LCMXO1200E-3TN100C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 73 9421 1200 100-LQFP |
|---|---|
| Quantity | 840 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 73 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200E-3TN100C – MachXO FPGA, 1200 logic elements, 100‑pin package
The LCMXO1200E-3TN100C is a MachXO family field programmable gate array (FPGA) designed for single‑chip, non‑volatile logic integration. It combines an array of programmable logic with on‑chip memory and flexible I/O to address glue logic, bus bridging, power‑up control and general control logic in commercial electronic designs.
With instant‑on non‑volatile operation, background reconfiguration and low‑power sleep modes, this device targets applications that require compact, secure, and reconfigurable control and interfacing functions.
Key Features
- Logic Capacity: 1200 logic elements (cells) for implementing combinational and sequential logic.
- On‑chip Memory: Total on‑chip RAM of 9,421 bits for distributed and embedded memory usage.
- I/O Count: 73 programmable I/Os suitable for interfacing with peripheral buses and external devices.
- Non‑volatile, Instant‑On: Single‑chip non‑volatile architecture with instant‑on operation and no external configuration memory required.
- In‑field Reconfiguration: TransFR™ reconfiguration capability and support for background programming of non‑volatile memory enable in‑system updates.
- Low Power Modes: Sleep mode to reduce static current significantly for power‑sensitive designs.
- Clocking: Includes one sysCLOCK PLL for clock multiply/divide and phase adjustments appropriate to the device family.
- Flexible I/O Buffering: Programmable sysIO buffer architecture supports a wide range of interface standards at the family level, enabling diverse signal I/O needs.
- Package and Mounting: Surface mount 100‑pin package; supplier lists 100‑TQFP (14×14 mm) and product data references 100‑LQFP packaging options.
- Supply and Temperature: Voltage supply range 1.14 V to 1.26 V; commercial operating temperature 0 °C to 85 °C.
- Compliance: RoHS‑compliant packaging.
Typical Applications
- Glue Logic and System Control: Replace discrete logic with compact, reconfigurable FPGA logic for control, reset sequencing, and power‑up management.
- Bus Bridging and Interfacing: Implement bus translators, level shifting, and protocol bridging using the device’s flexible I/O and programmable logic.
- User Interface Control: Manage buttons, indicators, and simple human‑machine interfaces with compact on‑chip logic and I/O resources.
- Peripheral and Sensor Interfacing: Aggregate and preprocess signals from sensors or peripherals before passing data to host controllers.
Unique Advantages
- Single‑chip non‑volatile solution: Eliminates the need for external configuration memory and simplifies BOM and board design.
- Instant‑on behavior: Device powers up in microseconds, minimizing system boot time for time‑sensitive start‑up sequences.
- Field reconfiguration support: TransFR and background programming enable updates to device logic while the system is operational, reducing service downtime.
- Compact package options: 100‑pin surface‑mount package (14×14 mm) enables space‑constrained board designs without sacrificing I/O capability.
- Low static power capability: Sleep mode offers substantial static current reduction for lower power consumption during idle periods.
- Flexible I/O standards: Programmable I/O buffering at the family level supports multiple signaling standards to ease system integration.
Why Choose LCMXO1200E-3TN100C?
The LCMXO1200E-3TN100C delivers a balanced combination of reconfigurable logic, on‑chip memory, and programmable I/O in a single non‑volatile package. Its instant‑on capability and in‑field reconfiguration options make it well suited for designs that require fast startup, secure configuration, and the ability to update logic in the field.
This part is ideal for commercial embedded systems engineers looking to reduce component count, simplify boot and configuration flows, and implement reliable glue logic, interface bridging, and control functionality with a compact footprint and supplier‑documented package options.
Request a quote or submit your requirements today to discuss availability, pricing, and lead times for the LCMXO1200E-3TN100C. Our team can provide tailored support for integrating this MachXO device into your designs.