LCMXO1200E-3T100C

The LCMXO1200E-3T100C is a MachXO family Field Programmable Gate Array (FPGA) offered in a 100-pin LQFP/TQFP surface-mount package. It combines a 1,200‑element LUT-based logic array with on-chip RAM and flexible I/O to address glue logic, bus interfacing, power-up control and control-logic tasks typically handled by CPLDs and low-capacity FPGAs.

Designed for commercial-grade applications, this device delivers non-volatile, instant-on capability and logic reconfiguration options while supporting a concise supply voltage range (1.14–1.26 V) and a 0 °C to 85 °C operating temperature.

Key Features

• Logic Capacity — 1,200 logic elements (LUT-based) arranged in a two-dimensional logic array for flexible implementation of control and glue logic.
• On‑Chip Memory — Total on-chip RAM: 9,421 bits (approximately 9.4 Kbits) to support distributed and embedded memory needs.
• I/O Count and Flexibility — 73 I/Os available in the 100-pin package, enabling broad interfacing options with surrounding system components.
• Non‑volatile, Instant‑On Architecture — Single-chip solution with non‑volatile configuration for immediate power-up operation and no external configuration memory required.
• Reconfiguration and Field Updates — Support for in-field reconfiguration and background programming of non-volatile memory to enable rapid updates while deployed.
• Low‑Power Modes — Sleep mode capability allowing substantial static current reduction for standby or power-sensitive applications.
• System Features — On-chip oscillator, IEEE 1149.1 boundary-scan support, and support for in-system programming through standard JTAG mechanisms.
• Package and Mounting — Surface-mount 100-LQFP package (Supplier device package: 100-TQFP, 14×14 mm) for compact board-level integration.
• Supply and Temperature — Voltage supply range 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C.

Typical Applications

• Glue Logic — Implement system glue and small-scale combinational/sequential logic to simplify board design and reduce discrete components.
• Bus Bridging and Interfacing — Bridge protocol differences and handle bus interfacing tasks using the device’s I/O and programmable logic resources.
• Power‑Up Control and Sequencing — Implement power sequencing, reset control and deterministic start-up behavior using non-volatile instant-on capability.
• Control Logic and State Machines — Realize application-specific control functions, timing logic and state machines within the on-chip logic and RAM.

Unique Advantages

• Single‑Chip, Non‑Volatile Configuration: Eliminates the need for external configuration memory and enables immediate power-up behavior.
• Compact Integration: 1,200 logic elements plus 73 I/Os in a 100‑pin surface‑mount package reduces board area and BOM complexity.
• Field Reconfigurability: Background programming and in-field reconfiguration enable rapid updates and iterative feature deployment.
• Low‑Power Standby: Sleep mode capability supports significant static current reduction for energy-sensitive designs.
• System‑Level Support: Built‑in oscillator and JTAG-based in-system programming simplify development and bring-up workflows.

Why Choose LCMXO1200E-3T100C?

The LCMXO1200E-3T100C positions itself as a compact, non‑volatile FPGA choice for designers needing instant-on, reconfigurable logic in a commercial-grade component. Its 1,200 logic elements, approximately 9.4 Kbits of on-chip RAM and 73 I/Os in a 100-pin surface-mount package make it well suited for board-level glue logic, bus interfacing, power sequencing and control tasks where a single-chip solution reduces board complexity.

Supported by MachXO family capabilities such as background programming, sleep mode and standard JTAG programming, the device offers a practical path for product designs that prioritize fast start-up, field updates and concise system integration.

Request a quote or submit an inquiry to obtain pricing and availability for the LCMXO1200E-3T100C.