LCMXO1200E-3FTN256C

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA

Quantity 619 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O211Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200E-3FTN256C – MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA

The LCMXO1200E-3FTN256C is a MachXO family FPGA optimized for glue logic, bus interfacing and control applications. It combines non-volatile single-chip configuration with a compact, surface-mount 256-ball ftBGA package to deliver instant-on behavior and flexible I/O in space-constrained, commercial-temperature designs.

With 1200 logic elements, approximately 9.4 Kbits of on-chip RAM and 211 I/Os, this device targets designs that require moderate logic density, fast startup and in-field reconfiguration capabilities while maintaining RoHS-compliant packaging.

Key Features

  • Core Logic — 1200 logic elements (LUT-based architecture) providing deterministic, fabric-based implementation for glue logic, state machines and bus adaptation.
  • On-chip Memory — Approximately 9.4 Kbits of total on-chip RAM for distributed and embedded memory needs within control and buffering functions.
  • I/O Capacity — 211 I/Os available in the 256-ball ftBGA package to support wide pin-to-pin connectivity for buses, peripherals and external devices.
  • Non-volatile, Instant-on — Single-chip non-volatile configuration enables instant-on operation and eliminates the need for external configuration memory; supports background programming and in-field reconfiguration.
  • Reconfiguration and Sleep — Supports Reconfigure SRAM-based logic in milliseconds and includes a Sleep Mode to significantly reduce static current.
  • Clocking — Family-level sysCLOCK PLL support; LCMXO1200 devices include one analog PLL for clock multiply/divide and phase adjustments.
  • Flexible sysIO™ Buffer — Programmable I/O buffer supports a broad set of interface standards (as defined in the MachXO family) for adaptable signal-level interfacing.
  • Package and Mounting — 256-ball ftBGA (17 × 17 mm) surface-mount package for compact board-level integration; RoHS-compliant.
  • Power and Temperature — Supply voltage range 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C.
  • System-level Support — Features such as boundary-scan (IEEE 1149.1), onboard oscillator and IEEE 1532 compliant in-system programming available across the MachXO family.

Typical Applications

  • Glue Logic and System Control — Implement bus arbitration, power-up sequencing and control-state machines with instant-on, non-volatile configuration.
  • Bus Bridging and Interfacing — Use the 211 I/Os and programmable I/O buffer to adapt and bridge different bus standards and peripheral interfaces.
  • In-field Reconfiguration — Apply TransFR reconfiguration to update or patch logic while the system remains operational.
  • Embedded Control and Monitoring — Leverage on-chip RAM and the single-chip configuration for small embedded control systems and monitoring tasks within commercial-temperature equipment.

Unique Advantages

  • Instant-on Non-volatile Operation: Single-chip configuration enables immediate functionality at power-up without external configuration memory, simplifying BOM and startup sequences.
  • High I/O Count in a Compact Package: 211 I/Os in a 256-ball ftBGA (17 × 17 mm) allow dense connectivity while preserving PCB area.
  • In-field Programmability: Background programming and reconfiguration support enable updates and feature evolution after deployment.
  • Low-power Modes: Sleep Mode capability provides substantial static current reduction for power-sensitive commercial applications.
  • Integrated System Features: Boundary-scan, onboard oscillator and in-system programming improve testability and simplify system integration.

Why Choose LCMXO1200E-3FTN256C?

The LCMXO1200E-3FTN256C positions itself as a practical, integrated FPGA choice for commercial designs that need non-volatile, instant-on configuration, mid-range logic density and substantial I/O in a compact surface-mount package. Its combination of 1200 logic elements, roughly 9.4 Kbits of on-chip RAM and 211 I/Os makes it suitable for control, bridging and system glue functions where fast startup and in-field updates matter.

Chosen for applications where board space, configurability and deployment flexibility are priorities, this MachXO device delivers clear integration benefits while providing family-level support features such as programmable I/O buffers, PLL clocking and IEEE-compliant system programming and test mechanisms.

Request a quote or submit an RFQ today to begin evaluating the LCMXO1200E-3FTN256C for your next design.

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