LCMXO1200E-3BN256I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 584 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200E-3BN256I – MachXO Field Programmable Gate Array (FPGA) IC
The LCMXO1200E-3BN256I is a non-volatile MachXO-series FPGA optimized for glue logic, control, and I/O-centric functions. Built around a logic array and programmable I/O, this surface-mount device provides instant-on non-volatile configuration and a compact 256-ball BGA package for space-constrained industrial applications.
With 1,200 logic elements (150 CLBs), 211 user I/Os and approximately 9.4 Kbits of on-chip RAM, the device targets control, interface bridging and system-management tasks where fast start-up, reconfiguration and low component count are priorities.
Key Features
- Logic Capacity — 1,200 logic elements implemented across 150 CLBs for implementing glue logic, state machines and control paths.
- On-chip Memory — Total RAM bits: 9,421 (approximately 9.4 Kbits) to support small data buffers, FIFOs and distributed storage.
- I/O Density — 211 programmable I/Os available in the 256-ball package to support broad interfacing and board-level connectivity.
- Non-Volatile, Instant-On Architecture — Single-chip non-volatile configuration with instant-on behavior and no external configuration memory required.
- Reconfiguration & Programming — Supports background programming, JTAG programming and in-field reconfiguration (TransFR™) for rapid updates without external storage.
- Clocking — sysCLOCK PLL support (1 PLL for the LCMXO1200 family) for common clock multiplication, division and phase adjustments.
- Flexible I/O Standards — Programmable sysIO buffers support a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL and multiple differential standards as described in the MachXO family specification.
- Power and Sleep Modes — Instant-on non-volatile configuration and a sleep mode that enables significant static current reduction.
- Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C for industrial environments.
- Supply Voltage — Core supply range: 1.14 V to 1.26 V.
- Package & Mounting — 256-ball LFBGA/CSPBGA (supplier package: 256-CABGA 14×14), surface-mount.
- Regulatory — RoHS compliant.
Typical Applications
- Glue Logic and Board-Level Control — Replace multiple discrete devices with a single non-volatile FPGA to implement control state machines, reset/power sequencing and system glue logic.
- Interface Bridging — Aggregate and translate between parallel and serial buses or mixed-voltage interfaces using the device’s high I/O count and programmable I/O buffer options.
- Boot and Configuration Manager — Use instant-on, single-chip configuration to manage system startup sequencing and configuration without external memory.
- Field Upgradeable Control — In-field logic updates (TransFR™) allow firmware and logic upgrades with minimal system downtime.
Unique Advantages
- Single-Chip Non-Volatile Solution: Eliminates the need for external configuration memory, reducing BOM and simplifying supply rails.
- Fast System Availability: Instant-on configuration supports rapid boot and realtime responsiveness after power-up.
- High Pin-to-Logic Ratio: 211 user I/Os paired with 1,200 logic elements deliver flexible I/O routing for dense interface requirements.
- Field Reconfiguration: Background programming and TransFR™ enable safe in-system updates without interrupting live systems.
- Industrial Temperature Range: Rated from -40 °C to 100 °C for robust operation in industrial environments.
- Compact BGA Packaging: 256-ball BGA provides a small board footprint while preserving a large I/O count for complex interface layouts.
Why Choose LCMXO1200E-3BN256I?
The LCMXO1200E-3BN256I combines non-volatile instant-on configuration, flexible I/O and mid-range logic capacity to address common board-level control and interface challenges. Its industrial temperature rating, compact 256-ball BGA package and on-chip memory make it well-suited for embedded systems that require reliable start-up behavior, field reprogrammability and a reduced component count.
Designers looking to consolidate glue logic, implement bus bridging, or add robust boot-time control will find the LCMXO1200E-3BN256I a practical, verifiable option backed by the MachXO family architecture and programming features.
Request a quote or submit a purchase inquiry to evaluate LCMXO1200E-3BN256I for your next design.

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