LCMXO1200E-3M132C

The LCMXO1200E-3M132C is a MachXO-series FPGA offering 1,200 logic elements and 101 I/O pins in a compact 132-ball CSPBGA (8×8 mm) package. Designed for glue logic, bus interfacing and control applications, this device combines non-volatile configuration, instant-on operation and on-chip RAM to simplify system design and reduce external BOM.

Key Features

• Core Logic — 1,200 logic elements provide flexible LUT-based logic implementation for glue logic, protocol bridging and control tasks.
• On-chip Memory — Total on-chip RAM: 9,421 bits for small embedded buffers and control-state storage.
• I/O — 101 user I/Os available in the 132‑ball CSPBGA package for dense pin access in compact layouts.
• Non-volatile Configuration — Instant-on, single‑chip configuration with no external configuration memory required; supports background programming and in-field reconfiguration.
• Reconfiguration & Power Modes — Supports in-field TransFR™ reconfiguration and a low‑power sleep mode to reduce static current when inactive.
• Clocking — Device-level PLL architecture is supported in the MachXO family for clock management and phase adjustment.
• Power Supply — Core supply range specified at 1.14 V to 1.26 V for compatibility with standard low-voltage systems.
• Package & Mounting — 132-CSPBGA (8×8 mm) surface-mount package (132-LFBGA) for compact board designs.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for commercial applications.
• Compliance — RoHS-compliant package.

Typical Applications

• Glue Logic and System Control — Implement control-state machines, reset sequencing and power‑up control with integrated non‑volatile configuration and instant-on behavior.
• Bus Bridging and Protocol Conversion — Use the device's logic capacity and plentiful I/Os to implement interface translation and bus buffering between subsystems.
• Peripheral and Sensor Interfaces — Manage sensor aggregation, simple data preprocessing and I/O conditioning in compact embedded designs.
• Field-upgradeable Logic — Support in-field logic updates and background programming to add features or fix issues without removing the device from the system.

Unique Advantages

• Instant-on, Single-Chip Solution: Non-volatile configuration eliminates the need for external configuration memory and enables microsecond-level power-up readiness.
• Compact High‑Pin Density: 101 I/Os in an 8×8 mm 132-CSPBGA package reduces PCB area while providing ample connectivity for peripheral interfaces.
• On‑board Memory for Control Tasks: 9,421 bits of on-chip RAM support small buffers, state machines and control data without external memory.
• Field Reconfiguration: TransFR-style in-field reconfiguration and background programming enable rapid feature updates and iterative development cycles.
• Power Efficiency: Sleep mode support offers significant static current reduction for duty‑cycled or low-power systems.
• Commercial Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial deployments.

Why Choose LCMXO1200E-3M132C?

The LCMXO1200E-3M132C positions itself as a compact, non-volatile FPGA optimized for control, interfacing and glue‑logic roles. With 1,200 logic elements, 9,421 bits of on‑chip RAM and 101 I/Os in a small CSPBGA footprint, it is suited to space-constrained designs that require instant-on behavior and the ability to update logic in the field.

Its combination of single-chip configuration, low-power sleep capability and a commercial operating range make it a practical choice for embedded system designers seeking to reduce BOM complexity while retaining flexible, reconfigurable logic capacity and reliable commercial performance.

Request a quote or submit an RFQ to check availability and lead time for the LCMXO1200E-3M132C. Provide your quantity and delivery requirements to receive a prompt response.