on non‑volatile configuration.
• Control Logic — Implement user interfaces, state machines and peripheral control functions in a small commercial FPGA footprint.

Unique Advantages

• Instant‑on, Single‑Chip Configuration: Powers up in microseconds with no external configuration memory required, simplifying system design and improving boot time.
• Field Update Capability: Background and in‑system reconfiguration let you deploy updates without removing the device or halting system operation.
• High I/O-to-Logic Density: 113 I/Os paired with 1,200 logic elements provide flexible connectivity for mid‑density applications in a compact package.
• Power‑Saving Sleep Mode: Sleep mode delivers substantial static current reduction, helping meet low‑power requirements in standby or low‑usage scenarios.
• Compact, RoHS‑Compliant Package: 144‑pin LQFP surface‑mount package provides a small PCB footprint while meeting RoHS requirements.
• Toolchain Support: Supported by the MachXO family design flow and ispLEVER tools referenced for series devices, enabling established synthesis and place‑and‑route workflows.

Why Choose LCMXO1200E-3TN144C?

The LCMXO1200E-3TN144C positions itself as a practical, single‑chip non‑volatile FPGA for commercial designs that need instant‑on behavior, flexible in‑field updates, and a balance of logic capacity and I/O density. Its 144‑LQFP package and surface‑mount form factor make it suitable for compact boards where reliable control, interfacing and boot behavior are important.

This device is well suited to engineers and procurement teams building mid‑density control and interface solutions who need a reprogrammable, RoHS‑compliant component with established family tool support and commercial temperature operation.

Request a quote or submit an inquiry to get pricing and availability for the LCMXO1200E-3TN144C and to discuss how it fits your next design.