LCMXO1200E-3FT256C

The LCMXO1200E-3FT256C is a MachXO family FPGA offering 1,200 logic elements in a non-volatile, instant-on architecture. Designed for glue logic, bus bridging, power-up control and general control logic, this surface-mount 256-ball BGA device combines on-chip configuration retention with flexible I/O and embedded memory to streamline system designs.

With 211 I/Os, approximately 9.4 Kbits of on-chip RAM and a single on-chip PLL, this commercial-grade device targets applications requiring compact, reconfigurable logic with quick startup and in-field update capability.

Key Features

• Core Logic — 1,200 logic elements (LUT-based) for implementing glue logic, state machines and interface bridging.
• On‑chip Memory — Total on-chip RAM: 9,421 bits (approximately 9.4 Kbits) including embedded block RAM suitable for small FIFOs and buffering.
• I/O and Packaging — 211 user I/Os in a 256-ball LBGA package (supplier package: 256-FTBGA, 17×17 mm). Surface-mount mounting type for compact PCB footprints.
• Non‑volatile, Instant‑on — Single-chip non-volatile configuration delivers microsecond power-up and eliminates the need for external configuration memory.
• In‑field Reconfiguration — Supports background programming and TransFR™ reconfiguration for updating logic while the system operates.
• Power and Voltage — Core voltage supply range 1.14 V to 1.26 V. Device family supports multiple supply options for system-level flexibility as documented in the MachXO family data sheet.
• Low‑power Modes — Sleep mode enables significant static current reduction for power-sensitive applications.
• Temperature and Compliance — Commercial operating range from 0 °C to 85 °C; RoHS compliant packaging.

Typical Applications

• Glue Logic and Control — Replace discrete logic and small CPLDs for board-level control, reset sequencing and state machine implementations.
• Bus Bridging and Interfacing — Implement bus conversion, protocol translation and pin-count adaptation using the device’s flexible I/O and embedded logic.
• Power‑up and System Management — Power sequencing, supervisor functions and system enable/disable logic that benefit from non-volatile instant-on behavior.
• In‑field Updatable Systems — Field firmware and logic updates leveraging background programming and on-chip reconfiguration without external configuration memory.

Unique Advantages

• Instant-on operation: Non-volatile single-chip configuration eliminates external memory and enables microsecond startup for faster system availability.
• Compact, high‑pin density: 211 I/Os in a 256-ball BGA give high pin-count capability in a small footprint for space-constrained designs.
• On-chip memory for buffering: Approximately 9.4 Kbits of RAM and embedded block RAM simplify small FIFO and buffering tasks without external SRAM.
• Field reprogrammability: Background programming and TransFR reconfiguration allow in-system updates and iterative development workflows.
• Low-power options: Sleep mode significantly reduces static current, supporting designs with intermittent active periods or low-power requirements.
• Commercial grade: 0 °C to 85 °C operating range and RoHS-compliant package meet typical commercial electronics requirements.

Why Choose LCMXO1200E-3FT256C?

The LCMXO1200E-3FT256C combines non-volatile instant-on operation, a moderate logic capacity of 1,200 elements, and dense I/O in a compact 256-ball BGA package to deliver a flexible building block for control, interface and system-management tasks. Its embedded memory, PLL resources and in-field programming support make it well suited to designs that need compact, reconfigurable logic with straightforward deployment and updates.

This device is ideal for engineers and procurement teams designing commercial electronics requiring reliable, reconfigurable glue logic or interface solutions with rapid system start-up and simplified BOMs.

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