LCMXO1200E-3BN256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 808 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 211 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200E-3BN256C – MachXO Field Programmable Gate Array (FPGA), 1200 Logic Elements, 256-LFBGA
The LCMXO1200E-3BN256C is a MachXO family FPGA offering non-volatile, instant-on configuration and flexible FPGA-style logic for commercial embedded designs. It combines 1200 logic elements with a compact 256-ball LFBGA package and a high pin count to address glue logic, bus bridging, interface control and power-up control tasks.
This device is optimized for applications requiring a single-chip, secure configuration with fast startup and in-field reconfiguration. Key hardware attributes include 211 user I/Os, approximately 9.4 Kbits of on-chip RAM, and a supply voltage range centered around 1.2 V (1.14 V to 1.26 V), all in a surface-mount 256-CABGA (14×14 mm) package rated for commercial temperature operation (0 °C to 85 °C).
Key Features
- Core Logic 1200 logic elements and 150 CLBs provide flexible LUT-based logic resources suitable for glue logic and control functions.
- On-chip Memory Approximately 9,421 bits (≈9.4 Kbits) of on-chip RAM for embedded storage and small FIFOs.
- I/O and Interfaces Up to 211 user I/Os in the 256-ball package deliver high I/O-to-logic density for bus interfacing and multi-signal designs.
- Non-volatile, Instant-on Configuration Single-chip non-volatile configuration enables instant power-up without external configuration memory and supports secure bitstream handling.
- Reconfiguration and Programming Supports in-field reconfiguration and background programming workflows for updating logic while in-system (TransFR™ reconfiguration capability noted in MachXO family documentation).
- Power and Sleep Mode Low-power features include a sleep mode for significant static current reduction, supporting power-constrained commercial designs.
- Packaging and Mounting Surface-mount 256-LFBGA (256-CABGA, 14×14 mm) package suitable for compact PCB layouts and automated assembly.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation for general commercial applications.
- Standards and System Support Family-level features include JTAG programming and boundary-scan support for in-system programming and testability.
Typical Applications
- Glue Logic and System Control Implements board-level glue logic, control sequencing and power-up control without external configuration memory.
- Bus Bridging and Interface Conversion High I/O count and flexible I/O buffering make it suitable for bus interfacing and protocol bridging on commercial systems.
- User Interface and Peripheral Control Handles keypad, LED, sensor, and peripheral control tasks where compact, reconfigurable logic is required.
- In-field Logic Updates Supports background and in-field reconfiguration workflows for feature updates or bug fixes without full system downtime.
Unique Advantages
- Instant-on, Single-chip Configuration: Eliminates the need for external configuration memory, simplifying BOM and startup sequencing.
- High I/O Density vs. Logic: 211 I/Os paired with 1200 logic elements enable complex interfacing in a compact device footprint.
- Compact, Surface-mount Package: 256-CABGA (14×14 mm) package supports space-constrained board designs while maintaining high pin count.
- Integrated On-chip Memory: Approximately 9.4 Kbits of on-chip RAM provides local storage for FIFOs and small data buffers without external RAM.
- Designed for Commercial Deployments: Commercial-grade temperature range (0 °C to 85 °C) and RoHS-compliant packaging meet common product requirements.
- Support for In-system Programming and Test: JTAG and boundary-scan capabilities simplify programming and board-level validation.
Why Choose LCMXO1200E-3BN256C?
The LCMXO1200E-3BN256C positions itself as a compact, single-chip FPGA solution for commercial embedded designs that require secure, instant-on configuration and high I/O density. Its blend of 1200 logic elements, on-chip RAM, and 211 user I/Os makes it well suited for glue logic, interface bridging, and control applications where board-level integration and fast startup are priorities.
With surface-mount 256-LFBGA packaging and support for in-field reconfiguration, this MachXO device is appropriate for teams seeking a reliable, reprogrammable building block that reduces external components and supports iterative updates through standard programming and test flows.
Request a quote or submit an inquiry to check pricing and availability for the LCMXO1200E-3BN256C and to discuss how it fits your design requirements.